Phase Field Modeling of Ghost Diffusion in Sn-Ag-Cu Solder Joints
<|begin_of_text|><|start_header_id|>system<|end_header_id|> You are a research archivist expert in dataset metadata. Answer the question truthfully.  <|eot_id|><|start_header_id|>user<|end_header_id|> Here is the Description of a dataset. Description:'In this paper, we have introduced a phase field modeling technique to simulate ghostdiffusion phenomena of intermetallic compounds in a bulk metallic matrix phase. We used Zenner-Frank phase field approach to define free energy density functional which is to be evolved using Chan-Hilliard and Alan-Chan equations to simulate time evolution of the precipitates. We verified our simulation results with intermetallic compound growth of Sn-Ag-Cu solder joints in isothermal aging process attributing to the diffusion of Ag3Sn intermetallic compound. Herewith we present that Zenner-Frank model demonstrates sound validity and provides a best understanding of such phenomena' . Please return only a json list of at most 3 Keywords corresponding to the Description:.<|eot_id|><|start_header_id|>assistant<|end_header_id|> {"Answer" : ["isothermal aging","multiscale modeling","phase field modeling","Zenner-Frank phase field kinetics"]} <|eot_id|>
 Here is the Description of a dataset. Description:'In this paper, we have introduced a phase field modeling technique to simulate ghostdiffusion phenomena of intermetallic compounds in a bulk metallic matrix phase. We used Zenner-Frank phase field approach to define free energy density functional which is to be evolved using Chan-Hilliard and Alan-Chan equations to simulate time evolution of the precipitates. We verified our simulation results with intermetallic compound growth of Sn-Ag-Cu solder joints in isothermal aging process attributing to the diffusion of Ag3Sn intermetallic compound. Herewith we present that Zenner-Frank model demonstrates sound validity and provides a best understanding of such phenomena' . Please return only a json list of at most 3 Keywords corresponding to the Description:.
In this paper, we have introduced a phase field modeling technique to simulate ghostdiffusion phenomena of intermetallic compounds in a bulk metallic matrix phase. We used Zenner-Frank phase field approach to define free energy density functional which is to be evolved using Chan-Hilliard and Alan-Chan equations to simulate time evolution of the precipitates. We verified our simulation results with intermetallic compound growth of Sn-Ag-Cu solder joints in isothermal aging process attributing to the diffusion of Ag3Sn intermetallic compound. Herewith we present that Zenner-Frank model demonstrates sound validity and provides a best understanding of such phenomena
isothermal aging; multiscale modeling; phase field modeling; Zenner-Frank phase field kinetics