DRAM thermal issues reach crisis point
> A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does. This is particularly true for AI/ML/DL designs, where high utilization increases thermal dissipation, but thermal density affects every advanced node chip and package, which are used in smart phones, server chips, AR/VR, and a number of other high-performance devices. For all of them, DRAM placement and performance is now a top design consideration.<p>I know this may not be a cheap solution, but why not start selling pre-built computers with active cooling systems? Refrigerant liquids like those used in refrigerators or water cooling could be an option. The article addresses this:<p>> Although it sounds like a near-perfect solution in theory, and has been shown to work in labs, John Parry, industry lead, electronics and semiconductor at Siemens Digital Industries Software, noted that it’s unlikely to work in commercial production. “You’ve got everything from erosion by the fluid to issues with, of course, leaks because you’re dealing with extremely small, very fine physical geometry. And they are pumped. One of the features that we typically find has the lowest reliability associated with it are electromechanical devices like fans and pumps, so you end up with complexity in a number of different directions.”<p>So instead of integrating fluids within the computer, build powerful mini-freezers for computers and store the computer inside. Or split the warm transistors from the rest of the build and store only those inside the mini freezer, with cables to connect to the rest of the computer outside.