TSMC starts volume production of 3nm chips
I don't know much about chip fabrication but reading wikipedia I see this:<p>> The term "3 nanometer" has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors. ... a 3 nm node is expected to have a contacted gate pitch of 48 nanometers and a tightest metal pitch of 24 nanometers... "3 nm" is used primarily as a marketing term by individual microchip manufacturers ... there is no industry-wide agreement among different manufacturers about what numbers would define a 3 nm node<p>So can someone who is more familiar with it help me understand what progress we're making in terms of the physical aspect of the chips?  Is transistor density still increasing?  Are we using different materials?  At a physical level what's different about this generation of chips?