TSMC’s 3-Nm Push Faces Tool Struggles
This is something I’ve noticed for a while now: All of the major semiconductor manufacturers use the same set of tooling. In particular, they all use EUV lithography machines from ASML. So how can any one company maintain any sort of sustained lead? As a first order approximately, all of them should have the same level of fabrication capabilities. If TSMC tries to push too fast, they’ll run into major challenges. And if they figure something out, their competitors should match them in short order.