Question: Maybe someone has experience in this field.

I'd like to overmold a PCBA, which has SMT components, with a low pressure molding process.
I am concerned about the temperature of the hotmelt material when it reaches the PCBA. The temperature should be between 200°C and 215°C.

Does anyone know if this material temperature could be a problem for the electronic components? Do I have the risk that the solder melts? Is this stress too harmful for the components?

I am not quite sure if the components will be able to withstand this temperature or if I should take as a reference the reflow temperatures of the components.

Answer: 
unlike Andy's answear i wouldn't use input resistors on your input. they add [noise](http://en.wikipedia.org/wiki/Johnson%E2%80%93Nyquist_noise) to your signal. of course its depending on your application.

what i would use is something like an [AD8479](http://www.analog.com/static/imported-files/data_sheets/AD8479.PDF) which is exactly what i think you want. high input offset voltage is the keyword here
The voltages at the input terminals must be within the common mode input range of the op-amp, and the output must of course not exceed maximum output range. Unfortunately, all the 741 data sheets I can find don't actually have the common mode input range specced. I'd avoid that op-amp anyway, and move to a rail to rail for what little I know about your application