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@@ -33,3 +33,19 @@ saved_model/**/* filter=lfs diff=lfs merge=lfs -text
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  *.zip filter=lfs diff=lfs merge=lfs -text
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  *.zst filter=lfs diff=lfs merge=lfs -text
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  *tfevents* filter=lfs diff=lfs merge=lfs -text
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
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  *.zip filter=lfs diff=lfs merge=lfs -text
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  *.zst filter=lfs diff=lfs merge=lfs -text
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  *tfevents* filter=lfs diff=lfs merge=lfs -text
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+ A[[:space:]]Review[[:space:]]of[[:space:]]Mechanism[[:space:]]and[[:space:]]Technology[[:space:]]of[[:space:]]Hybrid[[:space:]]Bonding.pdf filter=lfs diff=lfs merge=lfs -text
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+ Beyond[[:space:]]CMOS[[:space:]]heterogeneous[[:space:]]integration[[:space:]]of[[:space:]]III–V[[:space:]]devices,[[:space:]]RF[[:space:]]MEMS[[:space:]]and[[:space:]]other[[:space:]]dissimilar[[:space:]]materialsdevices[[:space:]]with[[:space:]]Si[[:space:]]CMOS[[:space:]]to[[:space:]]create[[:space:]]intelligent[[:space:]]microsystems.pdf filter=lfs diff=lfs merge=lfs -text
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+ Chiplet[[:space:]]Heterogeneous[[:space:]]Integration[[:space:]]Technology—Status[[:space:]]and[[:space:]]Challenges.pdf filter=lfs diff=lfs merge=lfs -text
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+ Copper[[:space:]]Bonding[[:space:]]Technology[[:space:]]in[[:space:]]Heterogeneous[[:space:]]Integration.pdf filter=lfs diff=lfs merge=lfs -text
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+ Epitaxial[[:space:]]growth[[:space:]]and[[:space:]]layer-transfer[[:space:]]techniques[[:space:]]for[[:space:]]heterogeneous[[:space:]]integration[[:space:]]of[[:space:]]materials[[:space:]]for[[:space:]]electronic[[:space:]]and[[:space:]]photonic[[:space:]]devices.pdf filter=lfs diff=lfs merge=lfs -text
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+ Heterogeneous[[:space:]]Integration[[:space:]]of[[:space:]]compound[[:space:]]semiconductors.pdf filter=lfs diff=lfs merge=lfs -text
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+ Hybrid[[:space:]]Cu-to-Cu[[:space:]]bonding[[:space:]]with[[:space:]]nano-twinned[[:space:]]Cu.pdf filter=lfs diff=lfs merge=lfs -text
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+ III-Vsilicon[[:space:]]photonics[[:space:]]for[[:space:]]on[[:space:]]chip[[:space:]]and[[:space:]]intra[[:space:]]chip[[:space:]]optical[[:space:]]interconnects.pdf filter=lfs diff=lfs merge=lfs -text
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+ Integrating[[:space:]]MEMS[[:space:]]and[[:space:]]ICs.pdf filter=lfs diff=lfs merge=lfs -text
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+ Materials[[:space:]]for[[:space:]]heterogeneous[[:space:]]integration.pdf filter=lfs diff=lfs merge=lfs -text
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+ Materials,processingandreliabilityoflowtemperaturebondingin3D.pdf filter=lfs diff=lfs merge=lfs -text
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+ Research[[:space:]]progress[[:space:]]of[[:space:]]hybrid[[:space:]]bonding[[:space:]]technology[[:space:]]for[[:space:]](2).pdf filter=lfs diff=lfs merge=lfs -text
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+ Temporary[[:space:]]Bonding[[:space:]]and[[:space:]]Debonding[[:space:]]in[[:space:]]Advanced[[:space:]]Packaging[[:space:]]Recent[[:space:]]Progress[[:space:]]and[[:space:]]Applications.pdf filter=lfs diff=lfs merge=lfs -text
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+ The[[:space:]]era[[:space:]]of[[:space:]]hyper-scaling[[:space:]]in[[:space:]]electronics.pdf filter=lfs diff=lfs merge=lfs -text
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+ The[[:space:]]Progress[[:space:]]and[[:space:]]Trend[[:space:]]of[[:space:]]Heterogeneous[[:space:]]Integration[[:space:]]SiliconIII[[:space:]]V[[:space:]]Semiconductor[[:space:]]Optical[[:space:]]Amplifiers.pdf filter=lfs diff=lfs merge=lfs -text
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+ The[[:space:]]Progress[[:space:]]and[[:space:]]Trend[[:space:]]of[[:space:]]Heterogeneous[[:space:]]Integration[[:space:]]SiliconIII-V[[:space:]]Semiconductor[[:space:]]Optical[[:space:]]Amplifiers.pdf filter=lfs diff=lfs merge=lfs -text
A Review of Mechanism and Technology of Hybrid Bonding.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:1b4ad0e6635dabbea0fd8c47c08cae98a958ebfa6797450c83ad4e00b2832673
3
+ size 2409766
A Review on hybrid bonding interconnection and its characterization.pdf ADDED
The diff for this file is too large to render. See raw diff
 
Beyond CMOS heterogeneous integration of III–V devices, RF MEMS and other dissimilar materialsdevices with Si CMOS to create intelligent microsystems.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:e0725b0e837a4ae34c2417f7b649f700b882f90c8f0f5cdb4c0bf829394dd961
3
+ size 1382360
Chiplet Heterogeneous Integration Technology—Status and Challenges.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:c403b18bba7d273965af4ef77b2b324e8659dc6e09a7da66599aa280fec29009
3
+ size 1347045
Copper Bonding Technology in Heterogeneous Integration.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:94117f1bf23ee00a852081f2f0dd4043b9c72f5718efe8938a2a7db03e6b0289
3
+ size 2628578
Epitaxial growth and layer-transfer techniques for heterogeneous integration of materials for electronic and photonic devices.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:5180d45d63404efaf133080949dcc1388d51300debd28d0b7e40ec86c1f6a1c0
3
+ size 3279794
Heterogeneous Integration of compound semiconductors.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:55d0d0d78e7d84da5d5c6807f1f8a24d5d62412cdde701fd51b157db32904d1b
3
+ size 3090197
Hybrid Cu-to-Cu bonding with nano-twinned Cu.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:60211ff05a6e346f10124041ef161af3bdf4ca3569c32d42f27fecfdc2a6cb22
3
+ size 4165833
III-Vsilicon photonics for on chip and intra chip optical interconnects.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:0df5642701e4133aee5cd43205e2f0a33618005199fe9e79a7f569278eb02716
3
+ size 3451155
Integrating MEMS and ICs.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:f2499b4ba3ddc3f81450d4de61671825430b97371b1f3f343d5bc9d0947a65d5
3
+ size 7432547
Materials for heterogeneous integration.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:c42f530ac8eed013a27396baa59092243040484b4e7fac16792a2d23c9bb217f
3
+ size 1533616
Materials,processingandreliabilityoflowtemperaturebondingin3D.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:15520da284f30dd76e8d361a90a337799422b82cd86d8c67b0dcfe9871de4919
3
+ size 3601354
Research progress of hybrid bonding technology for (2).pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:c6e31a5582d3f6cd35e112351fccc98b8886b584611c9709067c0e4f8ca0f1d5
3
+ size 19493196
Temporary Bonding and Debonding in Advanced Packaging Recent Progress and Applications.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:f0d823342365b77ce3d7afe326d40e8c196a3fa25b76f7f66e4cece9a7e4aa27
3
+ size 2492867
The Progress and Trend of Heterogeneous Integration SiliconIII V Semiconductor Optical Amplifiers.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:d11e9362d1a07b9e7490e6a7df7c2c5cc0950cee2f02d928a8c7c55393fc50c4
3
+ size 4912111
The Progress and Trend of Heterogeneous Integration SiliconIII-V Semiconductor Optical Amplifiers.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:21892352c8f89cdec2d1432a8e3ebb6551342d61830794d054a003ffc1af6fac
3
+ size 3051277
The era of hyper-scaling in electronics.pdf ADDED
@@ -0,0 +1,3 @@
 
 
 
 
1
+ version https://git-lfs.github.com/spec/v1
2
+ oid sha256:6c02b838d0b5b68667bf453aff7be132c237f73f795f607324a061e1482319eb
3
+ size 1746290