Upload 17 files
Browse files- .gitattributes +16 -0
- A Review of Mechanism and Technology of Hybrid Bonding.pdf +3 -0
- A Review on hybrid bonding interconnection and its characterization.pdf +0 -0
- Beyond CMOS heterogeneous integration of III–V devices, RF MEMS and other dissimilar materialsdevices with Si CMOS to create intelligent microsystems.pdf +3 -0
- Chiplet Heterogeneous Integration Technology—Status and Challenges.pdf +3 -0
- Copper Bonding Technology in Heterogeneous Integration.pdf +3 -0
- Epitaxial growth and layer-transfer techniques for heterogeneous integration of materials for electronic and photonic devices.pdf +3 -0
- Heterogeneous Integration of compound semiconductors.pdf +3 -0
- Hybrid Cu-to-Cu bonding with nano-twinned Cu.pdf +3 -0
- III-Vsilicon photonics for on chip and intra chip optical interconnects.pdf +3 -0
- Integrating MEMS and ICs.pdf +3 -0
- Materials for heterogeneous integration.pdf +3 -0
- Materials,processingandreliabilityoflowtemperaturebondingin3D.pdf +3 -0
- Research progress of hybrid bonding technology for (2).pdf +3 -0
- Temporary Bonding and Debonding in Advanced Packaging Recent Progress and Applications.pdf +3 -0
- The Progress and Trend of Heterogeneous Integration SiliconIII V Semiconductor Optical Amplifiers.pdf +3 -0
- The Progress and Trend of Heterogeneous Integration SiliconIII-V Semiconductor Optical Amplifiers.pdf +3 -0
- The era of hyper-scaling in electronics.pdf +3 -0
.gitattributes
CHANGED
@@ -33,3 +33,19 @@ saved_model/**/* filter=lfs diff=lfs merge=lfs -text
|
|
33 |
*.zip filter=lfs diff=lfs merge=lfs -text
|
34 |
*.zst filter=lfs diff=lfs merge=lfs -text
|
35 |
*tfevents* filter=lfs diff=lfs merge=lfs -text
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
33 |
*.zip filter=lfs diff=lfs merge=lfs -text
|
34 |
*.zst filter=lfs diff=lfs merge=lfs -text
|
35 |
*tfevents* filter=lfs diff=lfs merge=lfs -text
|
36 |
+
A[[:space:]]Review[[:space:]]of[[:space:]]Mechanism[[:space:]]and[[:space:]]Technology[[:space:]]of[[:space:]]Hybrid[[:space:]]Bonding.pdf filter=lfs diff=lfs merge=lfs -text
|
37 |
+
Beyond[[:space:]]CMOS[[:space:]]heterogeneous[[:space:]]integration[[:space:]]of[[:space:]]III–V[[:space:]]devices,[[:space:]]RF[[:space:]]MEMS[[:space:]]and[[:space:]]other[[:space:]]dissimilar[[:space:]]materialsdevices[[:space:]]with[[:space:]]Si[[:space:]]CMOS[[:space:]]to[[:space:]]create[[:space:]]intelligent[[:space:]]microsystems.pdf filter=lfs diff=lfs merge=lfs -text
|
38 |
+
Chiplet[[:space:]]Heterogeneous[[:space:]]Integration[[:space:]]Technology—Status[[:space:]]and[[:space:]]Challenges.pdf filter=lfs diff=lfs merge=lfs -text
|
39 |
+
Copper[[:space:]]Bonding[[:space:]]Technology[[:space:]]in[[:space:]]Heterogeneous[[:space:]]Integration.pdf filter=lfs diff=lfs merge=lfs -text
|
40 |
+
Epitaxial[[:space:]]growth[[:space:]]and[[:space:]]layer-transfer[[:space:]]techniques[[:space:]]for[[:space:]]heterogeneous[[:space:]]integration[[:space:]]of[[:space:]]materials[[:space:]]for[[:space:]]electronic[[:space:]]and[[:space:]]photonic[[:space:]]devices.pdf filter=lfs diff=lfs merge=lfs -text
|
41 |
+
Heterogeneous[[:space:]]Integration[[:space:]]of[[:space:]]compound[[:space:]]semiconductors.pdf filter=lfs diff=lfs merge=lfs -text
|
42 |
+
Hybrid[[:space:]]Cu-to-Cu[[:space:]]bonding[[:space:]]with[[:space:]]nano-twinned[[:space:]]Cu.pdf filter=lfs diff=lfs merge=lfs -text
|
43 |
+
III-Vsilicon[[:space:]]photonics[[:space:]]for[[:space:]]on[[:space:]]chip[[:space:]]and[[:space:]]intra[[:space:]]chip[[:space:]]optical[[:space:]]interconnects.pdf filter=lfs diff=lfs merge=lfs -text
|
44 |
+
Integrating[[:space:]]MEMS[[:space:]]and[[:space:]]ICs.pdf filter=lfs diff=lfs merge=lfs -text
|
45 |
+
Materials[[:space:]]for[[:space:]]heterogeneous[[:space:]]integration.pdf filter=lfs diff=lfs merge=lfs -text
|
46 |
+
Materials,processingandreliabilityoflowtemperaturebondingin3D.pdf filter=lfs diff=lfs merge=lfs -text
|
47 |
+
Research[[:space:]]progress[[:space:]]of[[:space:]]hybrid[[:space:]]bonding[[:space:]]technology[[:space:]]for[[:space:]](2).pdf filter=lfs diff=lfs merge=lfs -text
|
48 |
+
Temporary[[:space:]]Bonding[[:space:]]and[[:space:]]Debonding[[:space:]]in[[:space:]]Advanced[[:space:]]Packaging[[:space:]]Recent[[:space:]]Progress[[:space:]]and[[:space:]]Applications.pdf filter=lfs diff=lfs merge=lfs -text
|
49 |
+
The[[:space:]]era[[:space:]]of[[:space:]]hyper-scaling[[:space:]]in[[:space:]]electronics.pdf filter=lfs diff=lfs merge=lfs -text
|
50 |
+
The[[:space:]]Progress[[:space:]]and[[:space:]]Trend[[:space:]]of[[:space:]]Heterogeneous[[:space:]]Integration[[:space:]]SiliconIII[[:space:]]V[[:space:]]Semiconductor[[:space:]]Optical[[:space:]]Amplifiers.pdf filter=lfs diff=lfs merge=lfs -text
|
51 |
+
The[[:space:]]Progress[[:space:]]and[[:space:]]Trend[[:space:]]of[[:space:]]Heterogeneous[[:space:]]Integration[[:space:]]SiliconIII-V[[:space:]]Semiconductor[[:space:]]Optical[[:space:]]Amplifiers.pdf filter=lfs diff=lfs merge=lfs -text
|
A Review of Mechanism and Technology of Hybrid Bonding.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:1b4ad0e6635dabbea0fd8c47c08cae98a958ebfa6797450c83ad4e00b2832673
|
3 |
+
size 2409766
|
A Review on hybrid bonding interconnection and its characterization.pdf
ADDED
The diff for this file is too large to render.
See raw diff
|
|
Beyond CMOS heterogeneous integration of III–V devices, RF MEMS and other dissimilar materialsdevices with Si CMOS to create intelligent microsystems.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:e0725b0e837a4ae34c2417f7b649f700b882f90c8f0f5cdb4c0bf829394dd961
|
3 |
+
size 1382360
|
Chiplet Heterogeneous Integration Technology—Status and Challenges.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:c403b18bba7d273965af4ef77b2b324e8659dc6e09a7da66599aa280fec29009
|
3 |
+
size 1347045
|
Copper Bonding Technology in Heterogeneous Integration.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:94117f1bf23ee00a852081f2f0dd4043b9c72f5718efe8938a2a7db03e6b0289
|
3 |
+
size 2628578
|
Epitaxial growth and layer-transfer techniques for heterogeneous integration of materials for electronic and photonic devices.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:5180d45d63404efaf133080949dcc1388d51300debd28d0b7e40ec86c1f6a1c0
|
3 |
+
size 3279794
|
Heterogeneous Integration of compound semiconductors.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:55d0d0d78e7d84da5d5c6807f1f8a24d5d62412cdde701fd51b157db32904d1b
|
3 |
+
size 3090197
|
Hybrid Cu-to-Cu bonding with nano-twinned Cu.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:60211ff05a6e346f10124041ef161af3bdf4ca3569c32d42f27fecfdc2a6cb22
|
3 |
+
size 4165833
|
III-Vsilicon photonics for on chip and intra chip optical interconnects.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:0df5642701e4133aee5cd43205e2f0a33618005199fe9e79a7f569278eb02716
|
3 |
+
size 3451155
|
Integrating MEMS and ICs.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:f2499b4ba3ddc3f81450d4de61671825430b97371b1f3f343d5bc9d0947a65d5
|
3 |
+
size 7432547
|
Materials for heterogeneous integration.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:c42f530ac8eed013a27396baa59092243040484b4e7fac16792a2d23c9bb217f
|
3 |
+
size 1533616
|
Materials,processingandreliabilityoflowtemperaturebondingin3D.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:15520da284f30dd76e8d361a90a337799422b82cd86d8c67b0dcfe9871de4919
|
3 |
+
size 3601354
|
Research progress of hybrid bonding technology for (2).pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:c6e31a5582d3f6cd35e112351fccc98b8886b584611c9709067c0e4f8ca0f1d5
|
3 |
+
size 19493196
|
Temporary Bonding and Debonding in Advanced Packaging Recent Progress and Applications.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:f0d823342365b77ce3d7afe326d40e8c196a3fa25b76f7f66e4cece9a7e4aa27
|
3 |
+
size 2492867
|
The Progress and Trend of Heterogeneous Integration SiliconIII V Semiconductor Optical Amplifiers.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:d11e9362d1a07b9e7490e6a7df7c2c5cc0950cee2f02d928a8c7c55393fc50c4
|
3 |
+
size 4912111
|
The Progress and Trend of Heterogeneous Integration SiliconIII-V Semiconductor Optical Amplifiers.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:21892352c8f89cdec2d1432a8e3ebb6551342d61830794d054a003ffc1af6fac
|
3 |
+
size 3051277
|
The era of hyper-scaling in electronics.pdf
ADDED
@@ -0,0 +1,3 @@
|
|
|
|
|
|
|
|
|
1 |
+
version https://git-lfs.github.com/spec/v1
|
2 |
+
oid sha256:6c02b838d0b5b68667bf453aff7be132c237f73f795f607324a061e1482319eb
|
3 |
+
size 1746290
|