Q104 Qualification Test Plan Automotive Grade Level = MSL = Supplier Name: General Specification: AEC-Q104 Rev. - Supplier Code: Supplier Wafer Fabrication: Supplier Part Number: Supplier Wafer Test: Supplier Contact: Supplier Assembly Site: Supplier Family Type: Supplier Final Test Site: Device Description: Supplier Reliability Signature: PPAP Submission Date: Customer Test ID: Reason for Qualification: Customer Part Number: Prepared by Signature: Date: Customer Approval Signature: Date: Results Comments: Test # Reference Test Conditions Lots S.S. Total Lot/Pass/Fail (N/A =Not Applicable) Test Group A Accelerated Environment Stress Tests – Preconditioning: (Test @ Rm) JESD22 A113 PC A1 SMD only; Moisture Preconditioning for THB/HAST, Min. MSL = 3 MSL = J-STD-020 AC/UHST, TC, & PTC; Peak Reflow Temp = Temperature Humidity Bias: (Test @ Rm/Hot) THB JESD22 A101 or A2 of Highly Accelerated Stress Test: (Test @ Rm/Hot/) HAST JESD22 A110 Autoclave: (Test @ Rm) AC or JESD22 A102 Unbiased Highly Accelerated Stress Test: (Test @ Rm) UHST A3 JESD22 A118 of Temperature Humidity without Bias: (Test @ Rm) or TH or JESD22-A101 Temperature Cycle: (Test @ Hot) TC A4 JESD22 A104 of Power Temperature Cycle: (Test @ Rm/Hot) PTC A5 JESD22 A105 of High Temperature Storage Life: (Test @ Rm/Hot) HTSL A6 JESD22 A103 of
Q104 Qualification Test Plan Automotive Grade Level = MSL = Supplier Name: General Specification: AEC-Q104 Rev. - Supplier Code: Supplier Wafer Fabrication: Supplier Part Number: Supplier Wafer Test: Supplier Contact: Supplier Assembly Site: Supplier Family Type: Supplier Final Test Site: Device Description: Supplier Reliability Signature: PPAP Submission Date: Customer Test ID: Reason for Qualification: Customer Part Number: Prepared by Signature: Date: Customer Approval Signature: Date: Test # Reference Test Conditions Lots S.S. Total Results Lot/Pass/Fail Comments: (N/A =Not Applicable) Test Group A – Accelerated Environment Stress Tests PC A1 JESD22 A113 J-STD-020 Preconditioning: (Test @ Rm) SMD only; Moisture Preconditioning for THB/HAST, AC/UHST, TC, & PTC; Peak Reflow Temp = Min. MSL = 3 MSL = THB or HAST A2 JESD22 A101 JESD22 A110 Temperature Humidity Bias: (Test @ Rm/Hot) Highly Accelerated Stress Test: (Test @ Rm/Hot/) of AC or UHST or TH A3 JESD22 A102 JESD22 A118 or JESD22-A101 Autoclave: (Test @ Rm) Unbiased Highly Accelerated Stress Test: (Test @ Rm) Temperature Humidity without Bias: (Test @ Rm) of TC A4 JESD22 A104 Temperature Cycle: (Test @ Hot) of PTC A5 JESD22 A105 Power Temperature Cycle: (Test @ Rm/Hot) of HTSL A6 JESD22 A103 High Temperature Storage Life: (Test @ Rm/Hot) of
AEC_Q104_Rev-_QTP_Template_Final.docx