Test Group B Accelerated lifetime simulation tests – High Temp Operating Life: (Test @ Rm/Cold/Hot) HTOL B1 JESD22 A108 of AEC-Q104 Early Life Failure Rate: (Test @ Rm/Hot) ELFR B2 of Appendix 2 NVM Endurance & Data Retention Test: (Test @ Rm/Hot) EDR B3 AEC-Q100-005 of TEST GROUP C PACKAGE ASSEMBLY INTEGRITY TESTS – 5 AEC-Q100-001 Wire Bond Shear Test: (Cpk > 1.67) 30 WBS C1 of MCMs AEC-Q003 bonds bonds Min. Mil-STD-883, 5 Wire Bond Pull: (Cpk > 1.67); Each bonder used 30 WBP C2 Method 2011 of MCMs bonds bonds Min. AEC-Q003 Solderability: (>95% coverage) JESD22 B102 SD C3 8hr steam aging prior to testing of JSTD-002D JESD22 B100, Physical Dimensions: (Cpk > 1.67) PD C4 JESD22 B108 of AEC-Q003 Solder Ball Shear: (Cpk > 1.67); 5 balls from min. of 10 AEC-Q100-010 SBS C5 MCMs balls of AEC-Q003 balls Lead Integrity: (No lead cracking or breaking); LI C6 JESD22 B105 only; 10 leads from each of 5 MCMs of leads leads X-ray: XRAY C7 Acoustic Microscopy: AM C8 TEST GROUP D DIE FABRICATION RELIABILITY TESTS – Electromigration: Data Available EM D1 JEP001 - - - Time Dependant Dielectric Breakdown: Data Available TDDB D2 JEP001 - - -
Test Group B – Accelerated lifetime simulation tests HTOL B1 JESD22 A108 High Temp Operating Life: (Test @ Rm/Cold/Hot) of ELFR B2 AEC-Q104 Appendix 2 Early Life Failure Rate: (Test @ Rm/Hot) of EDR B3 AEC-Q100-005 NVM Endurance & Data Retention Test: (Test @ Rm/Hot) of TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTS WBS C1 AEC-Q100-001 AEC-Q003 Wire Bond Shear Test: (Cpk > 1.67) 30 bonds 5 MCMs Min. bonds of WBP C2 Mil-STD-883, Method 2011 AEC-Q003 Wire Bond Pull: (Cpk > 1.67); Each bonder used 30 bonds 5 MCMs Min. bonds of SD C3 JESD22 B102 JSTD-002D Solderability: (>95% coverage) 8hr steam aging prior to testing of PD C4 JESD22 B100, JESD22 B108 AEC-Q003 Physical Dimensions: (Cpk > 1.67) of SBS C5 AEC-Q100-010 AEC-Q003 Solder Ball Shear: (Cpk > 1.67); 5 balls from min. of 10 MCMs balls balls of LI C6 JESD22 B105 Lead Integrity: (No lead cracking or breaking); only; 10 leads from each of 5 MCMs leads leads of XRAY C7 X-ray: AM C8 Acoustic Microscopy: TEST GROUP D – DIE FABRICATION RELIABILITY TESTS EM D1 JEP001 Electromigration: - - - Data Available TDDB D2 JEP001 Time Dependant Dielectric Breakdown: - - - Data Available
AEC_Q104_Rev-_QTP_Template_Final.docx