The info pads and lockout features are end user selectable. See Related Information 1, ¶ R1-3 for an example of how they may be specified. Presence, Placement, Info-Pads and RFID Tag Placement Sensor Pad and Hole Cross-Section Requirement for Radio Frequency Identification (RFID) Tag Placement Volume The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID tag, if present, must be placed within the volume defined by and as shown in Figures 13 x29, y26, y27, z37 z38 and 15. SEMI E144 provides specifications for the required elements of RFID tags. RFID Tag Placement Volume Requirement for Carrier Hold-Down Features The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly closer to the FP than the front KCPs. Each feature consists of cylindrical volume centered at and x28 y38 with top and bottom surfaces at HP and with radius Each volume has an opening to the bottom of the carrier z6 r7. bounded by and From the bottom of the opening, a vertical surface of height joins (with a small but y34, y35 r7. z7 unspecified blend radius) a sloping plane of angle above the horizontal (and parallel to the intersection of FP and θ3 HP). This sloping plane meets the surface at See Figures 16 and 17. z6. This configuration provides the load port with several options for holding the carrier in place not limited to the following: A hook shape that presses against the slope and the shelf, or A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the sloping plane with or without contacting the incline. See Figure 18. Either (each) hold-down feature shall be able to withstand a force in any direction of without f001 permanent damage or deformation. Door opening and closing shall operate correctly with a force of applied to either (each) f002 down feature. The carrier must withstand this force without impact on its intended function. The force generated at the bottom hold feature is related to the wafer retention forces and the door sealing forces that occur during the door insertion and removal operation. Carrier suppliers should consider the maximum force generated in their carrier design when designing the hold down feature. carrier’s Hold-Down Feature Locations
The info pads and lockout features are end user selectable. See Related Information 1, ¶ R1-3 for an example of how they may be specified. Presence, Placement, Info-Pads and RFID Tag Placement Sensor Pad and Hole Cross-Section Requirement for Radio Frequency Identification (RFID) Tag Placement Volume The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID tag, if present, must be placed within the volume defined by x29, y26, y27, z37 and z38 as shown in Figures 13 and 15. SEMI E144 provides specifications for the required elements of RFID tags. RFID Tag Placement Volume Requirement for Carrier Hold-Down Features The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly closer to the FP than the front KCPs. Each feature consists of cylindrical volume centered at x28 and y38 with top and bottom surfaces at HP and z6 with radius r7. Each volume has an opening to the bottom of the carrier bounded by y34, y35 and r7. From the bottom of the opening, a vertical surface of height z7 joins (with a small but unspecified blend radius) a sloping plane of angle θ3 above the horizontal (and parallel to the intersection of FP and HP). This sloping plane meets the surface at z6. See Figures 16 and 17. This configuration provides the load port with several options for holding the carrier in place not limited to the following: A hook shape that presses against the slope and the shelf, or A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the sloping plane with or without contacting the incline. See Figure 18. Either (each) hold-down feature shall be able to withstand a force in any direction of f001 without permanent damage or deformation. Door opening and closing shall operate correctly with a force of f002 applied to either (each) feature. The carrier must withstand this force without impact on its intended function. The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing forces that occur during the door insertion and removal operation. Carrier suppliers should consider the maximum force generated in their carrier design when designing the carrier’s hold down feature. Hold-Down Feature Locations
5877.docx