Made clarifications in the section on Vac-Seal Added general stipulations in section 12.2 such as for design applications where dimensional control is extremely important or tolerances are exceedingly tight, it is the responsibility of the design engineer to (a) establish a basis for baking parts at temperatures lower than the See DCC default temperatures recommended herein, and v18 26 Aug 2011 record (b) get a waiver for a lower temperature bake from the LIGO Vacuum Review Board. Corrected indium entry Combined copper and copper alloys (such as aluminum bronze, phosphor bronze and beryllium copper) into a single section section regarding Class B cleaning and See DCC v19 24 Sep 2011 baking of Viton record Changed section 12.27.8 to show updated See DCC v20 19 Oct 2011 cleaning procedure for viewports record Changed Section 12.27.8 (again) to show updated viewport cleaning procedures See DCC V21 Clarified and updated section regarding record electrical feedthroughs Clarified responsibilities of cognizant engineer and VRB Added section about DI water and inspection of DI water systems that supply Clean and Bake facilities Augmented fluoroelastomers section with reminder to maximize surface exposure and minimize surface contact during baking and made it explicit that CIT is the default site for baking Viton, etc. Clarified OSEM cables and sensor sections Removed note about not using water on electro-polished parts 26 March See DCC Clarified labeling section to mention ICS V22 2012 record generated labels explicit note about oven ramp up and cool down times for feed-throughs Updated optics cleaning and baking section to indicate VRB acceptance of bake” “no proposal Added section about Clean and Bake requests including link to CNB Ticketing System Clarified cleaning process for Macor process for cleaning Optics Lens Caps Added link to CNB of Siskiyou Mirror Mounts Added Zerodur and Invar clean and bake instructions
Made clarifications in the section on Vac-Seal v18 26 Aug 2011 See DCC record Added general stipulations in section 12.2 such as for design applications where dimensional control is extremely important or tolerances are exceedingly tight, it is the responsibility of the design engineer to (a) establish a basis for baking parts at temperatures lower than the default temperatures recommended herein, and (b) get a waiver for a lower temperature bake from the LIGO Vacuum Review Board. Corrected indium entry Combined copper and copper alloys (such as aluminum bronze, phosphor bronze and beryllium copper) into a single section v19 24 Sep 2011 See DCC record section regarding Class B cleaning and baking of Viton v20 19 Oct 2011 See DCC record Changed section 12.27.8 to show updated cleaning procedure for viewports V21 See DCC record Changed Section 12.27.8 (again) to show updated viewport cleaning procedures Clarified and updated section regarding electrical feedthroughs V22 26 March 2012 See DCC record Clarified responsibilities of cognizant engineer and VRB Added section about DI water and inspection of DI water systems that supply Clean and Bake facilities Augmented fluoroelastomers section with reminder to maximize surface exposure and minimize surface contact during baking and made it explicit that CIT is the default site for baking Viton, etc. Clarified OSEM cables and sensor sections Removed note about not using water on electro-polished parts Clarified labeling section to mention ICS generated labels explicit note about oven ramp up and cool down times for feed-throughs Updated optics cleaning and baking section to indicate VRB acceptance of “no bake” proposal Added section about Clean and Bake requests including link to CNB Ticketing System Clarified cleaning process for Macor process for cleaning Optics Lens Caps Added link to CNB of Siskiyou Mirror Mounts Added Zerodur and Invar clean and bake instructions
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