III/V compound No Exposed B Semiconductors metals- Metals can be buried/covered Glass with Staff Substrates approval PECVD and ALD Cannot be used Films as an etch stop Buried Class B Metals with approval Organic/Bio Materials prepped w/o Salt Buffers Cured organics and baked No High Vapor Photoresist pressure materials Tool Category 5: Class A and B Metals and Compounds Allowed Not Allowed Tool category 1/1+ 2, 3, and 4 materials Silicon Based Substrates and Films III/V compound Semiconductors Glass Substrates and ALD Films Cured organics and baked Photoresist Class A, B, and CNF Refractory metals Exposed Gold, Silver, Copper
III/V compound Semiconductors No Exposed B metals- Glass Substrates Metals can be buried/covered with Staff approval PECVD and ALD Films Cannot be used as an etch stop Buried Class B Metals with approval Organic/Bio Materials prepped w/o Salt Buffers Cured organics and baked Photoresist No High Vapor pressure materials Tool Category 5: Class A and B Metals and Compounds Allowed Not Allowed Tool category 1/1+ 2, 3, and 4 materials Silicon Based Substrates and Films III/V compound Semiconductors Glass Substrates and ALD Films Cured organics and baked Photoresist Class A, B, and CNF Refractory metals Exposed Gold, Silver, Copper
CNF%20Tool%20and%20Material%20Compatibility%20Policy%203_21_18.docx