VPG200 – exposure with manual alignment point and click style Version of 2017-08-08. Get the latest one at Introduction Change write mode This guide presents a step by step procedure on Change the write mode to “Head_20mm” or how to expose a design aligned with a pre-existing on the writehead you “Head_10mm” depending design on a substrate, a will use to write your design (Head_5mm is not mask aligners task… . available/advisable for alignment, because the It uses the global alignment script to manually optical focus of this mode will interfere with the find the wafer/substrate’s coordinate system, then pre-existing features on the wafer and loose runs a job. Loading and unloading is done focus.). manually with handler. Select desired writehead in the “Write mode” list. Login on accounting PC Login with and password.on the you “CMi” account Click <yes> when the software asks for the Zone 05 accounting computer. Select the confirmation to change mode. VPG200 “Heidelberg – Laser lithography system”. Wait for “Please unmount current device…” message. Fig 1: accounting interface Start the software Only then physically change the writehead. on vpg200, Failure to follow this sequence will put writehead in If no “Hi-Login” window present then start software (currently 1.8 Menu) an undefined state requiring staff intervention. When done changing writehead, click <ok> in the “Please unmount current device…” message. If software already running, make sure to change user to below account. login Username Advanced, Wait for the new mode to be properly loaded. Password: “ ” Wait: Set-up Automation and Mode Parts are moved, intensity is calibrated, be patient. Proceed: Set Automation mode to and “Quiet” “Manual”. Load substrate Otherwise , once we have done the global Select the “Handler” tab. alignment, the stage will wafercenter and setzero and thereby mess up your alignment.
VPG200 – exposure with manual alignment point and click style Version of 2017-08-08. Get the latest one at Introduction This guide presents a step by step procedure on how to expose a design aligned with a pre-existing design on a substrate, a mask aligners task… . It uses the global alignment script to manually find the wafer/substrate’s coordinate system, then runs a job. Loading and unloading is done manually with handler. Login on accounting PC Login with you “CMi” account and password.on the Zone 05 accounting computer. Select the “Heidelberg VPG200 – Laser lithography system”. Fig 1: accounting interface Start the software If no “Hi-Login” window present on vpg200, then start software (currently 1.8 Menu) If software already running, make sure to change user to below account. login Username Advanced, Password: “ ” Set-up Automation and Mode Set Automation mode to “Quiet” and “Manual”. Otherwise , once we have done the global alignment, the stage will wafercenter and setzero and thereby mess up your alignment. Change write mode Change the write mode to “Head_20mm” or “Head_10mm” depending on the writehead you will use to write your design (Head_5mm is not available/advisable for alignment, because the optical focus of this mode will interfere with the pre-existing features on the wafer and loose focus.). Select desired writehead in the “Write mode” list. Click <yes> when the software asks for the confirmation to change mode. Wait for “Please unmount current device…” message. Only then physically change the writehead. Failure to follow this sequence will put writehead in an undefined state requiring staff intervention. When done changing writehead, click <ok> in the “Please unmount current device…” message. Wait for the new mode to be properly loaded. Wait: Parts are moved, intensity is calibrated, be patient. Proceed: Load substrate Select the “Handler” tab.
vpg.exp.man.align.point.and.click.170808.docx