d. Talks, Abstracts, and Other Professional Papers Presented Articles 1. Requirement for Next Generation Modeling”, Printed Circuit Design & Manufacture, “Critical , June 2007. Refereed Conference Proceedings and Presentations [2015] 2015-1 New In-Situ Warpage Measurement of a Wafer with Speckle-Free Digital Image “A Correlation (DIC) Method,” Yuling Niu, Seungbae Park, and Hohyung Lee, Proc. of 65th May 2015. ECTC, 2015-2 Fracture Mechanics Parametric Study of the Cu-Cu Direct Thermo-Compression “A Bonded Interface Using 2D and 3D Finite Element Method,” Ah-Young Park, Seungbae Park, and Satish Chaparala, May 2015. Proc. of 65th ECTC, [2014] 2014-1 Study of Analytical Models to predict Warpage in Microelectronics “Comparative Packages,” Charandeep Singh, Yeonsung Kim, and Seungbae Park, Proc. of the IMECE November 2014.. 2014, 2014-2 of Material Constants for Low-Cycle Fatigue Modeling,” Quang Nguyen, “Validation Seungbae Park, and Tung Nguyen, November 2014. Proc. of the IMECE 2014, 2014-3 of behavior of actual lead free solder joint for modeling,” “Characterizations Hohyung Lee, Ruiyang Liu, Seungbae Park, and Jae Kwak, Proc. of the IMECE 2014, November 2014. [2013] 2013-1 and Cu-Cu Direct Bond Wafer and Package-Level Reliability,” K. Hummler, B. “TSV Sapp, I. Ali, J.R. Lloyd, S. Kruger and S. Olson, S.B. Park, B. Murray, D. Jung, S. Cain, A. Park, and D. Ferrone, June 2013. Proc. of 63rd ECTC, 2013-2 to Evaluate Pre-Applied Underfill Materials with Concurrent Flux “Methodology Capability for Ultra-Fine Pitch Solder-Based Interconnects,” Sunoo Kim, Seth Kruger, Brian Sapp, and Sitaram Arkalgud, Ho Hyung Lee, and Seungbae Park, June Proc. of 63rd ECTC, 2013.
d. Talks, Abstracts, and Other Professional Papers Presented Articles 1. “Critical Requirement for Next Generation Modeling”, Printed Circuit Design & Manufacture, , June 2007. Refereed Conference Proceedings and Presentations [2015] 2015-1 “A New In-Situ Warpage Measurement of a Wafer with Speckle-Free Digital Image Correlation (DIC) Method,” Yuling Niu, Seungbae Park, and Hohyung Lee, Proc. of 65th ECTC, May 2015. 2015-2 “A Fracture Mechanics Parametric Study of the Cu-Cu Direct Thermo-Compression Bonded Interface Using 2D and 3D Finite Element Method,” Ah-Young Park, Seungbae Park, and Satish Chaparala, Proc. of 65th ECTC, May 2015. [2014] 2014-1 “Comparative Study of Analytical Models to predict Warpage in Microelectronics Packages,” Charandeep Singh, Yeonsung Kim, and Seungbae Park, Proc. of the IMECE 2014, November 2014.. 2014-2 “Validation of Material Constants for Low-Cycle Fatigue Modeling,” Quang Nguyen, Seungbae Park, and Tung Nguyen, Proc. of the IMECE 2014, November 2014. 2014-3 “Characterizations of behavior of actual lead free solder joint for modeling,” Hohyung Lee, Ruiyang Liu, Seungbae Park, and Jae Kwak, Proc. of the IMECE 2014, November 2014. [2013] 2013-1 “TSV and Cu-Cu Direct Bond Wafer and Package-Level Reliability,” K. Hummler, B. Sapp, I. Ali, J.R. Lloyd, S. Kruger and S. Olson, S.B. Park, B. Murray, D. Jung, S. Cain, A. Park, and D. Ferrone, Proc. of 63rd ECTC, June 2013. 2013-2 “Methodology to Evaluate Pre-Applied Underfill Materials with Concurrent Flux Capability for Ultra-Fine Pitch Solder-Based Interconnects,” Sunoo Kim, Seth Kruger, Brian Sapp, and Sitaram Arkalgud, Ho Hyung Lee, and Seungbae Park, Proc. of 63rd ECTC, June 2013.
SBParkCV.docx