Polishing Process Polishing is the process in which the wafer is smoothen its uneven surface left by lapping and etching process and makes the wafer mirrored, super-flat surface required for the fabrication of today's advanced semiconductor devices. Basically, it is an automated, multi-step process using ultra-fine slurry and pressure against two rotating surfaces ,which is quite similar to lapping. This is accomplished by chemical-mechanical polishing process to support optical photolithography. Final Dimension & Electrical Properties Qualification After all the above processes has been carried out, the wafers undergo a final test so that manufactures can check if the wafers obtained are met the customer specifications and needs. They are tested for flatness, thickness, resistivity and type. The electrical properties of wafers can be tested with examina probe which is easily found in industry. By carrying out the final test, defect trend information can be evolved. Thus, the wafer manufactures can taken necessary improvement on yield and process improvement regarding surface defects, scratches and particles defect. Silicon Fabrication Steps
Polishing Process Polishing is the process in which the wafer is smoothen its uneven surface left by lapping and etching process and makes the wafer mirrored, super-flat surface required for the fabrication of today's advanced semiconductor devices. Basically, it is an automated, multi-step process using ultra-fine slurry and pressure against two rotating surfaces ,which is quite similar to lapping. This is accomplished by chemical-mechanical polishing process to support optical photolithography. Final Dimension & Electrical Properties Qualification After all the above processes has been carried out, the wafers undergo a final test so that manufactures can check if the wafers obtained are met the customer specifications and needs. They are tested for flatness, thickness, resistivity and type. The electrical properties of wafers can be tested with examina probe which is easily found in industry. By carrying out the final test, defect trend information can be evolved. Thus, the wafer manufactures can taken necessary improvement on yield and process improvement regarding surface defects, scratches and particles defect. Silicon Fabrication Steps
silicon_wafer_processing.docx