15. "Effect of Substrate CTE on Solder Ball Reliability of Flip Chip PBGA Package Assembly", B. Han, M. Chopra, S. Park, L. Li, and K. Verma, Surface Mount International Conference, San Jose, CA, September 1996. Invited Talks, etc. as an indicator of Reliability”, Key Note Speech, North Atlantic Test “Warpage Workshop 2015. of Packaging When We Move from Ceramic to Organic,” Invited talk, “Challenges IMAPS Regional Meeting, IBM T.J. Watson Research Center, Yorktown Heights, NY, October 26, 2006. Formation and Failure of Pb-Free Solders under Thermal Cycling“, Invited talk, “Grain International Electronics Packaging Symposium, GE Global Research, Niskayuna, NY, October 23-24, 2006. of Pb-Free Solder Interconnects” Invited Seminar Series, Intel, , July 10, “Reliability 2006. Digital Image Correlation for the Investigation of SAC Solder Grain Stresses“, “3D Invited Seminar, , April 19, 2005. Assessment of MEMS and MOEMS Package”, invited seminar, Analog “Reliability Device, , May 25, 2004. Moire vs. Three Dimensional Digital Image Correlation for In-situ Warpage “Shadow Measurement” JEDEC 14-1 Reliability Committee, Web Conference, December 3, 2003 Solution in High Power Laser Application”, Invited Seminar, Corning Inc., , “Packaging October 1, 2003. Impacts of Pb-Free Solders in Chip Interconnects”, invited seminar, , August “Reliability 19, 2003. Reliability Assessment on Electronic Packaging”, Invited Seminar, Teradyne “Systematic Inc., , August 5, 2003. Panelist for of Technology in Yield Learning Conference, IBM Headquarter, 1998. Invited seminar for Engineering Seminar Series, , , October 1996. Tutorial Tools for Packaging and Reliability,” Conference, July ASME InterPACK “Optomechanics 2011. in Microelectronics, MEMS, and MOEMS Packaging” in ASME ITHERM “Photomechanics May 2006. Conference 2006,
15. "Effect of Substrate CTE on Solder Ball Reliability of Flip Chip PBGA Package Assembly", B. Han, M. Chopra, S. Park, L. Li, and K. Verma, Surface Mount International Conference, San Jose, CA, September 1996. Invited Talks, etc. “Warpage as an indicator of Reliability”, Key Note Speech, North Atlantic Test Workshop 2015. “Challenges of Packaging When We Move from Ceramic to Organic,” Invited talk, IMAPS Regional Meeting, IBM T.J. Watson Research Center, Yorktown Heights, NY, October 26, 2006. “Grain Formation and Failure of Pb-Free Solders under Thermal Cycling“, Invited talk, International Electronics Packaging Symposium, GE Global Research, Niskayuna, NY, October 23-24, 2006. “Reliability of Pb-Free Solder Interconnects” Invited Seminar Series, Intel, , July 10, 2006. “3D Digital Image Correlation for the Investigation of SAC Solder Grain Stresses“, Invited Seminar, , April 19, 2005. “Reliability Assessment of MEMS and MOEMS Package”, invited seminar, Analog Device, , May 25, 2004. “Shadow Moire vs. Three Dimensional Digital Image Correlation for In-situ Warpage Measurement” JEDEC 14-1 Reliability Committee, Web Conference, December 3, 2003 “Packaging Solution in High Power Laser Application”, Invited Seminar, Corning Inc., , October 1, 2003. “Reliability Impacts of Pb-Free Solders in Chip Interconnects”, invited seminar, , August 19, 2003. “Systematic Reliability Assessment on Electronic Packaging”, Invited Seminar, Teradyne Inc., , August 5, 2003. Panelist for of Technology in Yield Learning Conference, IBM Headquarter, 1998. Invited seminar for Engineering Seminar Series, , , October 1996. Tutorial “Optomechanics Tools for Packaging and Reliability,” ASME InterPACK Conference, July 2011. “Photomechanics in Microelectronics, MEMS, and MOEMS Packaging” in ASME ITHERM Conference 2006, May 2006.
SBParkCV.docx