PI, Large Format Digital Correlation Metrology System, simulation modeling and their & Application to Electronic Components including Wafers, Advanced Semiconductor Engineering, 04/13–03/14, $50,000 (100%) PI, Advanced Package and Material Research, Analog Device, 09/13–12/13, $16,500 (100%) PI, Abnormal Signal for MEMS Oscillator, Sands9, 06/12–04/13, $79,500 (100%) PI, Advanced Package and Material Research, Analog Device, 06/12–04/13, $69,500 (100%) PI, Chip-Package Interactions on 3D-IC Learning Vehicle, SEMATECH, 06/12–04/13, $225,025 (34%), Co-PI: B. Murray, B. Sammakia PI, Underfill and Thermal Management, SEMATECH, 06/12–12/12, $75,026 (50%), Co-PI: B. Sammakia Co-PI, Investigations on Direct Copper Bonding as Method of Interconnection for Chip / Wafer Stacking, SEMATECH, 05/12–12/12, $74,004 (33%) PI: J. Cho PI, Impact Response of Substrate, Corning, 11/10–03/12, $74,004 (100%) PI, Investigating Temperature and Time Dependent Stress Relaxation Behavior of MEMS Packages and Packaging Materials, Analog Device, 10/10–11/11, $73,321 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 02/09–01/10, $67,600 (100%) PI, Development of In-situ and Full-field Deformation Analysis Methodology for a Mobile Phone under Drop Shock, Samsung, 02/08–11/08, $70,000 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 01/08–12/08, $59,269 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 09/06–08/07, $59,269 (100%) PI, Development of an Automated, In-situ, and 3-D Nano-Characterization System Using Digital Image Correlation, Intel Corporation, 06/06 03/07, $125,000, (100%) –
PI, Large Format Digital Correlation Metrology System, simulation & modeling and their Application to Electronic Components including Wafers, Advanced Semiconductor Engineering, 04/13–03/14, $50,000 (100%) PI, Advanced Package and Material Research, Analog Device, 09/13–12/13, $16,500 (100%) PI, Abnormal Signal for MEMS Oscillator, Sands9, 06/12–04/13, $79,500 (100%) PI, Advanced Package and Material Research, Analog Device, 06/12–04/13, $69,500 (100%) PI, Chip-Package Interactions on 3D-IC Learning Vehicle, SEMATECH, 06/12–04/13, $225,025 (34%), Co-PI: B. Murray, B. Sammakia PI, Underfill and Thermal Management, SEMATECH, 06/12–12/12, $75,026 (50%), Co-PI: B. Sammakia Co-PI, Investigations on Direct Copper Bonding as Method of Interconnection for Chip / Wafer Stacking, SEMATECH, 05/12–12/12, $74,004 (33%) PI: J. Cho PI, Impact Response of Substrate, Corning, 11/10–03/12, $74,004 (100%) PI, Investigating Temperature and Time Dependent Stress Relaxation Behavior of MEMS Packages and Packaging Materials, Analog Device, 10/10–11/11, $73,321 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 02/09–01/10, $67,600 (100%) PI, Development of In-situ and Full-field Deformation Analysis Methodology for a Mobile Phone under Drop Shock, Samsung, 02/08–11/08, $70,000 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 01/08–12/08, $59,269 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 09/06–08/07, $59,269 (100%) PI, Development of an Automated, In-situ, and 3-D Nano-Characterization System Using Digital Image Correlation, Intel Corporation, 06/06 – 03/07, $125,000, (100%)
SBParkCV.docx