MHSC Materials for Harsh Service Conditions – PI Process Intensification – R2R Roll-to-Roll Processing – TE Thermoelectric Materials, Devices, and Systems – WHR Waste Heat Recovery – WBG Wide Bandgap Power Electronics – PH Process Heating – ASCMP Advanced Sensors, Controls, Models and Platforms – NGM Next Generation Materials and their Manufacture – If you are commenting on a table, figure, or text box, clearly identify it in your comment (Figure 3, Table 7, etc.) Save the Word document with the following filename: Email your Word document to with the Subject line the same as your document filename (Lastname-Firstname-Chapter8TA). Please use the Comment Form on the following page for submission of your feedback. Comment Form 2015 QTR Chapter 8 Technology Assessments [NAME] [TITLE] [ORGANIZATION] [EMAIL] [PHONE NUMBER]
MHSC – Materials for Harsh Service Conditions PI – Process Intensification R2R – Roll-to-Roll Processing TE – Thermoelectric Materials, Devices, and Systems WHR – Waste Heat Recovery WBG – Wide Bandgap Power Electronics PH – Process Heating ASCMP – Advanced Sensors, Controls, Models and Platforms NGM – Next Generation Materials and their Manufacture If you are commenting on a table, figure, or text box, clearly identify it in your comment (Figure 3, Table 7, etc.) Save the Word document with the following filename: Email your Word document to with the Subject line the same as your document filename (Lastname-Firstname-Chapter8TA). Please use the Comment Form on the following page for submission of your feedback. Comment Form 2015 QTR Chapter 8 Technology Assessments [NAME] [TITLE] [ORGANIZATION] [EMAIL] [PHONE NUMBER]
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