Chris to follow up with Jose. D: SMTAI 2016. 06-03-2016 Chris Jorgensen to follow up with Jose 03-16-2016 Include BGAs covered with no-clean flux vs BGAs that are shipped after cleaning CLOSED ACTION Task/Section Responsible Status Can underfill cure the issue, new 09-28-2016 polymer-filled solder Action closed This is in Dave’s content on whiskering Advent of resin reinforced solder paste 07-19-2016 Chris to check back with Raiyo on purpose of this task. D: SMTAI 2016. 06-03-2016 Raiyo will prove some content by 6/30 03-16-2016 Need someone from the task group to take the lead. Thermal stress impact on smaller ball NEED VOLUNTEER 09-28-2016 contact interface Action closed 06-03-2016 Ask Dave Hillman to see if Section 8 needs this information Strive for harmonization with Udo Welzel / Dave 09-28-2016 and IPC-A-610F. Hillman Action closed Voiding limit for BGA solder Udo will contact those respective committees with comments for their joints (set to 30 % in the X-ray image in IPC-A-610F) documents. Electrical clearance requirements between solder 07-19-2016 balls (taken from PCB-related Electrical clearance requirements between solder balls (taken from PCB-related material in the Appendix of IPC-A-610F) material in the Appendix of IPC-A-610F): Udo will take it to IPC-A-610/J-STD-001 Non-collapse requirement 25-30 task groups. Need to reference JESD 217 Udo to include reference to JESD 217 (allows 10% in ball) (incoming BGA inspection) Can you even detect in non-collapse voids? 07-19-2016: Non-collapse requirement: Closed.
Chris to follow up with Jose. D: SMTAI 2016. 06-03-2016 Chris Jorgensen to follow up with Jose 03-16-2016 Include BGAs covered with no-clean flux vs BGAs that are shipped after cleaning CLOSED ACTION Task/Section Responsible Status Can underfill cure the issue, new polymer-filled solder Advent of resin reinforced solder paste 09-28-2016 Action closed This is in Dave’s content on whiskering 07-19-2016 Chris to check back with Raiyo on purpose of this task. D: SMTAI 2016. 06-03-2016 Raiyo will prove some content by 6/30 03-16-2016 Need someone from the task group to take the lead. Thermal stress impact on smaller ball contact interface NEED VOLUNTEER 09-28-2016 Action closed 06-03-2016 Ask Dave Hillman to see if Section 8 needs this information Strive for harmonization with and IPC-A-610F. Voiding limit for BGA solder joints (set to 30 % in the X-ray image in IPC-A-610F) Electrical clearance requirements between solder balls (taken from PCB-related material in the Appendix of IPC-A-610F) Non-collapse requirement 25-30 Need to reference JESD 217 (allows 10% in ball) Can you even detect in non-collapse voids? Udo Welzel / Dave Hillman 09-28-2016 Action closed Udo will contact those respective committees with comments for their documents. 07-19-2016 Electrical clearance requirements between solder balls (taken from PCB-related material in the Appendix of IPC-A-610F): Udo will take it to IPC-A-610/J-STD-001 task groups. Udo to include reference to JESD 217 (incoming BGA inspection) 07-19-2016: Non-collapse requirement: Closed.
IPC-7095D%20Task%20List%2011172016.docx