4.1 Recommended Reflow Profile Specifications The recommended baseline reflow profile is defined by the solder supplier/manufacturer. The oven supplier does not define the recommended reflow profile specification. The specification recommendation should be cross referenced with component specifications and board specifications to ensure maximum temperature limitation on materials used is not exceeded. The solder paste manufacturer has determined that achieving the recommended reflow profile will yield the overall optimum solder joint quality for a typical printed board assembly. Variations/deviations from this recommended baseline reflow profile may be required for printed board assemblies which have a large variation of thermal mass (eg. very large thermal mass components and very small thermal mass components on the same assembly). The baseline recommended profile is typically available within the suppliers solder paste data sheet provided with the solder paste. The data sheet is typically available on the solder paste supplier’s website. For guidance on setting up a specific recipe, see IPC-7530. 4.2 Example of a Typical Tin-Lead Reflow Profile Specifications A general ramp/soak/spike profile for an SnPb alloy may look like Figure 4-1.The elements of a ramp/soak/spike profile are: Preheat/soak time = 60-90 seconds = 183˚C Recommended peak temperature = 210-225˚C Time above = 30-90 seconds Recommendations from solder manufacturer will vary based on formula and manufacturer. Consult your solder paste manufacturer’s data sheet for specific time/temperature recommendations. Figure 4-1 Typical SnPb reflow profile (NEW) 4.3 Example of a Typical Pb-free Reflow Profile Specifications A general ramp/spike profile may look like Figure 4-2. The elements of a ramp/spike profile are: Preheat/soak time = 60-90 seconds = 217-220˚C Recommended peak temperature = 235-255˚C Time above = 40-75 seconds (sometimes 40-60 seconds) Recommendations from solder paste manufacturer will vary based on formula and manufacturer. Consult your solder paste manufacturer’s data sheet for specific time/temperature recommendations.
4.1 Recommended Reflow Profile Specifications The recommended baseline reflow profile is defined by the solder supplier/manufacturer. The oven supplier does not define the recommended reflow profile specification. The specification recommendation should be cross referenced with component specifications and board specifications to ensure maximum temperature limitation on materials used is not exceeded. The solder paste manufacturer has determined that achieving the recommended reflow profile will yield the overall optimum solder joint quality for a typical printed board assembly. Variations/deviations from this recommended baseline reflow profile may be required for printed board assemblies which have a large variation of thermal mass (eg. very large thermal mass components and very small thermal mass components on the same assembly). The baseline recommended profile is typically available within the suppliers solder paste data sheet provided with the solder paste. The data sheet is typically available on the solder paste supplier’s website. For guidance on setting up a specific recipe, see IPC-7530. 4.2 Example of a Typical Tin-Lead Reflow Profile Specifications A general ramp/soak/spike profile for an SnPb alloy may look like Figure 4-1.The elements of a ramp/soak/spike profile are: Preheat/soak time = 60-90 seconds = 183˚C Recommended peak temperature = 210-225˚C Time above = 30-90 seconds Recommendations from solder manufacturer will vary based on formula and manufacturer. Consult your solder paste manufacturer’s data sheet for specific time/temperature recommendations. Figure 4-1 Typical SnPb reflow profile (NEW) 4.3 Example of a Typical Pb-free Reflow Profile Specifications A general ramp/spike profile may look like Figure 4-2. The elements of a ramp/spike profile are: Preheat/soak time = 60-90 seconds = 217-220˚C Recommended peak temperature = 235-255˚C Time above = 40-75 seconds (sometimes 40-60 seconds) Recommendations from solder paste manufacturer will vary based on formula and manufacturer. Consult your solder paste manufacturer’s data sheet for specific time/temperature recommendations.
IPC-7801_working_draft_9-25-14.docx