180 (AlN) 260 (BeO) Copper 401 Soldering. Permanent connection of mechanical parts may be done by using welding, soldering, and gluing. Their essence is introduction of liquid phase between the parts to be connected (molten base metal in welding, molten solder in soldering, glue in gluing). The liquid wets the parts, gets in intimate interfacial contact with them arising intermolecular attractive forces. Then the liquid solidifies keeping the parts connected. Soldering is a process by which the parts are joined together using material (solder) with lower melting point than melting points of materials of joined parts. Welding is performed by melting of materials of joined parts. Glues are liquid materials that solidify as the result of chemical reaction or evaporation of solvent. Soldering materials. Solder is metal (elemental or alloy) or glass. Glass is used, for example, to attach optic cable to metal connector or to assemble ceramic and metallic parts of hermetic IC package. Metallic solders may be split in two families: are copper, zinc or silver alloys with melting temperature above 400C. Hard solders High melting temperature makes them not suitable for electronic assembly. have lower melting temperature (but lower mechanical strength) when Soft solders compared to hard solders. The most of soft solders are tin alloys. Tin is unique metal that wets vast majority of the metals. Six not wetted by tin (and therefore not solderable by tin alloys) metals are: Cast iron, Chromium (Cr), Titanium (Ti), Tantalum (Ta), Magnesium (Mg), Beryllium (Be). The fact that some metals that are not wetted by solder is important. These metals are used in soldering machinery for manufacturing machine parts that get in touch with molten solder. They were basic solders in electronic industry for many years. They Lead-containing solders. have relatively low melting temperature, excellent mechanical properties but comprise toxic lead. Nowadays they are gradually replaced by lead-free solders.
Copper 180 (AlN) 260 (BeO) 401 Soldering. Permanent connection of mechanical parts may be done by using welding, soldering, and gluing. Their essence is introduction of liquid phase between the parts to be connected (molten base metal in welding, molten solder in soldering, glue in gluing). The liquid wets the parts, gets in intimate interfacial contact with them arising intermolecular attractive forces. Then the liquid solidifies keeping the parts connected. Soldering is a process by which the parts are joined together using material (solder) with lower melting point than melting points of materials of joined parts. Welding is performed by melting of materials of joined parts. Glues are liquid materials that solidify as the result of chemical reaction or evaporation of solvent. Soldering materials. Solder is metal (elemental or alloy) or glass. Glass is used, for example, to attach optic cable to metal connector or to assemble ceramic and metallic parts of hermetic IC package. Metallic solders may be split in two families: Hard solders are copper, zinc or silver alloys with melting temperature above 400C. High melting temperature makes them not suitable for electronic assembly. Soft solders have lower melting temperature (but lower mechanical strength) when compared to hard solders. The most of soft solders are tin alloys. Tin is unique metal that wets vast majority of the metals. Six not wetted by tin (and therefore not solderable by tin alloys) metals are: Cast iron, Chromium (Cr), Titanium (Ti), Tantalum (Ta), Magnesium (Mg), Beryllium (Be). The fact that some metals that are not wetted by solder is important. These metals are used in soldering machinery for manufacturing machine parts that get in touch with molten solder. Lead-containing solders. They were basic solders in electronic industry for many years. They have relatively low melting temperature, excellent mechanical properties but comprise toxic lead. Nowadays they are gradually replaced by lead-free solders.