Surface energy density of solid: 1.65 J/m2 Thermal capability of solid: 560 J/(KgK) Thermal capability of liquid: 496 J/(KgK) Thermal conductivity of solid: 20 W/(mK) Thermal conductivity of liquid: 20 W/(mK) Melting point: 1650 oC Tm Latent heat: 3.76E5 J/Kg Absorption Coefficient: 0.4 m1 Table S2. Process parameters used in simulations Property Value Unit Preheat temperature: 800 oC Tpre Powder size: D10: 20, D90: 45 m thickness: 30 m Beam power: 40, 80, 120, 160 W Scanning speed: 100~1600 mm/s v Diameter of beam: 39 m S3. Other model parameters Property Value Unit Density diffusivity: 7×102 Mobilities of 6×106 , Activation energy of 2.5×105 ,, Surface energy density of liquid: J/m2
Surface energy density of solid: 1.65 J/m2 Thermal capability of solid: 560 J/(KgK) Thermal capability of liquid: 496 J/(KgK) Thermal conductivity of solid: 20 W/(mK) Thermal conductivity of liquid: 20 W/(mK) Melting point: Tm 1650 oC Latent heat: 3.76E5 J/Kg Absorption Coefficient: 0.4 m1 Table S2. Process parameters used in simulations Property Value Unit Preheat temperature: Tpre 800 oC Powder size: D10: 20, D90: 45 m thickness: 30 m Beam power: 40, 80, 120, 160 W Scanning speed: v 100~1600 mm/s Diameter of beam: 39 m S3. Other model parameters Property Value Unit Density diffusivity: 7×102 Mobilities of , 6×106 Activation energy of ,, 2.5×105 Surface energy density of liquid: J/m2