Chemical/Mechanical Balance Management through Pad Microstructure in CMP Ratanak Yim, CEA-Leti – Process Model Identification for Optimizing Particle-to-Part Selectivity during Ultrasonic Parts Cleaning Osama Khalil, Quantum Clean – Advantages of using RGA as part of Atomically Clean Surface (ACS™) for Sub-10nm Parts Cleaning Process Matthew House, Quantum Clean – Sulfate ion removal by combined UV and bake process Fei Xu, Changzhou Ruize Micro – Particle Clean-Up of Various Filter Media in WEC Chemistry via 20 nm Particle Counting Patrick Connor, Pall – Effective Point of use Filtration of Ultrapure Water for Critical Tools and Processes Glen Sundstrom, Evoqua Water Technologies – Continuous Monitoring of Particles at 20 nm in Critical Semiconductor Process Chemicals Dan Rodier, PMS – Implementing Chemical Cost Saving in 14 nm High Volume Manufacturing Line Tejasvi Sadasivuni, GLOBALFOUNDRIES – Improved Missing Pattern Defects using Megasonic for Hard Mask clean at 14 nm and Beyond Sangita Kumari, GLOBALFOUNDRIES – Dummy Poly Gate Etch Residue Removal Wen Dar Liu, Versum – Indium Bump Liftoff Challenges Tice, MEI –
Chemical/Mechanical Balance Management through Pad Microstructure in CMP – Ratanak Yim, CEA-Leti Process Model Identification for Optimizing Particle-to-Part Selectivity during Ultrasonic Parts Cleaning – Osama Khalil, Quantum Clean Advantages of using RGA as part of Atomically Clean Surface (ACS™) for Sub-10nm Parts Cleaning Process – Matthew House, Quantum Clean Sulfate ion removal by combined UV and bake process – Fei Xu, Changzhou Ruize Micro Particle Clean-Up of Various Filter Media in WEC Chemistry via 20 nm Particle Counting – Patrick Connor, Pall Effective Point of use Filtration of Ultrapure Water for Critical Tools and Processes – Glen Sundstrom, Evoqua Water Technologies Continuous Monitoring of Particles at 20 nm in Critical Semiconductor Process Chemicals – Dan Rodier, PMS Implementing Chemical Cost Saving in 14 nm High Volume Manufacturing Line – Tejasvi Sadasivuni, GLOBALFOUNDRIES Improved Missing Pattern Defects using Megasonic for Hard Mask clean at 14 nm and Beyond – Sangita Kumari, GLOBALFOUNDRIES Dummy Poly Gate Etch Residue Removal – Wen Dar Liu, Versum Indium Bump Liftoff Challenges – Tice, MEI