Written responses 12 – John Amy- Navy HV-HF sort of implies a high dv/dt; this would mean insulation design can be challenging Subhashish Bhattacharya North Carolina State University – Yes, insulation issues and parasitic capacitances of the motor Roger Cooley Northrup Grumman – CM compatibility on system. Passive elements –effects Rajib Datta GE – Protection and qualification for direct MV connection . Geoffrey Dolan Google – We would love to see packaging standardization. Multiple vendors are key to market participation. Current IGBT packages are debilitating to SiC. Krstic Slobodan Corporation –Eaton Yes. Cost, EMI and dV/dt problems, 2nd source for devices Stephen Kuznetsov Raytheon – Reliability and MTBF for SiC compared to conventional 9 kV thyristors and 6 kV IGBTs. Short circuit withstand e.g. 50 kA is important requirement Veli-Matti Leppanen ABB – Reliability concerns. Tim McCoy McCoy Consulting – Cost. Reliability. System implementation tools/knowledge. John Shegirian General Dynamics – Perceived reliability Brij N. Singh - John Deere Inc. Reliability of technology, availability of compatible electric motors and generators, dv/dt and di/dt noise concerns, EMI/EMC issues, lack of packaging knowledge to take effective advantages of high temperature properties of WBG devices Ajith Wijenayake DRS – One of the major issues are common mode issues at high switching frequencies limiting the speed of the SiC device capabilities. Question 3. What advanced VSD performance characteristics are required to achieve system benefits and desired payback estimates?
Written responses – 12 John Amy- Navy HV-HF sort of implies a high dv/dt; this would mean insulation design can be challenging Subhashish Bhattacharya – North Carolina State University Yes, insulation issues and parasitic capacitances of the motor Roger Cooley – Northrup Grumman CM compatibility –effects on system. Passive elements Rajib Datta – GE Protection and qualification for direct MV connection . Geoffrey Dolan – Google We would love to see packaging standardization. Multiple vendors are key to market participation. Current IGBT packages are debilitating to SiC. Krstic Slobodan –Eaton Corporation Yes. Cost, EMI and dV/dt problems, 2nd source for devices Stephen Kuznetsov – Raytheon Reliability and MTBF for SiC compared to conventional 9 kV thyristors and 6 kV IGBTs. Short circuit withstand e.g. 50 kA is important requirement Veli-Matti Leppanen – ABB Reliability concerns. Tim McCoy – McCoy Consulting Cost. Reliability. System implementation tools/knowledge. John Shegirian – General Dynamics Perceived reliability Brij N. Singh - John Deere Inc. Reliability of technology, availability of compatible electric motors and generators, dv/dt and di/dt noise concerns, EMI/EMC issues, lack of packaging knowledge to take effective advantages of high temperature properties of WBG devices Ajith Wijenayake – DRS One of the major issues are common mode issues at high switching frequencies limiting the speed of the SiC device capabilities. Question 3. What advanced VSD performance characteristics are required to achieve system benefits and desired payback estimates?