fan-out wafer-level packaging (fo-wlp), a process that enables ultra-thin, high-density packages, has been around for several years, and the fan-out technology is becoming an industry trend due to increasing market demand for smaller and thinner mobile products. according to the research firm yole développement, the fan-out packaging market is predicted to reach $2.4 billion by 2020, increasing from $174 million in 2014.