2.5d packaging can enable hundreds of thousands of interconnects within a small package space. this packaging technology is used in applications such as high memory bandwidth, network switches, router chips and graphics cards for the gaming market. since 2007, ase has been working with amd to bring 2.5d packaging technology to market. the two companies collaborated on fiji, a 2.5d-based gpu processor designed for extreme gamers, which is small enough to fit a 6-inch pcb and connects 240,000 bumps. in june 2015, fiji was officially launched at the e3 gaming conference.