CUPERTINO, CALIF.--(BUSINESS WIRE)--APPLE® TODAY ANNOUNCED M1 ULTRA, THE NEXT GIANT LEAP FOR APPLE SILICON AND THE MAC®. FEATURING ULTRAFUSION™ — APPLE'S INNOVATIVE PACKAGING ARCHITECTURE THAT INTERCONNECTS THE DIE OF TWO M1 MAX CHIPS TO CREATE A SYSTEM ON A CHIP (SOC) WITH UNPRECEDENTED LEVELS OF PERFORMANCE AND CAPABILITIES — M1 ULTRA DELIVERS BREATHTAKING COMPUTING POWER TO THE NEW MAC STUDIO™ WHILE MAINTAINING INDUSTRY-LEADING PERFORMANCE PER WATT. THE NEW SOC CONSISTS OF 114 BILLION TRANSI
APPLE UNVEILS M1 ULTRA, THE WORLD'S MOST POWERFUL CHIP FOR A PERSONAL COMPUTER