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# CSP Hybrid Socket
### FEATURES
* Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
* For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
* Quick and Easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day.
* Socket lid nests device into socket for a reliable connection.
* ZIF style socket using Aries solderless, Au-plated pressure mount Spring-Probe.
* Special lid designs and/or materials can be quoted.
* Socket easily located, mounted & removed from PCB.
* Signal path during test only 0.077 [1.96].
* 4-point crown insures scrub on solder oxides – consult factory for other available probe styles.
* The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface of the device solder balls.
## Ordering Information
#### Need a Breakout Board?
* BODY MATERIAL: PEEK or TORLON
* 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe)
* ESTIMATED CONTACT LIFE: 500,000 cycles
* COMPRESSION SPRING-PROBES: heat-treated BeCu with 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ min.
  [0.75µ] Ni per SAE AMS-QQ-N-290B
* CONTACT FORCE:
  : 15g per contact on 0.30-0.35mm pitch
  : 16g per contact on 0.40-0.45mm pitch
  : 25g per contact on 0.50-0.75mm pitch
  : 25g per contact on 0.80mm pitch or larger
* SCREWS, ALIGNMENT PINS: Stainless Steel
* INSERTS: Brass per QQ-B-626, Sn/plated
* OPERATING TEMPERATURE: -55ºC to 150ºC [-67º to 302º]
* NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
* TEST PCB MINIMUM DIAMETER “G”…
  : 0.025 [0.64] (large probe 0.80mm pitch and larger)
  : 0.015 [0.38] (small probe 0.50-0.79mm pitch)
  : 0.012 [0.31] (small probe 0.40-0.49mm pitch)
  : 0.009 [0.23] (small probe 0.30-0.39mm pitch)
  : 0.004 [0.10] (small probe 0.20-0.29mm pitch)
* TEST PCB DIA. SPRING-PROBE PAD PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY for DIM. “A” – “S”
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.
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## Can’t Find What You're Looking For?
We can provide you a quote for creating a custom product that fits all of your needs. Let us know exactly what you are looking for and we can make it!
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# BGA Switch-A-Pitch Adapters
* Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints
* Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please  for other pitch requirements)
* Enable the use of standard line and trace spacing
* Eliminate the need for laser-drilled micro vias motherboards
To obtain a quote for a specific adapter, please email a request to info@arieselec.com with the following information:
* Your name, company name, and telephone number
* A drawing or data sheet of the device to be placed on adapter
  (top image)
* A drawing or data sheet of the target footprint for the adapter
  (bottom image)
* A list of any other design parameters or restrictions that must be considered
* The quantity of adapters to be quoted
Available in panelized form, adapter only, or as a turnkey solution with devices mounted. Consult Factory
* BOARD MATERIAL: 0.062 [1.58] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides
* PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD
* SOLDER SPHERES: 63/37 Sn/Pb or Lead-free SAC 305
* TRACE WIDTH/SPACE: 0.003 [0.0762]
* OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Lead-free
* SUGGESTED PCB PAD SIZE: 0.022 [0.559] for 1.27mm pitch; 0.020 [0.51] for 1.00mm pitch
# Oscillator Socket – P/N 1107741 and 1108800
Available in RoHS
* This 4-pin Oscillator Socket (in 14- and 8-position frames) accept standard oscillator packages
* Designed to be end-to-end or side-to-side stackable
* Machine insertable
## Ordering information
| Specify | Choose an option14-Pin (Sn Shell/Au Collet)14-Pin (Sn/Pb Shell/Au Collet)8-Pin (Sn Shell/Au Collet)8-Pin (Sn/Pb Shell/Au Collet)Clear |
| --- | --- |
* BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon
* PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05
* PIN BODY PLATING: is 200µ [1.27µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min
* 4-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM B194-08
* CONTACT PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B
* CONTACT CURRENT RATING: 3 amps
* OPERATING TEMPERATURE: 221°F [105°C]
* INSERTION FORCE: 180g/pin, based on 0.018 [0.46] dia. test lead
* WITHDRAWAL FORCE: 90g/pin, based on 0.018 [0.46] dia. test lead
* NORMAL FORCE: 140g/pin, based on 0.018 [0.46] dia. test lead
* ACCEPTS LEADS: 0.015-0.025 [0.38-0.64] dia., 0.100-0.146 [2.54-3.71] long
* SUGGESTED PCB HOLE SIZE: 0.030 ±0.002 [0.76 ±0.05] dia.
ALL DIMENSIONS IN INCHES [MILLIMETERS]
CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS
ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED
# 0.5mm 8- and 10-Pin MSOP-to-0.300″ DIP Adapter – P/N 1111841-X
## FEATURES
* A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout.
* Available on 0.300 [7.62] centers
| Pin Count | Choose an option8-Pin10-Pin |
| Pin Plating | Choose an optionSn/Pb |
| Option | Choose an optionStandardPanelized Form VersionClear |
* BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides
* PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
* PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
* OPERATING TEMPERATURE: 221ºF [105ºC]
* SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS