text: Normal pressure thermogravimetry (TG) measurements were used to study the sublimation behavior of several volatile metal compounds,
  used as metal precursors in thin film fabrication by chemical vapor phase methods, like atomic layer deposition (ALD) and
  chemical vapor deposition (CVD). The results indicated that dynamic TG measurements may be used to find correct source temperatures
  to be used in an ALD reactor: a good correlation between the source temperatures used in ALD and temperatures corresponding
  to mass losses of 10 and 50% in TG was verified. It was also found that isothermal TG measurements offer a simple way for
  the vapor pressure measurements which otherwise are not trivial for solids with only moderate volatility.