Compression Attached Memory Module
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMM and SO-DIMM which use edge connectors and have been in use for 25 years. CAMM was created to overcome technical limitations of traditional slotted DIMM. The CAMM module allows for shorter traces as compared to SO-DIMM, allowing the memory to be run with less power and at higher speeds. The memory module is pressed and held in place against a bar with land grid array pin contacts which connect to the motherboard. JEDEC Solid State Technology Association (JEDEC) plans to complete CAMM 1.0 specification in H2 2023. A non-standard CAMM module was first shipped in the Dell Precision 7000-series laptops in 2022. Advantages of CAMM include lower thickness, allows for replaceable LPDDR modules, provide faster speeds above 6400 MHz, more capacities up to 128 GB per module and higher bandwidth. Disadvantages are that it cannot be mounted without tools and uses six screws. History 
In April 2022, Dell launched laptops in the Dell Precision 7000-series that used a custom form factor of CAMM for DDR5 SDRAM. In June 2023, ADATA demoed an updated design CAMM memory module, which looks different (and more compact) than Dell's 2022 design. CAMM specification is expected to be finalised in H2 2023. References 

Computer memory form factor
Computer-related introductions in 2022
Dell