Hot air is definitely the right way to do it for SMD&#x2F;BGA, and I find it much easier than through-hole because you don&#x27;t have to solder each pin separately -- just aim the gun at the part and wait for the solder to melt. The surface tension means the part will actually self-align into place over the pads if you get it close enough.<p>BGA is not that much more difficult; look online for videos of the phone repair shops in China which can swap BGA chips in literally minutes.