Nothing too exciting. Having RAM closer to the die is nice, but it&#x27;s still DRAM. Incremental progress rather than a quantum leap, as usual. I see some advantage in customers not needing to lay out high-speed memory on their PCB, which can require multiple design cycles to get right.<p>They&#x27;re achieving this using Intel&#x27;s EMIB silicon bridge technology, but that was apparently already available to them as a fab customer.