Job ID: R-20007276 What you will do - Develop new wafer process modules for SiC wafers (doping, Laser anneal, CVD, etching, cleaning, characterization) - Execute major process development or integration tasks and build up product and process knowledge - Leader of small or medium size process integration or optimization projects - Sub-project leader of process development or integration tasks in complex projects - Build up and maintain knowledge (technical & procedures) and BG internal & external contacts in own field of expertise - Active member in PC&O Process improvement teams - Provide technical mentorship to less experienced engineers What you will need - Master’s degree in Semiconductor Device Physics or Semiconductor Technology and/or Microelectronics - Minimum 3 years’ relevant working experience - Knowledge of semiconductor devices and industrial semiconductor technology - Hands on experience in wafer fab process module developments on furnace equipment - Team player with a strong drive to achieve success - Fluency in German. Good level in English - Willingness to travel internationally (approximately 50% during the first 2 years of service) - Good communication skills, both verbal and in writing Why work for us? - Flexible working hours and possibility of overtime reduction to maintain a Work-Life-Balance - Unlimited employment contract with a competitive salary and supplementary voluntary employee benefits - A wide variety of training courses and career development options - Numerous further benefits, such as retirement provisions, travel allowance for the HVV public transport ticket, company events, sports and leisure activities, employee discounts and even more
(Sr.) Process Integration Engineer (m/f/d) - SiC (Ingenieur/in - Elektrotechnik)