Thus at convergent boundaries, continental crust, made of granite, is created, and oceanic crust is destroyed. Two plates sliding past each other forms a transform plate boundary. Natural or human-made structures that cross a transform boundary are offsetâsplit into pieces and carried in opposite directions. Rocks that line the boundary are pulverized as the plates grind along, creating a linear fault valley or undersea canyon.
About the Seminar. Lamination of Flexible Materials for Packaging is designed to give engineers and others an understanding of lamination processes and the properties of the resultant laminates utilized in flexible packaging. Monolayer flexible materials often fall short in delivering the needed properties.
Semiconductor Packaging Assembly Technology. Introduction. This chapter describes the fundamentals of the processes. used by National Semiconductor to assemble IC devices in. electronic packages. Electronic packaging provides the in-. terconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and. environmental protection to ensure reliability and perfor-. mance. Three fundamental assembly flow processes (Table.