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Normally, structures are expected to be robust to such inevitable manufacturing variations but the bladed disc is an exception â indeed, an extreme exception â and the consequences of these variations, referred to as âblade mistuningâ, can be a disproportionally large variations in resonant response levels from one blade to the next.
Blade dicing is the most common dicing techniques used in the semiconductor industry. In recent years in the continuous improvement and advancement of Copper (Cu)/low-k wafer technology, which involving the inter-layer dielectric (ILD) materials changes from traditional silicon dioxide (SiO2) ILD to a much weaker property in mechanical and adhesion strength of Cu/low-k ILD. This change was pushed by many semiconductor industry participants as there are demands and needs to get low cost, high functioning, fast speed,