Niobium capacitor
The development of solid electrolyte tantalum capacitors began in the early 1950s as a miniaturized, more reliable low-voltage support capacitor to complement the newly invented transistor. The solution found by R. L. Taylor and H. E. Haring of the Bell Labs was based on experience with ceramics. They ground down tantalum to a powder, pressed this powder into a cylindrical form and then sintered the powder particles into a pellet (“slug”) at high temperatures, between 1500 and 2000 °C, under vacuum conditions. These first sintered tantalum capacitors used a non-solid electrolyte not consistent with the concept of solid state electronics. 1952 a targeted search in the Bell Labs for a solid electrolyte by D. A. McLean and F. S. Power led to the invention of manganese dioxide as a solid electrolyte for a sintered tantalum capacitor.
EPROM
Development of the EPROM memory cell started with investigation of faulty integrated circuits where the gate connections of transistors had broken. Stored charge on these isolated gates changed their properties. The EPROM was invented by Dov Frohman of Intel in 1971, who was awarded US patent 3660819 in 1972.
Each storage location of an EPROM consists of a single field-effect transistor. Each field-effect transistor consists of a channel in the semiconductor body of the device. Source and drain contacts are made to regions at the end of the channel. An insulating layer of oxide is grown over the channel, then a conductive (silicon or aluminum) gate electrode is deposited, and a further thick layer of oxide is deposited over the gate electrode. The floating-gate electrode has no connections to other parts of the integrated circuit and is completely insulated by the surrounding layers of oxide. A control gate electrode is deposited and further oxide covers it.