l present designs of optoelectronic multichip module (OE-MCM) structures with high connectively, and low latency designs for small, (three to seven) ensembles of chips. I will demonstrate multiple approaches for scaling these systems to large numbers of devices. I will also present several prototype systems that we have developed in our laboratory.
['Donald M. Chiarulli', 'Steven P. Levitan', 'Matt Robinson', 'Karim Tatah']
Optoelectronic multi-chip modules based on imaging fiber bundle structures