This paper introduces a new technique that enables real-time monitoring and characterization of a production wafer probing process. Using this new technique, probing contact resistance data taken from production wafers has been correlated with wafer yield. Data are presented showing that production wafers are better suited for characterizing probing contact resistance than metalized setup wafers.
['Minh Quach', 'Kim Harper']
Real time in-situ monitoring and characterization of production wafer probing process