This paper presents our effort to predict delamination related IC & packaging reliability problems. These reliability problems are driven by the mismatch between the different material properties, such as thermal expansion, hygro swelling, and/or the degradation of interfacial strength. First of all, a test technique is presented to measure the interfacial strength between packaging materials. Secondly, several reliable non-linear Finite Element models are developed, able to predict the reliability impact of delamination on wire failures, different package structures, and passivation cracks in IC-packages.
['W.D. van Driel', 'M.A.J. van Gils', 'R.B.R. van Silfhout', 'G.Q. Zhang']
Prediction of delamination related IC & packaging reliability problems