A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.
['Stephen Long', 'W. Mark Dorsey', 'André A. Adams', 'G. H. Huff']
Metallization of a polymer substrate for microfluidic-cooled RF laminates