Delaminations are a major concern in plastic encapsulated devices (PED). This paper presents three complementary methods to evaluate the sensitivity of PED to this problem. Analytical models are fast to implement, and permit to derive a comparative evaluation between different packages. To refine the results, finite element models, necessitating longer calculation times are very useful, but need to be validated by real measurements, which can be done with assembly test chips.
['H. Fremont', 'Jean-Yves Delétage', 'Kirsten Weide-Zaage', 'Yves Danto']
How to study delamination in plastic encapsulated devices