This paper presents the effect of creep properties on pressure-induced tin whisker formation. Creep properties of bright SnPb and SnCu finishes were evaluated by using a nanoindentation test. At the early stage of indentation, power law creep has a small scatter in both plating finishes. On the other hands, diffusion creep in SnCu show big scatter than SnPb. This behavior can explain the whisker formation on SnCu.
['Tadahiro Shibutani', 'Qiang Yu', 'Masaki Shiratori']
Effect of Creep Properties on Pressure Induced Tin Whisker Formation