After baking, the cured microfluidic device was removed from its mold, and holes for the fluidic introduction ports including cross flow inlet (CFI) and sample inlet (SI) as well as the oscillation inlets (OSC1 and OSC2), were punched into it using a 0.5 mm outer diameter hole punch (Technical Innovations, Angleton, TX, USA). The outlets were punched using a 3 or 4 mm diameter puncher. The microfluidic device was then bonded by oxygen plasma (Model PDC-001, Harrick Plasma) to a blank layer of PDMS previously spin-coated onto a blank silicon wafer at 1500 rpm for 1 minute and then subsequently bonded to a standard microscope slide (50 × 75 mm, Fisher Scientific).