Thus the photoresist must have a high selectivity and be relatively free from stress when applied in thick layers. The typical choice, poly(methyl methacrylate) (PMMA) is applied to the substrate by a glue-down process in which a precast, high-molecular-weight sheet of PMMA is attached to the plating base on the substrate. The applied photoresist is then milled down to the precise height by a fly cutter prior to pattern transfer by X-ray exposure. Because the layer must be relatively free from stress, this glue-down process is preferred over alternative methods such as casting. Further, the cutting of the PMMA sheet by the fly cutter requires specific operating conditions and tools to avoid introducing any stress and crazing of the photoresist. A key enabling technology of LIGA is the synchrotron, capable of emitting high-power, highly collimated X-rays. This high collimation permits relatively large distances between the mask and the substrate without the penumbral blurring that occurs from other X-ray sources. In the electron storage ring or synchrotron, a magnetic field constrains electrons to follow a circular path and the radial acceleration of the electrons causes electromagnetic radiation to be emitted forward. The radiation is thus strongly collimated in the forward direction and can be assumed to be parallel for lithographic purposes. Because of the much higher flux of usable collimated X-rays, shorter exposure times become possible. Photon energies for a LIGA exposure are approximately distributed between 2.5 and . Unlike optical lithography, there are multiple exposure limits, identified as the top dose, bottom dose, and critical dose, whose values must be determined experimentally for a proper exposure. The exposure must be sufficient to meet the requirements of the bottom dose, the exposure under which a photoresist residue will remain, and the top dose, the exposure over which the photoresist will foam. The critical dose is the exposure at which unexposed resist begins to be attacked. Due to the insensitivity of PMMA, a typical exposure time for a thick PMMA is six hours. During exposure, secondary radiation effects such as Fresnel diffraction, mask and substrate fluorescence, and the generation of Auger electrons and photoelectrons can lead to overexposure. During exposure the X-ray mask and the mask holder are heated directly by X-ray absorption and cooled by forced convection from nitrogen jets. Temperature rise in PMMA resist is mainly from heat conducted from the substrate backward into the resist and from the mask plate through the inner cavity air forward to the resist, with X-ray absorption being tertiary.