Thermal profiling  A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. A thermal profile can be ranked on how it fits in a process window (the specification or tolerance limit). Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. The center of the process window is defined as zero, and the extreme edges of the process window are ±99%. A Process Window Index (PWI) greater than or equal to 100% indicates the profile is outside of the process limitations. A PWI of 99% indicates that the profile is within process limitations, but runs at the edge of the process window. For example, if the process mean is set at 200 °C with the process window calibrated at 180 °C and 220 °C respectively, then a measured value of 188 °C translates to a process window index of −60%. The method is used in a variety of industrial and laboratory processes, including electronic component assembly, optoelectronics, optics, biochemical engineering, food science, decontamination of hazardous wastes, and geochemical analysis. One of the major uses of this method is soldering of electronic assemblies. There are two main types of profiles used today: The Ramp-Soak-Spike (RSS) and the Ramp to Spike (RTS). In modern systems, quality management practices in manufacturing industries have produced automatic process algorithms such as PWI, where soldering ovens come preloaded with extensive electronics and programmable inputs to define and refine process specifications. By using algorithms such as PWI, engineers can calibrate and customize parameters to achieve minimum process variance and a near zero defect rate. In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid. For an effective soldering process, soldering must be carried out under carefully calibrated conditions in a reflow oven. Convection Reflow Oven Detailed Description  There are two main profile types used today in soldering:  Ramp is defined as the rate of change in temperature over time, expressed in degrees per second.