At the cathode, the Cu2+ is reduced to metallic copper by gaining two electrons. The result is the effective transfer of copper from the anode source to a plate covering the cathode. The plating is most commonly a single metallic element, not an alloy. However, some alloys can be electrodeposited, notably brass and solder. Plated "alloys" are not true alloys, i.e. solid solutions, but rather discrete tiny crystals of the metals being plated. In the case of plated solder, it is sometimes deemed necessary to have a "true alloy", and the plated solder is melted to allow the Tin and Lead to combine to form a true alloy. The true alloy is more corrosion resistant than the as-plated alloy. Many plating baths include cyanides of other metals (such as potassium cyanide) in addition to cyanides of the metal to be deposited. These free cyanides facilitate anode corrosion, help to maintain a constant metal ion level and contribute to conductivity. Additionally, non-metal chemicals such as carbonates and phosphates may be added to increase conductivity. When plating is not desired on certain areas of the substrate, stop-offs are applied to prevent the bath from coming in contact with the substrate. Typical stop-offs include tape, foil, lacquers, and waxes. The ability of a plating to cover uniformly is called ""; the better the throwing power the more uniform the coating. Initially, a special plating deposit called a "strike" or "flash" may be used to form a very thin (typically less than 0.1 μm thick) plating with high quality and good adherence to the substrate. This serves as a foundation for subsequent plating processes. A strike uses a high current density and a bath with a low ion concentration. The process is slow, so more efficient plating processes are used once the desired strike thickness is obtained. The striking method is also used in combination with the plating of different metals. If it is desirable to plate one type of deposit onto a metal to improve corrosion resistance but this metal has inherently poor adhesion to the substrate, a strike can be first deposited that is compatible with both. One example of this situation is the poor adhesion of electrolytic nickel on zinc alloys, in which case a copper strike is used, which has good adherence to both. Electrochemical deposition is generally used for the growth of metals and conducting metal oxides because of the following advantages: the thickness and morphology of the nanostructure can be precisely controlled by adjusting the electrochemical parameters; relatively uniform and compact deposits can be synthesized in template-based structures; higher deposition rates are obtained; and the equipment is inexpensive due to the non-requirements of either a high vacuum or a high reaction temperature.