<https://szphoton.com/blogs/glass-core-substrate/reliability-assessment-of-thermocompressed-epoxy-molding-compound-through-glass-via-interposer-architecture-by-the-submodeling-simulation-approach#article>
<http://schema.org/headline>
"Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach"
<https://szphoton.com/blogs/glass-core-substrate/reliability-assessment-of-thermocompressed-epoxy-molding-compound-through-glass-via-interposer-architecture-by-the-submodeling-simulation-approach>