<http://schema.org/description>
"...Minimum Skills/Experience Required:\n* 10+ years of IC package selection , design , layout , and modeling experience\n* 10+ years of Package Design expertise in 2-4 layer laminate and/or non laminate substrate technologies (BGA &amp; LGA)\n\nAdditional Knowledge/Skills/Experience in the following, preferred:\n* Knowledge of assembly and substrate manufacturing processes\n* Experience in package selection of packages in mid to low tier mobile products (phones/tablets)\n* Fundamental understanding of Signa..."^^<http://www.w3.org/2001/XMLSchema#string>
<https://tapwage.com/country/1668284-taiwan/hardware/jobs>