<http://schema.org/description>
"Laboratory will deliver customer-driven solutions to the dynamic wafer fabrication marketplace; includes electroplating processes for bump wafer, through silicon via, copper redistribution layer and copper post applications."^^<http://www.w3.org/2001/XMLSchema#string>
<http://www.pfonline.com/blog/post/enthone-opens-wafer-level-packaging-applications-laboratory>