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Count of semiconductor fabs using 300mm wafers projected to exceed 200 by 2026
At the end of 2021, there were 153 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.
The 300mm wafer fab count increased by 14 in 2021, the most in one year since the same number opened in 2005. There are 10 fabs scheduled to open in 2022, followed by another 13 in 2023 and 10 in 2024. This puts the industry on pace to have more than 200 300mm fab lines in operation by 2026.