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852815, Loctite 852815 Dáileacháin - Electronics-ic.com
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THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE
CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
Thermstrate® TC is a phase change thermal interface material
suitable for use between a heat sink and a variety of heat
dissipating components. This product is supplied as a dry
compound in bar form, packaged in a unique easy to use
applicator, which flows in the installation at the phase change
temperature and conforms to the surface features of the heat
sink and component. Upon flow, air is expelled from the
interface, reducing thermal impedance and the material
performs as a highly efficient thermal transfer medium.
Thermstrate TC is a convenient alternative to die cut preforms.
Custom parts of the equivalent preformed material,
Thermstrate 2000, are available upon request for a wide range
Micro processors, hybrid power modules, solid state relays,
power transistors, power modules, IGBT’s, RF components
etc. Typically used between any heat dissipating electrically
isolated component and a heat sink or thermal solution.
One application of Thermstrate TC results in a compound
coating thickness of approximately 0.25 mils (0.00635mm).
Data for this coating thickness is provided below.
Part Number (Standard) TC-175-125
Phase change temperature 60°C
Volumetric expansion upon phase
Viscosity above phase change
No silicones in the compound formulation.
Thermal Impedance vs Mounting Pressure
The performance of any phase change thermal interface
material will be improved by increasing the mounting pressure
at the interface. The graph below shows the thermal
impedance values generated on an ASTM D5470 platform.
The test block dimensions are 2” x 2”, the finish is 64
microinches and the flatness is .002 inches/inch. The power
level is 80 watts.
The graph above shows the typical performance for
Thermstrate TC when placed between a device and a heat
sink, under a clamp load of 10psi. The temperature at the case
of the device and the heat sink are recorded. During the first
reflow cycle, i.e. prior to phase change, Thermstrate TC
exhibits relatively high thermal impedance. Once the material
has changed phase one time, all subsequent operations will
see the thermal impedance values indicated on the curve
traces which approximately parallel the horizontal axis.
852815 Achoimre na n-ábhar
Technical Data Sheet Thermstrate ® TC November 2002 NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS PRODUCT. PRODUCT DESCRIPTION Thermstrate® TC is a phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a dry compound in bar form, packaged in a unique easy to use applicator, which flows in the installation at the phase chang
TDS Thermstrate TC November 2002 Loctite Electronics Henkel Loctite Corporation, 26941 Cabot Road, Bldg 124, Laguna Hills, CA 92653, U.S.A. U.S.A.: 949.582.6712 Canada: 9 05.814.6511 Brazil: 011.55.11.4143.7000 Loctite is a Trademark of Henkel Loctite Corp. U.S.A. www.loctite.com Operating Temperature Range Tests have confirmed that Thermstrate TC can be used reliably up to 150°C. Surface Conditions Typical interface surface conditions are quoted below: Surface finish 64 microinches or better 1.6 microns or better Surface flatness .002 inches/inch or better .001 cm/cm or better General Infor
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