text: In the Sn-Pb alloys, tensile strength increases with increasing tin content. Indium-tin alloys with high indium content have very low tensile strength.
  For soldering semiconductor materials, e.g. die attachment of silicon, germanium and gallium arsenide, it is important that the solder contains no impurities that could cause doping in the wrong direction. For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin can also be used.
  Various fusible alloys can be used as solders with very low melting points; examples include Fields metal, Lipowitzs alloy, Woods metal, and Roses metal.