text: Silicon has three major advantages over GaAs for integrated circuit manufacture. First, silicon is abundant and cheap to process in the form of silicate minerals. The economies of scale available to the silicon industry has also hindered the adoption of GaAs.
  In addition, a Si crystal has a very stable structure and can be grown to very large diameter boules and processed with very good yields. It is also a fairly good thermal conductor, thus enabling very dense packing of transistors that need to get rid of their heat of operation, all very desirable for design and manufacturing of very large ICs. Such good mechanical characteristics also make it a suitable material for the rapidly developing field of nanoelectronics. Naturally, a GaAs surface cannot withstand the high temperatures needed for diffusion; however a viable and actively pursued alternative as of the 1980s was ion implantation.
  The second major advantage of Si is the existence of a native oxide (silicon dioxide, SiO), which is used as an insulator. Silicon dioxide can be incorporated onto silicon circuits easily, and such layers are adherent to the underlying silicon. SiO is not only a good insulator (with a band gap of 8.9 eV), but the Si-SiO interface can be easily engineered to have excellent electrical properties, most importantly low density of interface states. GaAs does not have a native oxide, does not easily support a stable adherent insulating layer, and does not possess the dielectric strength or surface passivating qualities of the Si-SiO.
  Aluminum oxide (AlO) has been extensively studied as a possible gate oxide for GaAs (as well as InGaAs).
  The third advantage of silicon is that it possesses a higher hole mobility compared to GaAs (500 versus 400 cmVs). This high mobility allows the fabrication of higher-speed P-channel field-effect transistors, which are required for CMOS logic. Because they lack a fast CMOS structure, GaAs circuits must use logic styles which have much higher power consumption; this has made GaAs logic circuits unable to compete with silicon logic circuits.
  For manufacturing solar cells, silicon has relatively low absorptivity for sunlight, meaning about 100 micrometers of Si is needed to absorb most sunlight. Such a layer is relatively robust and easy to handle. In contrast, the absorptivity of GaAs is so high that only a few micrometers of thickness are needed to absorb all of the light. Consequently, GaAs thin films must be supported on a substrate material.
  Silicon is a pure element, avoiding the problems of stoichiometric imbalance and thermal unmixing of GaAs.
  Silicon has a nearly perfect lattice; impurity density is very low and allows very small structures to be built (down to 5 nm in commercial production as of 2020). In contrast, GaAs has a very high impurity density, which makes it difficult to build integrated circuits with small structures, so the 500 nm process is a common process for GaAs.
  Silicon has about three times the thermal conductivity of GaAs, with less risk of local overheating in high power devices.