text: # Magnetic materials e.g. alnico, sendust, Permendur, FeCo, Terfenol-D
  # Superconductors e.g. A15 phases, niobium-tin
  # Hydrogen storage e.g. AB compounds (nickel metal hydride batteries)
  # Shape memory alloys e.g. Cu-Al-Ni (alloys of CuAl and nickel), Nitinol (NiTi)
  # Coating materials e.g. NiAl
  # High-temperature structural materials e.g. nickel aluminide, NiAl
  # Dental amalgams, which are alloys of intermetallics AgSn and CuSn
  # Gate contact/ barrier layer for microelectronics e.g. TiSi
  # Laves phases (AB), e.g., MgCu, MgZn and MgNi.
  The formation of intermetallics can cause problems. For example, intermetallics of gold and aluminium can be a significant cause of wire bond failures in  semiconductor devices and other microelectronics devices.  The management of intermetallics is a major issue in the reliability of solder joints between electronic components.