text: in the following description , reference is made to the accompanying drawings that form a part hereof , and in which is shown by way of illustration specific embodiments in which the described subject matter may be practiced . these embodiments are described in sufficient detail to enable those skilled in the art to practice the described subject matter , and it is to be understood that other embodiments may be utilized and that structural , logical and electrical changes may be made without departing from the scope of the described subject matter . the following description is , therefore , not to be taken in a limited sense , and the scope of the present invention is defined by the appended claims . the functions or algorithms described herein are implemented in software or a combination of software and human implemented procedures in one embodiment . the software comprises computer executable instructions stored on computer readable media such as memory or other type of storage devices . the term “ computer readable media ” is also used to represent carrier waves on which the software is transmitted . further , such functions correspond to modules , which are software , hardware , firmware or any combination thereof . multiple functions are performed in one or more modules as desired , and the embodiments described are merely examples . the software is executed on a digital signal processor , asic , microprocessor , or other type of processor operating on a computer system , such as a personal computer , server or other computer system . an optimal power configuration is realized by selectively decreasing the power consumed by the i / o of a high speed bus device . the bus may be synchronous or asynchronous . short transfer times of high speed busses , such as those operating in the gigahertz range use aggressive edge rates . the output drive of a cmos gate is increased to drive a faster edge rate against a parasitic capacitance ( cp ) of the bus . since the conductor of the bus itself becomes inductive , the high drive strength alone would cause signal quality problems . thevenin terminations may be used on the bus itself to match the signal impedance and limit ringing of the fast signals . fig1 is a block diagram of a system 100 including a synchronous bus 105 according to an example embodiment of the invention . bus 105 , in one embodiment is a synchronous bus that implements a sstl ( series stub terminated logic ) signaling method . bus 105 has a variable value termination resistor 110 coupled to it . bus 105 is used to transmit signals between a controller 115 and a bus device 120 . bus device 120 comprises a driver 125 , such as a cmos dual gate fet . multiple selectable stages of the driver may be used to vary the output power of the driver . the driver 125 is coupled to the bus 105 via a variable drive resistor 130 . a variable clock 135 is coupled to the controller 115 . clock 135 in one embodiment has two different frequencies , which may be referred to as a high setting and a low setting . the high setting provides a higher frequency , such as 533 mhz , and the low setting provides a lower frequency , such as 400 mhz . the controller also controls the values of the variable termination resistor 110 and the variable drive resistor 130 depending on whether the frequency is high or low . in the high setting , the signaling on the bus utilizes high static power . current is continuously sourced to maintain a logic high or “ 1 ”, and constantly sunk to maintain a logic low or “ 0 ”. the current passed from a termination voltage 140 , referred to as vtt may be significant . since some busses are now 64 to 128 bits wide , the amount of power used in output termination can create several watts of power consumption . to reduce the power consumption when lower performance may be appropriate , the clock is set to the low frequency , resulting in a decrease in the number of switching times on the bus . this may be done by controller 115 in one embodiment in response to user commands , or sensed or expected utilization of the bus . the output drive of the bus device 120 may also be decreased to a lower level . this decreases both the ac and dc drive current on the bus . optionally , the bus terminations themselves are changed or even removed so as to remove the dc load component . when the bus device is a dram , during normal data reads , the dram device outputs data to the memory controller in high power mode . the clock is fast . in low power mode , the memory controller is slowed down by the clock , easing the timing expectations on the bus . the dram output drive can be decreased , and the termination loading reduced or eliminated . in one embodiment , the bus is bidirectional . during writes to dram , data flows from the controller to the dram . the memory controller drive current may also be reduced as long as the clocking speed is slow . the lower power mode may be dynamically and reversibly applied . typical stimulus for changing the power consumption of the bus include a manual power conservation being asserted . for example , in a notebook computer , the bus may be set up for high power , high performance while coupled to ac power . lower performance may be utilized when the notebook computer is operating off of battery power . power conservation may be applied in the event that a computer system incorporating the bus and multiple devices is detected as overheating . for example , dram may be added to the bus in a fairly dense manner , with little provision made for proper conduction of heat . this may put an entire computer system at risk . temperature sensors may be used to identify such risk , and apply power conservation by implementing the low power mode . power conservation may also be applied when little bus traffic is observed . fig2 is a block diagram of an example computer system 200 incorporating an embodiment of the invention . system 200 has a central processing unit cpu 205 coupled by a front side bus 210 to a bridge device 215 . in one embodiment , bridge device 215 is a north bridge , and interfaces a controller 220 , such as a memory controller to cpu 205 . in some embodiments , the memory controller 220 is integrated into the cpu itself . the controller 220 is coupled via an interface driver 225 and bus 230 to a bus device , such as dynamic random access memory ( dram ) 235 . in one example embodiment , the dram 235 is a micron inc . ddr - 2 dram . the ddr - 2 dram has “ on die termination ,” with 2 possible termination resistor networks indicated at 240 and 245 . each resistor is approximately 150 ohms in one embodiment . a pair of switches indicated at 250 and 255 , when closed , provides a bus termination that is effectively 75 ohms terminated to vss ( ground ) and to vddq ( the operational voltage of the dram ). when switches 250 and 255 are closed , the resistor network 240 is coupled to the bus , effectively doubling the termination resistance in one embodiment . in further embodiments , the resistor values are other than equal . the operating speed of the memory controller 220 is set by a clock 260 and third switch 265 to either approximately 400 mhz or 533 mhz . these frequencies may be significantly varied for different types of devices and busses . future busses are likely to have even higher operating frequencies available . the operating frequency is related to the speed of switching utilized for high and low states on the bus . higher frequencies use faster switching . in further embodiments , an algorithm 270 provides outputs that are used to control the frequency selection switch 265 , and resistor network switches 250 and 255 . the algorithm may be implemented on many different logic platforms , including cpu 205 or controller 220 . the algorithm may also be used to control a further switch 273 that is used to include a second stage in interface driver 225 . a counter 275 may be used to monitor bus traffic , and provide indications of the amount of bus traffic to the algorithm for use in determining an appropriate frequency of operation . further , a thermistor 280 is optionally placed proximate the bus device 235 to monitor operating temperatures and to potentially slow down the operating frequency to reduce power consumption and correspondingly heat generation . the thermistor 280 provides information about the operating temperature to the algorithm for use in determining the frequency of operation if desired . a further input may be provided externally to the algorithm for directly selecting the frequency of operation , such as by direct user input or other power management algorithms . fig3 is a flow chart example 310 of algorithm 270 configuring the system for a high performance mode . at 320 , the operating speed of the memory controller 220 is at its fast setting . switch 265 is set to the fast clock speed of approximately 533 mhz . at 330 , the memory controller interface driver 225 is enabled for the highest possible output drive by closing switch 273 to engage parallel transistors . at 340 , the thevenin termination inside the dram 235 is set to the highest current drive by closing switches 250 and 255 . this may be done in one embodiment by setting appropriate bits in an extended mode register of the dram to obtain a termination resistance of 75 ohms , or other value depending on the values of resistors used . at 350 , the output drive of the dram may also be set to maximum by setting a corresponding bit in the extended mode register of the dram . fig4 is a flow chart 400 showing operation of the algorithm 270 in configuring the system 200 for low power mode . at 410 , switch 265 is set to the lower frequency , 400 mhz . at 420 , switch 273 is opened , decreasing the output drive of the interface driver 225 by removing one of the parallel transistor stages . at 430 , switches 250 and 255 are opened , increasing the termination source to a 150 ohm load in one embodiment . at 440 , the dram output drive is optionally set to low by removing one or more of the drive stages . the low power mode may be entered as a function of many different factors . the device 235 temperatures may be too high . thermister 280 provides an indication , such as a signal representative of temperature which may be used to determine the device is at an unsafe temperature . the algorithm 270 receives information from the thermister 280 and configures the system 200 for low power mode in accordance with the flow chart 400 . the amount of activity on the bus from the device , such as dram 235 may be either very high or very low . counter 275 measures the amount of dram activity over a duration . if the amount of activity is very high , then dram overheating is suggested , and the algorithm may determine to configure the system for low power mode . if the amount of activity is very low , the algorithm may determine that the system may operate at lower than high performance . if so , the algorithm may place the system in the low power mode to lower performance . the system then becomes more efficient in power consumption without sacrificing overall system performance . this aspect of the algorithm may be useful in large systems with multiple bus devices that are all generating heat . if all such devices were operating in high performance mode , more heat may be generated than can be effectively handled by the system . various manual settings may indicate a desire for a power conservation mode as indicated at 285 . reasons may include detection of battery versus ac line power , lower cpu speed settings , acoustic requirements where less cooling fan noise is desired , or detection of other manual power conservation settings . in some instances , the algorithm 270 may decide that the system temperature is very low and can “ margin ” the timing . when silicon is cool , it will inherently operate faster . the algorithm receives information , such as by reading the thermistor 280 and determines that the termination strength can be reduced — without reducing the speed — of the memory controller . in other words , the algorithm may decide that the system has adequate margin and may use something other than the high output drive to work reliably . the algorithm will then open switches 273 to decrease the drive , and open switches 250 and 255 to decrease the termination strength . the drive strength of the device may also be decreased by the algorithm via the extended mode register . the decrease may be accomplished in the same manner as the decrease in drive strength of the controller interface driver 225 .