text: the reader is again referred to the above - referenced u . s . pat . no . 7 , 535 , 547 if necessary for a more detailed description of the process of resizing lcds . the present invention is directed to the repair of electrical short circuit that may occur during such resizing processes at the resizing cut edge of the target portion ( 5 ) of the fpd . turning first to fig1 , a perspective view is shown of the cut edge ( 55 ) of the target portion ( 5 ) of a resized lcd with substrates ( 20 ), image area ( 40 ), and original lcd seal ( 25 ) intact on the non - cut edges of the target portion ( 5 ). this represents the lcd after it has been cut as part of the resizing process , and thus the cut edge ( 55 ) has not yet been resealed . the edge of the cell is exhibited showing electrical conductor lines ( 30 ) and location of the ground plane ( 35 ). two of the lines ( 30 - s 1 and 30 - s 2 ) are shown shorted to the ground plane ( 35 ). the display is not showing an image in this figure . if it was , the shorts would cause a line in the image due to the inability of the shorted line to control the corresponding pixels connected to it . the left edge in the perspective drawing is one of the edges where the external electronics are attached to control the pixels and show an image . the description of how the image is portrayed is not relevant to this invention . the cut edge ( 55 ) in some cases could be coincident with one of the conductor lines ( 30 ) on the left edge , which would further complicate the nature of potential shorts along the cut edge ( 55 ). for example , the shorts could potentially be so extensive that a narrow sliver of the substrate panel needs to be removed . this might occur when the cut edge ( 55 ) is on top of a conductor line ( 30 ) running parallel to the cut edge ( 55 ). in such situations , after the sliver is removed , the repair process should be repeated from the beginning . the shorted line ( 30 - s 1 ) is an example of a conductor line ( 30 ) that has separated from the substrate ( 20 ) of target portion ( 5 ) sufficiently to bridge the cell gap and make contact with the ground plane ( 35 ). shorted line ( 30 - s 2 ) is an example of a conductor line ( 30 ) that has separated from the waste portion in sufficient length to fold back and bridge the cell gap to make contact with the ground plane ( 35 ). shorted lines may occur in these manners , or in other manners . these shorted lines ( 30 - s 1 and 30 - s 2 ) are examples of the simplest form of the short - circuits to be repaired in accordance with the present invention . as part of the resizing process , the cut edge ( 55 ) is resealed . fig2 is a plan view of the lcd in fig1 , after the lcd has been resealed along the cut edge ( 55 ) with resizing seal ( 45 ). the shorted conductor line ( 30 - s 2 ) is still undesirably present . resizing seal ( 45 ) is shown penetrating in between the substrates ( 20 ) as indicated by dotted line ( 45 a ). the symptoms of the failed pixels associated with the shorted conductor line ( 30 - s 1 ) are symbolically shown as x &# 39 ; s ( 50 ). the x &# 39 ; s ( 50 ) represent a line of pixels or a portion of a line of pixels missing in the image emanating from the cut edge . the original perimeter seal ( 25 ) is shown along the non - cut edges for reference . the image shown in fig2 is a solid color with a line or partial line ( 50 ) not responding to the image commanded . the means for generating an image are not included in fig2 , but would require electrical connections to the electrical conductors ( 30 ) shown in the bottom of the figure . methods of repairing these short circuits will now be described in more detail . turning to fig4 , a flow diagram is shown of a method of repairing shorted lines in a target portion ( 5 ) of a resized fpd , in accordance with the present invention . the method is best performed while the fpd is displaying an image , so the effectiveness of the method can be seen at each step along the way . the method begins at step 400 by obtaining a target portion ( 5 ) of a resized fpd . this typically occurs as part of the overall resizing process , i . e ., by separating a fpd into a target portion ( 5 ) and a waste portion ( not shown ). but the source of the target portion ( 5 ) is not significant , such that this step may include simply being given the target portion ( 5 ) which may have been created by someone else doing a resizing operation . the target portion ( 5 ) of the fpd at this point typically would be operational . once the target portion ( 5 ) is obtained , short circuits are identified at step 410 . identification of a short circuit could be accomplished by electrically exciting the display to show an image on image area ( 40 ). the short ( s ) will exhibit a line of nonresponsive pixels , seen symbolically as x &# 39 ; s ( 50 ) in fig2 and fig3 a . the nonresponsive pixels will not actually appear as x &# 39 ; s , but rather as pixels in the image display area ( 40 ) not responding to the image commanded . the location of the short can be found by observing the intersections of the display image line of non - responding pixels ( 50 ) and the resized cut edge ( 55 ). a failed line of pixels ( 50 ) may fade in and out as the electrical current heats the point of contact and burns open the short . the length of the line of affected pixels ( 50 ) depends , in part , of the conductivity of the short . if a short circuit has been identified at step 410 , the method proceeds to step 420 at which the short is repaired . here , the repair may be by applying 1 ) a mechanical force to remove material to expose the short at a minimum or open the short ; 2 ) a high voltage to the electrical conductive materials associated with the short to fuse open the short ; 3 ) a chemical etchant to etch away material constituting the short ; 4 ) a thermal effect to burn open the short ; 5 ) other means to open the short such as re - cutting the panel to remove the portion of the panel with the short ; or any combination of the aforementioned , sequentially and / or substantially simultaneously . each such repair is performed in a manner sufficient to open the short circuit to cause the image to be complete and sufficiently to ensure that the short does not reoccur . if no short circuits are identified at step 410 ( or after one or more have been identified , and then repaired at step 420 ), the method proceeds to step 430 at which optionally the display is stress tested for further reliability , and then if applicable to step 440 at which the exposed area ( 65 ) of the repaired short is resealed . step 420 may also be performed to a cut edge ( 55 ) that has already been resealed with resizing seal ( 45 ) to ruggedize the resizing seal ( 45 ), even if image defects are not exhibited initially . for example , the resizing seal ( 45 ) may be scrubbed with a chemical - etchant - impregnated material such as a sanding block wetted with an acidic etchant in a manner sufficient to remove exposed electrodes from the resizing seal , and to stress the resizing seal ( 45 ). the sanding block may then be used to sand the full length of the resealed edge of the resized display three or four times with moderate pressure . the moderate pressure is sufficient to remove a portion of the sealant with each stroke . also , the resizing seal ( 45 ) can be stress tested , and exposed electrodes removed , by simply rubbing the resizing seal ( 45 ) with a chemical etchant . exposed electrodes should be removed because they could cause a short circuit at some later time in the fpd . this can be done using a cotton swab wet with the etchant agent . the seal line may be further stressed by rubbing it with a metal foil while displaying an image on the display , to see if the symptoms of a short occur . if there are exposed electrodes left on the resizing seal ( 45 ), the metal foil will short them during contact , and thus cause pixel failures . in that case , further etching should be done to better ruggedize the seal , and if necessary the resizing seal ( 45 ) could be replenished at the affected area . the seal line may be further stressed while being cleaned with wet tissue with alcohol and water . stressing the display can be accomplished in many ways , including but not limited to rubbing the resized edge ( 55 ) with a wet and dry cotton swab or glass rod or wooded stick , rubbing the resized edge with metal conductive foil , flexing the target panels ( 20 ), and / or environmental cycling the lcd in a chamber in temperature and humidity over the required operating range and storage envelope . step 440 may be applicable , for example , if the resizing seal ( 45 ) had already been applied to the cut edge ( 55 ) prior to arriving at step 420 , and at step 420 the resizing seal ( 45 ) was disturbed . this situation is seen in fig3 b . additional stress testing may occur at step 450 , after the resealing step at 440 . the seal may be stressed by flexing , for example , to cause near shorts to occur thus exposing weak points that may be shorted during the normal handling , usage and environmental variations that the display will be exposed to during its operational life . fig4 shows this process occurring once for all short circuits in parallel , but the process may be performed on a single short at a time . during stress testing at step 430 , if the stress testing fails ( i . e ., one or more shorts are identified ) as indicated by the “ n ” path at decision 435 , the process may return back to step 420 to repair the short ( s ) identified as part of the stress testing . during stress testing at step 450 , if the stress testing fails as indicated by the “ n ” path at decision 455 , the process may likewise return back to step 420 to repair the short ( s ) identified as part of the stress testing . shorts typically do not recur if they pass a stress test . for further assurance the short will not reappear and cause a pixel image failure symptom , or a new short will not appear and cause a pixel image failure , any resizing seal ( 45 ) removed is replenished by applying a protective material ( 60 ) after removal of the short , as shown in fig3 c and at step 440 of fig4 . as previously stated , any exposed area ( 65 ) of the resizing seal ( 45 ) exposed by the process should be covered to protect and prevent a recurrence of the short and insure the integrity of the seal ( 45 ) on the target portion ( 5 ). if the exposed area ( 65 ) is not covered , shorts may be induced by later disturbances such as physically rubbing the repaired area , or contamination with conductive materials . further , the original display seal ( 25 ) itself may otherwise be compromised and need to be reconstituted . also as previously stated , additional ( or first - time ) stress testing may occur after step 440 . the stress test should include the entire cut edge even if no symptoms of shorts are exhibited at least once in the process . before or after the resizing seal ( 45 ) is replenished with protective material ( 60 ), it can be stress tested by rubbing the seal bead ( 45 ) with a wet cotton swab and / or a dry cotton swab ( such as a q - tip swab ) three or more times and a metal foil three or more times . a suitable wetting agent is isopropyl alcohol . a suitable metal foil is aluminum foil . any marginal situation will be flexed , shorted or made conductive by the presence of an applicator &# 39 ; s wetting agent and by rubbing motion pressure to apply the agent . the symptoms of intermittent shorts , if any , would then occur , thus allowing them to be identified . the intermittent shorts may then be eliminated by the methods described herein . this sequence should be repeated until the intermittent shorts do not recur . marginal shorts could be readdressed by the same methods and retested and re - stressed until all symptoms of shorts are permanently removed . the stress test may also include environmental testing by , for example , cycling the panel thermally and with humidity . such a stress test would be done if the situation warranted a high degree of confidence that shorts would not reoccur . further , the panel could be flexed along the cut edge ( 55 ) to induce slight motion in the internal aspects of the seal . if intermittent shorts should occur , then step 420 could be repeated to achieve further separation of the shorting elements . the repair process at step 420 will now be described in more detail . at step 420 , an example of mechanical force to open a short circuit is to mechanically remove material at the cut edge ( 55 ) in the vicinity of the short as exhibited by the failed line of pixels ( 50 ) in the image area ( 40 ) of the target portion ( 5 ). if the short is identified by stress testing after the resizing seal ( 45 ) is applied , then in most cases the failed line ( 50 ) can be fixed by simply scratching the surface of the resizing seal bead ( 45 ) with a sharp instrument . to remove more severe shorts , the resizing seal bead ( 45 ) may be scraped away and , in the most - severe cases , the substrate ( 20 ) may need to be removed to reach and open the short . when removing one short , another short may be precipitated as exhibited by the image . the mechanical action may be repeated until all of the failed lines of pixels are restored if possible . a specific mechanical way to open a short circuit in a target portion ( 5 ) of a resized lcd is by grinding down the resizing seal bead ( 45 ) with a high - speed grinder right at the point where the failed line of pixels ( 50 ) intercepts the cut edge ( 55 ) of the target portion ( 5 ). a dremel tool with a cutting or grinding blade works well for this function . the blade is held perpendicular to the resizing seal bead ( 45 ) at the point to be repaired . while the dremel tool is running at high speed , the surface of the bead ( 45 ) is lightly contacted . typically the short is removed in an instant with a small penetration into the bead ( 45 ). for more difficult shorts , as shown in fig3 b , the penetration into the bead ( 45 ) is deeper based upon the effect seen in the displayed image . in difficult cases the grinding action may penetrate into the glass substrate ( 20 ) before the short is extinguished and the repair is completed . in more severe cases , the short cannot be removed by mechanical means . while removing one short by the mechanical means another short may occur . there is a high probability that the short will return if only mechanical means are used as is the state of the art . the electrical , chemical , thermal , and / or other methods should thus be used alone , or in combination with each other and / or mechanical means , to achieve greater assurance that the short is removed and will not return . an example of using electrical means is to apply an excess electrical voltage to the suspect electrodes ( 30 ). since the shorts typically have a higher resistivity than the conductor lines , when a current limited high voltage ( a . c . or d . c .) up to ten times the normal voltage is applied between the suspect lines ( 30 ) and / or between the lines ( 30 ) and the ground plane ( 35 ) as applicable , the shorts open like a fuse in an electrical circuit . the conductive metals turn to oxides when fused open and are instantly non - conductors . the electrical fusing process can be used without any other adjunct action such as mechanical or chemical . an example of using a chemical means is to apply an etching chemical such as hydrochloric acid mixed approximately three to one with nitric acid . in some cases , even a small amount of citrus juice such as grapefruit juice may be sufficient . a preferred method is to first open the sealant at the location of the short mechanically and then dab the acid along the cut edge ( 55 ) of the target portion ( 5 ) at the point of the short . the short may disappear with the mechanical action , but the acid etch will cause the shorting metals to be separated further . since the conductive lines ( 30 ) are typically made of thin film metals such as aluminum , molybdenum , etc ., the conductor lines ( 30 ) can be etched back from the cut substrate edge ( 55 ) to the point where they are no longer in contact with each other or other conductors in the immediate area . this may be done before the target portion ( 5 ) is resealed at step 440 , because after resealing , the chemical would have to then penetrate the protective material ( 60 ) if applicable , and the resizing seal ( 45 ), unless the short extended beyond them . the chemical may be applied by dabbing with a glass rod wetted with the acid or a wooden stick wetted with the acid . the acid should be washed away after a about a minute with a water rinse , by for example , using a cotton swab followed with an isopropyl alcohol cleaning . the short attended to by this series of operations should be completely resolved and this short is most likely ready to be repaired in step 440 . the most effective method using the chemical method is to apply it simultaneously while sanding the seal mechanically . as the mechanical action opens the short or potential short area , the chemical etches the electrodes further than can be achieved by simple mechanical means . this dual action gives an increased margin of separation of the electrodes . once the electrode is exposed by the mechanical action it is immediately etched away deep into the seal material that directly minimizes the degree of mechanical action needed . the combination of mechanical abrasion and chemical etching is more effective than either one alone or in sequence . an example of using thermal means is to heat the local area of the short with a soldering iron or laser beam to thermally melt the electrodes within the adhesive and / or glass until the short symptoms are removed . the method of opening electrical lines by a laser beam is well - known in the fpd industry . the thermal method may be preferred in situations wherein the short is in between the substrates ( 20 ). as previously mentioned , multiple forces may be applied substantially simultaneously at step 420 , such as : mechanical and electrical ; mechanical and chemical ; mechanical and thermal ; mechanical , electrical and chemical ; mechanical , electrical and thermal ; mechanical , chemical and thermal ; mechanical , electrical , chemical , and thermal . an example of using mechanical and chemical forces substantially simultaneously will now be described . at step 420 , wet an abrasive sanding block of grit approximately 220 with hcl and hno 4 ( aqua regia ) diluted approximately 4 : 1 with water . then scrub the surface of the resized seal bead three or more times . where a “ line - out ” ( 50 ) exists , scrub the seal edge with the sanding block using moderate hand pressure until the line is restored . a light touch with a dremel grinding tool or razor blade may be used if necessary to restore the “ line - out .” let the lcd stand for a few seconds to a minute to allow time for the acid to etch away exposed conductors . this sequence may be used when there is no initial short to insure that any undesirable electrodes are removed . then for the first stress test at step 430 , rub the seal with aluminum foil to stress the seal . rub the seal with the aluminum foil at least three times using moderate finger pressure . clean the seal with a tissue wetted with about 91 % isopropyl alcohol until the seal is cleansed of any aluminum oxide and other byproducts from the acid treatment . the aluminum oxide stains the tissue black . it may take several rubbings using moderate finger pressure to remove the black aluminum oxide . when the tissue is finally clear of any discoloration after rubbing the seal , clean again with a new clean tissue wetted with isopropyl alcohol using moderate finger pressure . if any “ line - out ” still appears or reappears , repeat the process of repair ( 420 ) and stress test ( 430 ) at the area of interest . if the seal is diminished from the application of this method , it may need to be replenished with protective material ( 60 ). the replenished area of the seal may require further stress testing and repair . turning now to fig3 , there is shown a series of close - ups to help understand the methods described herein . fig3 a shows the conductor line ( 30 - s 2 ) shorted to the ground plane ( 35 ) as seen in fig2 , and within the resizing seal bead ( 45 ). fig3 b shows the shorted line ( 30 - s 2 ) of fig3 a after being open using methods described herein . for example , a mechanical force could have been applied to cut through the resizing seal bead ( 45 ) and the conductor ( 30 - s 2 ). or the mechanical force could have been used to cut only partially through the resizing seal bead ( 45 ), or through the resizing seal bead ( 45 ) only , or through the resizing seal bead ( 45 ) and only partially through the conductor ( 30 - s 2 ). in these later cases , the short could have been opened after the initial mechanical force by using electrical , chemical , and / or thermal techniques described herein . fig3 c shows the opened short line ( 30 - s 2 ) with the resizing seal bead ( 45 ) replenished using a protective material ( 60 ) to cover the area adjacent the repaired short circuit ( 30 - s 2 ). protective material ( 60 ) may be the same as sealant used to seal the cut edge ( 55 ), during the original resizing process , or it may be another dielectric . the criteria for success in the process is that the symptoms of a failed line of pixels ( 50 ) in the image caused by a short at the cut edge ( 55 ) do not reappear permanently or intermittently ( and that symptoms of no other failed line of pixels appear ) during a stress test at the level that the display will see environmentally or mechanically during its operation .