text: various illustrative embodiments of the invention are described below . in the interest of clarity , not all features of an actual implementation are described in this specification . it will of course be appreciated that in the development of any such actual embodiment , numerous implementation - specific decisions must be made to achieve the developers &# 39 ; specific goals , such as compliance with system - related and business - related constraints , which will vary from one implementation to another . moreover , it will be appreciated that such a development effort might be complex and time - consuming , but would nevertheless be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure . the present subject matter will now be described with reference to the attached figures . various structures , systems and devices are schematically depicted in the drawings for purposes of explanation only and so as to not obscure the present disclosure with details that are well known to those skilled in the art . nevertheless , the attached drawings are included to describe and explain illustrative examples of the present disclosure . the words and phrases used herein should be understood and interpreted to have a meaning consistent with the understanding of those words and phrases by those skilled in the relevant art . no special definition of a term or phrase , i . e ., a definition that is different from the ordinary and customary meaning as understood by those skilled in the art , is intended to be implied by consistent usage of the term or phrase herein . to the extent that a term or phrase is intended to have a special meaning , i . e ., a meaning other than that understood by skilled artisans , such a special definition will be expressly set forth in the specification in a definitional manner that directly and unequivocally provides the special definition for the term or phrase . the present disclosure is directed to various methods of forming asymmetric spacers on a variety of different structures that may be formed on an integrated circuit product . as will be readily apparent to those skilled in the art upon a complete reading of the present application , the methods disclosed herein may be used in forming integrated circuit products that employ a variety of devices and technologies , e . g ., nmos , pmos , cmos , etc ., and they may be readily employed in forming a variety of integrated circuit products , including , but not limited to , asic &# 39 ; s , logic devices , memory devices , etc . with reference to the attached drawings , various illustrative embodiments of the methods disclosed herein will now be described in more detail . fig1 a depicts an illustrative integrated circuit product or device 10 at an early stage of fabrication . the device 10 is formed in and above an illustrative semiconductor substrate 12 . the substrate 12 may have a variety of configurations , such as the depicted bulk silicon configuration . the substrate 12 may also have a silicon - on - insulator ( soi ) configuration that includes a bulk silicon layer , a buried insulation layer and an active layer , wherein semiconductor devices are formed in and above the active layer . the substrate 12 may also be made of materials other than silicon . thus , the terms “ substrate ” or “ semiconductor substrate ” should be understood to cover all forms of semiconductor structures and all semiconductor materials . also depicted in fig1 a are a plurality of illustrative structures 13 positioned above the substrate 12 . the structures 13 depicted herein are intended to be schematic and representative in nature , as the size , shape , purpose , use , function , configuration and / or materials of construction used in the structures 13 may vary depending upon the particular application . in one illustrative embodiment , the structures 13 may be comprised of illustrative gate structures 14 for various transistor devices that will be formed in and above the substrate 12 or they may be residual portions of a hardmask layer . such transistor structures would typically be electrically isolated by forming a trench isolation structure ( not shown ) in the substrate 12 . in the depicted example , the structures 13 also include a gate cap layer 16 . the illustrative gate structures 14 generally include an illustrative gate insulation layer 14 a and one or more conductive gate electrode layers 14 b . the gate cap layer 16 , which may be made of a material such as silicon nitride , is positioned above each of the gate structures 14 . the gate structures 14 depicted herein are intended to be schematic and representative in nature , as the materials of construction used in the gate structures 14 may be different depending upon the particular application . the gate insulation layer 14 a may be comprised of a variety of materials , such as silicon dioxide , silicon oxynitride , a high - k ( k value greater than 7 ) insulating material , etc . the gate electrode layer 14 b may be comprised of one or more layers of conductive materials , such as polysilicon , amorphous silicon , a metal , etc . the structures 13 depicted in fig1 a may be formed by performing a variety of known techniques . for example , the layers of material that make up the structures 13 may be initially blanket - deposited above the substrate 12 . thereafter , one or more etching process are performed through a patterned mask layer ( not shown ) to define the basic structures 13 depicted in fig1 a . next , as shown in fig1 b , a conformal deposition process may be performed to form an etch stop or protection liner 18 across the device 10 . the protection liner 18 may be comprised of a variety of different materials , e . g ., silicon dioxide , silicon nitride , etc ., and it may be formed by performing , for example , a chemical vapor deposition ( cvd ) or atomic layer deposition ( ald ) process . the thickness of the protection liner 18 may vary depending upon the particular application , e . g ., about 1 - 3 nm . in some cases , the protection layer 18 may not be required . thereafter , with continuing reference to fig1 b , another conformal deposition process may be performed to form an undoped spacer material layer 20 on the protection layer 18 . the undoped spacer material layer 20 may be comprised of a variety of different materials , e . g ., undoped amorphous silicon , etc ., and it may be formed by performing , for example , a cvd or ald process . the thickness of the undoped spacer material layer 20 may vary depending upon the particular application , e . g ., about 5 - 6 nm . it should be noted that , by referring to the spacer material layer 20 as being “ undoped ,” it is only meant that no intentional steps have been taken to intentionally add dopant materials to the initially undoped spacer material layer 20 . next , as shown in fig1 c , an angled ion implantation process 22 is performed to form regions of doped spacer material 22 a in portions of the undoped spacer material layer 20 . note that , due to the angle of the implant process 22 , not all of the undoped spacer material layer 20 is implanted with the dopant material used in the implant process 22 . the details of the ion implantation process 22 , such as the material implanted , the implant dose , implant angle and implant energy , may vary depending on the particular application . in one illustrative embodiment , the angled ion implantation process 22 may be performed at an implant angle 22 b that falls within the range of about 5 - 45 degrees . in one example , the angled ion implantation process 22 uses , for example , boron difluoride , boron or carbon , etc ., at a dopant dose that ranges from about 1e 14 - 1e 15 ions / cm 2 , at an energy level that ranges from about 1 - 20 kev . then , as shown in fig1 d , an etching process 24 is performed to selectively remove the portions of the undoped spacer material layer 20 that were not implanted with the dopant materials during the angled ion implantation process 22 . in general , the undoped portions of the undoped spacer material layer 20 will etch at a faster rate than the regions of doped spacer material 22 a . during the etching process 24 , the protection liner 18 protects the structures 13 and the substrate 12 . in one illustrative embodiment , the etching process 24 may be a wet etching process that is performed with an etchant such as , for example , ammonia , koh or tmah . then , as shown in fig1 e , an anisotropic etching process 26 , such as a dry reactive ion etching process , is performed to remove the horizontally positioned portions of the remaining regions of doped spacer material 22 a . this etching process results in the definition of the asymmetric spacers 28 comprised of the doped spacer material positioned adjacent one side of the structures 13 . depending upon the particular application , the spacer 28 may or may not actually contact the structure 13 . fig1 f depicts an optional process operation that may be performed to convert the spacer 28 to an oxide material . more specifically , in the case where the spacer 28 is made of a doped amorphous silicon , a heating process 30 may be performed to convert a portion or all of the spacer 28 to an oxide material 28 x ( complete conversion is depicted in fig1 f ). the parameters of the oxidizing heating process may vary depending upon the particular application and the available thermal budget . the heating process 30 may be performed in a rapid thermal anneal chamber or in a traditional furnace . fig2 a - 2c are plan views depicting various illustrative examples of possible arrangements of one or more asymmetric spacers 28 that may be formed adjacent an illustrative structure 13 using the novel methods disclosed herein . in the illustrative embodiments shown in fig2 a - 2c , the structure 13 may be a gate electrode structure for a transistor that extends in a gate width ( gw ) and gate length ( gl ) direction . in the embodiment shown in fig2 a , a single angled ion implantation process 22 was performed in the direction indicated that , with the other processing described above , resulted in a single asymmetric spacer 28 positioned adjacent to only one side of the structure 13 . in the embodiment shown in fig2 b , a single angled ion implantation process 22 was performed in the direction indicated that , with the other processing described above , resulted in asymmetric spacers 28 positioned adjacent to only two sides of the structure 13 . in the embodiment shown in fig2 c , first and second angled ion implantation processes 22 , 22 x were performed in the directions indicated that , with the other processing described above , resulted in asymmetric spacers 28 positioned adjacent to only three sides of the structure 13 . from the foregoing , it should be clear that the novel methods disclosed herein provide device designers with great flexibility in terms of forming asymmetric spacers at specific locations adjacent to selected portions of a structure formed when forming an integrated circuit product . the particular embodiments disclosed above are illustrative only , as the invention may be modified and practiced in different but equivalent manners apparent to those skilled in the art having the benefit of the teachings herein . for example , the process steps set forth above may be performed in a different order . furthermore , no limitations are intended to the details of construction or design herein shown , other than as described in the claims below . it is therefore evident that the particular embodiments disclosed above may be altered or modified and all such variations are considered within the scope and spirit of the invention . accordingly , the protection sought herein is as set forth in the claims below .