text: referring to fig1 for an embodiment of the present invention , a two - stage packaging method s 100 of image sensors includes the steps of : providing a substrate ( s 10 ); fixing an image sensor chip on the substrate ( s 20 ); fixing a transparent board on the image sensor chip ( s 30 ); electrically connecting the image sensor chip and the substrate ( s 40 ); forming a first encapsulant layer ( s 50 ); and forming a second encapsulant layer ( s 60 ). referring to fig1 , fig2 a , fig2 f , and fig3 , the two - stage packaging method begins by providing a substrate ( s 10 ), wherein the substrate 10 has a first surface 11 and a second surface 12 , and the second surface 12 faces away from the first surface 11 . the substrate 10 is made of plastic or ceramic . the substrate 10 is further provided with a plurality of electrical contacts 13 fixed on the second surface 12 . the electrical contacts 13 enable the circuit on the substrate 10 or on the image sensor chip 20 to make electrical connection with components outside the substrate 10 . referring to fig1 , fig2 b , fig2 f , and fig3 , the step of fixing an image sensor chip on the substrate ( s 20 ) is carried out as follows . the image sensor chip 20 is fixed on the first surface 11 of the substrate 10 . the image sensor chip 20 has a sensing area 21 as an input area for signals sensed by the image sensor chip 20 . the image sensor chip 20 is one of a complementary metal - oxide - semiconductor ( cmos ) image sensor chip and an integrated circuit having a cmos image sensor chip . referring to fig1 , fig2 c , fig2 f , and fig3 , the step of fixing a transparent board on the image sensor chip ( s 30 ) involves connecting a transparent board 30 to the image sensor chip 20 via an intermediate 40 so as to form a sealed space 50 between the transparent board 30 and the image sensor chip 20 . the intermediate 40 surrounds the boundary of the sensing area 21 such that the sensing area 21 is enclosed in the sealed space 50 . referring to fig2 c - 2f and fig3 , the transparent board 30 is formed of one of transparent glass , transparent acrylic , and transparent plastic . a signal sensed by the image sensor chip 20 penetrates the transparent board 30 and is received by the sensing area 21 . the intermediate 40 is formed of one of glass , plastic , a polyimide , and an amide resin , or the intermediate 40 is formed by molding a liquid crystal polymer ( lcp ). if the intermediate 40 is formed of any of the foregoing materials , the upper end and the lower end of the intermediate 40 can be tightly connected , through an adhesive 41 , to the transparent board 30 and the image sensor chip 20 respectively . as shown in fig3 , the intermediate 40 may alternatively be one of a heat - curable adhesive , a uv - curable adhesive , an adhesive polyimide , and an adhesive amide resin . in that case , the transparent board 30 can be adhered to the image sensor chip 20 through the curing process of the intermediate 40 . if the intermediate 40 is one of a heat - curable adhesive and a uv - curable adhesive , the intermediate 40 and the image sensor chip 20 can be tightly connected without application of the adhesive 41 . referring to fig2 c , fig2 f , and fig3 , the height h of the sealed space 50 formed by the intermediate 40 , the transparent board 30 , and the image sensor chip 20 is the vertical distance between the transparent 30 and the image sensor chip 20 . the height h of the sealed space 50 can be determined according to the sensing requirement of the image sensor chip 20 and be achieved by selecting an intermediate 40 of the appropriate size in the step of fixing a transparent board on the image sensor chip ( s 30 ). referring to fig2 c and fig2 f , the height h of the sealed space 50 may range from 100 um to 500 um ( um = micro meter ; i . e ., 10 − 6 meter ). reference is now made to fig1 , fig2 d , fig2 f , and fig3 . to perform the step of electrically connecting the substrate and the image sensor chip ( s 40 ), the two connecting ends 61 of each of a plurality of bonding wires 60 are respectively connected to the substrate 10 and the image sensor chip 20 so as to electrically connect the substrate 10 and the image sensor chip 20 . the bonding wires 60 and the connecting ends 61 are located outside the intermediate 40 ; that is to say , the bonding wires 60 and the connecting ends 61 are located outside the sealed space 50 . the bonding wires 60 are electric wires made of gold ( au ), a mixture of gold and silver ( ag ), or a mixture of gold and copper ( cu ). referring to fig1 , fig2 e , fig2 f , and fig3 , the step of forming a first encapsulant layer ( s 50 ) is executed in the following manner . a first encapsulant covers the bonding wires 60 , the connecting ends 61 , the top surface of the image sensor chip 20 outside the intermediate 40 , and the first surface 11 excluding the area occupied by the image sensor chip 20 . the first encapsulant is then cured to form a first encapsulant layer 70 , wherein the first encapsulant layer 70 covers a portion of the lateral sides of the transparent board 30 and has a top surface lower than the top surface of the transparent board 30 . the first encapsulant may be an epoxy . the first encapsulant is applied by a dispensing process such that the first encapsulant covers the bonding wires 60 , the connecting ends 61 at both ends of each bonding wire 60 , the top surface of the image sensor chip 20 outside the intermediate 40 , and the first surface 11 excluding the area occupied by the image sensor chip 20 . as the first encapsulant maintains a liquid and gluey substance during its application , and the epoxy is not required to be of the same height as the transparent board 30 , the pressure resulting from the first encapsulant is relatively low , and because of the fluid property , the impact of the pressure on the bonding wires 60 , the two connecting ends 61 of each bonding wire 60 , or the image sensor chip 20 is relatively small . after the first encapsulant is cured and forms the first encapsulant layer 70 , all the components in first encapsulant layer 70 are protected , wherein the components refer to the bonding wires 60 , the connecting ends 61 of each bonding wire 60 , the top surface of the image sensor chip 20 outside the intermediate 40 , and the first surface 11 excluding the area occupied by the image sensor chip 20 . refer again to fig1 , fig2 f , and fig3 . to perform the step of forming a second encapsulant layer ( s 60 ), a second encapsulant is used to cover an outer portion of the first encapsulant layer 70 . the second encapsulant is then cured to form a second encapsulant layer 80 , wherein the second encapsulant layer 80 covers the remaining portion of the lateral sides of the transparent board 30 . moreover , the top surface of the second encapsulant layer 80 is as high as and coplanar with the top surface of transparent board 30 . referring to fig2 e , fig2 f , and fig3 , the lateral sides of the first encapsulant layer 70 and the lateral sides of second encapsulant layer 80 are made flush with the lateral sides of the substrate 10 . as the second encapsulant covers the aforesaid outer portion of the first encapsulant layer 70 only after the first encapsulant is cured and forms the first encapsulant layer 70 , the components covered and protected by the first encapsulant layer 70 will not be affected by the pressure resulting from the step of forming a second encapsulant layer ( s 60 ). the second encapsulant may be a heat - curable encapsulant and may vary in material or color depending on application requirements . when implementing the two - stage packaging method s 100 of image sensors , the second encapsulant may be a black or opaque material in order not to interfere with sensing . in the two - stage packaging method s 100 of image sensors , the two - stage formation of the first encapsulant layer 70 and the second encapsulant layer 80 greatly reduces the adverse effects of the encapsulant forming pressure on the bonding wires 60 or the image sensor chip 20 . consequently , not only can the yield , quality , and production of the image sensor packaging process be increased , but also the manufacturing costs can be lowered . the embodiments described above are intended only to demonstrate the technical concept and features of the present invention so as to enable a person skilled in the art to understand and implement the contents disclosed herein . it is understood that the disclosed embodiments are not to limit the scope of the present invention . therefore , all equivalent changes or modifications based on the concept of the present invention should be encompassed by the appended claims .