text: although the following detailed description contains many specifics for the purposes of illustration , anyone of ordinary skill in the art will appreciate that many variations and alterations to the following details are within the scope of the invention . accordingly , the following preferred embodiments of the invention are set forth without any loss of generality to , and without imposing limitations upon , the claimed invention . first , the construction details of the heat dissipating panel itself are described , followed by a detailed description of the lighted heat dissipating panel apparatus . the heat dissipating panel may be comprised of a structural core in combination with a filler material . the structural core may take a variety of shapes and may be fabricated from a number of different materials as described below and functional equivalents thereof . the filler may be a number of materials as described below , such as glass - carbon material , and the functional equivalents thereof . a preferred embodiment of the heat dissipating panel 100 is illustrated in fig6 . this embodiment is comprised of a expanded honeycomb aluminum structural core 600 comprising a plurality of cells 603 , wherein said cells 603 are essentially filled with filler 604 which is preferably carbon composite material in this preferred embodiment , but may be glass - carbon or any other material or combination that provides structural qualities such that the finished panel exhibits desired qualities of stiffness , weight , and thermal conductivity for the intended application . in a preferred embodiment , the aluminum is expanded recycled aluminum . heat dissipating panel 100 has an upper surface 601 and a lower surface 602 . in the context of the present invention , “ essentially filled ” means that the carbon composite material occupies the cells 603 , but there may be voids within said filler 604 . it is not therefore a limitation of the present invention that said filler 604 be free of voids , bubbles , or other gaps or open spaces within cells 603 . while the aforementioned preferred embodiment of the heat dissipating panel 100 is comprised of an expanded honeycomb aluminum core structure essentially filled with carbon composite , it will be appreciated that there exist a number of variations in the shape of the core structure that will be effective for the purposes of the present invention . for example , in the case where the core structure is an expanded structure , the cross section of the openings in the expanded core structure may be square , rectangular , round , oval , or any other open shape which will create an open - cell structure . the depth and material of the expanded core structure may be selected to meet the thermal conductivity and stiffness needs of the user and may be of less depth than the finished panel . in other words , it is not necessary that the expanded core structure extend to the upper and lower surfaces of the panel . as an example , the expanded core structure may be a simple mesh or may be the thicker honeycomb structure as shown in the figures , or may be a honeycomb structure of any cell cross section . the material used to create the core structure may be any thermally conductive , rigid material such as , for example , any metal including steel or metal alloy , but is preferably recycled aluminum . the wall thickness of the core structure may be selected to achieve a given thermal conductivity , or stiffness , or both . furthermore , filler 604 may be comprised of any material or combinations of materials that provides the desired weight , stiffness , and thermal conductivity properties for the intended heat dissipating panel application . a covering layer of fiberglass matt material or carbon matt material may be applied to upper surface 601 and lower surface 602 and bonded to panel 100 by the use of resins , ester resins , urethanes , polyurethanes , soy - based urethanes , and the like . such coverings serve to reduce oxidation of the filler material and provide a desired surface finish , and are moldable to the shape of the panel , which is not necessarily flat . such coverings may also extend to any of the sidewalls , providing a complete covering of the panel . a plurality of layers of coverings may be used , and it is not necessary that the same covering material be used on all surfaces of the panel . for instance , carbon cloth or matt material , fiberglass cloth or matt material , or a functional equivalent thereof may be used on a desired surface or surfaces of the panel and carbon cloth or matt material , fiberglass cloth or matt material , or a functional equivalent thereof may be used as the covering material for another surface , or surfaces , of the same panel . the heat dissipating panel of the invention need not necessarily be flat or rectangular in shape . the structural core may be fabricated to be any desired shape by molding , casting , layup , or other known fabrication techniques for glass - resin construction , including any three dimensional shape , including any curvilinear or desired outline , and may be of any cross section that is sufficient to meet the structural needs of the application . the filler material and covering materials are by their nature moldable , thus the heat dissipating panel of the invention may take any three dimensional or cross sectional shape required by the designer . the reader will see that , according to a preferred embodiment of the invention , the present invention provides for a thermally conductive , stiff , lightweight heat dissipating panel fabricated partially from sustainable , recycled materials . the present invention is comprised of said heat dissipating panel described above in combination with a lighting element , which may be a single lighting element or a plurality of lighting elements , to provide the thermally efficient , lightweight , lighted panel described below . referring to fig1 , lighted heat dissipating panel 100 has a first mounting edge which is a left mounting surface which is retainingly engaged with a first supporting structure 105 and a second mounting edge which is a right mounting surface which is retainingly engaged with a second supporting structure 106 . said retaining engagement for both said left and said right mounting surfaces may be provided by a number of mechanical structures well known in the art such as a the “ l ” shaped panel mounting rail 500 shown in fig5 or the u shaped rail 400 shown in fig4 , but is preferably a plurality of spring loaded ball detent assemblies 101 . a preferred embodiment of the mechanical structure providing the retaining engagement of said heat dissipating panel 100 left and right mounting surface is shown in more detail in fig3 . heat ( i . e ., radiated heat 202 and conducted heat 203 shown in fig2 , for example ) is transferred from lighting elements 206 within heat dissipating panel 100 to the first and second supporting structures 105 and 106 as described herein . in this manner , the heat dissipating panel 100 and the first and second supporting structures 105 and 106 , which may , for example , be a cabinet or other enclosure , are able to act as a large heat sink for said lighting elements 206 by transfer of heat 202 , 203 from the lighting elements 33 to the first and second supporting structures 105 and 106 . referring now to fig2 , a preferred embodiment of the lighted heat dissipating panel 100 is comprised of a groove 208 having a left groove wall 204 and a right groove wall 209 , and further having a bottom surface 200 . lighting element assembly 33 is comprised of a printed circuit board ( pcb ) substrate 205 having a first surface 201 and a second surface 210 , and having conductive traces on said first surface 201 for providing electrical power and ground connections to the lighting elements as is commonly known in the electrical arts . pcb substrate 205 may be a single - layer or multilayer substrate having internal traces on internal layers , and is comprised of any of the known materials used in the electrical arts for pcb substrates including , for example , any of the rigid , flexible , or rigid - flexible pcb materials such as fiberglass , woven glass fabric / epoxy resin , synthetic resin bonded paper , polyimide , bismaleimide triazine epoxy , ceramic , or any other pcb substrate material . lighting element assembly 33 is further comprised of either a single or a plurality of lighting elements 206 mounted to said pcb first surface 201 so as to achieve electrical connectivity with conductive traces on said pcb first surface 201 as is known in the art to provide electrical power so said lighting elements 206 , and preferably to provide a thermal conduction to said pcb first surface 201 . said lighting element 206 is an electric circuit element having two electrical terminals , and which emits light when a voltage is applied across said terminals . lighting element 206 is adapted to mount to said pcb first surface 201 by any of the techniques well known in the electrical arts including , but not limited to , surface mount packaging and through - hole mount packaging . surface mount packaging , which is well known in the art of electronic assembly , is a preferred embodiment of the present invention due to its reduced size and increased ease of assembly over through hole mount packaging . lighting element 206 is mounted to said pcb first surface 201 by any of the techniques well known in the electrical arts for mounting electronic components to pcb substrates so that said lighting element electrical connections are in electrical communication with said pcb conductive traces , which techniques include , but are not limited to , soldering , bonding using electrically conductive bond agents , and the like . in this manner electrical power is provided to the lighting elements 206 . bond agents such as non - conductive epoxy may also be used to further secure the lighting elements 206 to pcb substrate 205 . such bond agents may be utilized , for instance , in applications in which the lighted panel 100 may be subjected to a physical environment , for example vibration , which requires additional mechanical strength in retaining said lighting elements 206 to said pcb substrate 205 . still referring to fig2 , said pcb substrate second surface 210 is in direct contact with said groove bottom surface 200 and is attached thereto by any of the attaching means known in the art such as , for example , chemical bonding or threaded fasteners . a preferred embodiment of said attaching means is one in which said pcb substrate second surface 210 is bonded to said groove bottom surface 200 by chemical structural / thermal conductive bonding means , for example epoxy bonding agents , or more specifically thermal epoxy bonding agents . said attaching means may be any of the pcb attaching means known in the art . referring now to fig3 , a preferred embodiment of the mechanical retaining structure is comprised of a ball detent assembly 101 , preferably a spring loaded ball detent assembly , which is retained within a cavity 300 adapted to accept said ball detent assembly 101 in heat dissipating panel 100 . the ball detent assembly 101 includes a thermally conducting ball 303 received in an accepting detent 301 along an accepting surface 302 of a supporting structure 304 . as shown in fig3 , radiated heat 202 is radiated from the heat dissipating panel 100 and conducted heat 203 is conducted away from the panel 100 to the supporting structure 304 , for example . the present invention may be comprised of a plurality of ball detent assemblies . ball detent assemblies have been used for years and are known in the mechanical arts . the embodiment shown in fig3 may be , but is not necessarily , one in which electrical conduction means providing electrical power to the lighting elements 206 is achieved by establishing electrical conductivity through ball detent assemblies 101 , or by means of a pigtail , as described herein . a further preferred embodiment of the mechanical retaining structure is one in which electrical power is provided to the lighting elements 206 by electrical power conduction means which comprises electrical connectivity through the ball detent assemblies 101 . referring now to fig1 , vertical mounting rails 102 and 103 are electrically conductive and electrically energized in accordance with the schematic diagram in fig7 ( to be discussed in detail later ). conductive vertical mounting rails 102 and 103 are in electrical communication with ball detent assemblies 101 such that the circuit of fig7 is implemented . electrical connectivity from ball detent assemblies 101 to pcb substrate 205 is achieved by means for providing such electrical connectivity that are known in the art such as , for example , embedded wiring which is electrically attached to pcb substrate 205 and ball detent assemblies 101 by electrical connection means such as soldering , electrical connectors , or press mechanical fit between electrically conductive surfaces . the lighting elements 206 may be connected in accordance with the schematic diagram shown in fig7 , or in any other configuration which provides power to the lighting elements 206 such that they operate to emit light 207 when power is applied . an alternate embodiment of the lighted heat dissipating panel 100 is shown in fig5 . heat dissipating panel 100 is secured to “ l ” shaped mounting rail 500 by any connecting means known in the art , shown in fig5 as a screw 503 , preferably a countersunk screw , which is threadingly engaged with the panel 100 by use of threaded insert 504 . it is not necessary that a threaded insert be used ; an alternative embodiment is one in which the receiving threads are machined into the heat dissipating panel 100 . in this manner a secure mechanical attachment is made between the heat dissipating panel 100 and mounting rail 500 , which attachment also provides a thermal path for heat conduction from the heat dissipating panel 100 to a supporting structure 401 . the mounting rail 500 is further attached to the panel 100 using an adhesive 501 . heat is transferred from the panel 100 to the mounting rail 500 at a heat transfer surface 502 . the mounting rail 500 may be attached to the supporting structure 401 by any of the well known mechanical attachment means known in the art such as , for example , threaded fasteners , chemical bonding 404 using bonding agents such as epoxy , riveting , or welding . electrical power conduction means ( not shown in fig5 ) provides electrical power to the pcb substrate 205 ( shown in fig2 , for example ). said electrical power conduction means may be electrically connected to said pcb by any of the known connection means known in the art such as , for example , soldering and use of connectors . a further alternate embodiment of the lighted heat dissipating panel 100 is shown in fig4 . heat dissipating panel 100 is slidingly engaged with “ u ” shaped mounting rail 400 . panel 100 thus transfers heat to the surrounding structure 401 through a first heat transfer surface 402 and a second heat transfer surface 403 . mounting rail 400 may be attached to the supporting structure 401 by any of the well known mechanical attachment means known in the art such as , for example , threaded fasteners , chemical bonding 404 using bonding agents such as epoxy , riveting , or welding . electrical power conduction means provides electrical power to the pcb substrate 205 . said electrical power conduction means is comprised of electrical wiring comprised of a first wire in electrical communication with said pcb substrate 205 and having a first end and a second end , and a second wire in electrical communication with said pcb substrate 205 and having a first end and a second end , wherein said first end of said first wire and said first end of said second wire are in electrical communication with said pcb substrate 205 and wherein said second end of said first wire and said second end of said second wire are terminated in either bare wires , or stripped as is commonly known , or are connectorized for attachment to an external power source such as a power supply 700 as shown in fig7 via positive (+) and negative (−) terminal connections 701 and 702 . such electrical connection configurations are commonly known as “ pigtails ” in the art . said first end of said first wire and said first end of said second wire means may be electrically connected to said pcb substrate 205 by any of the connection means known in the art such as , for example , soldering and use of connectors . referring now to fig7 , a plurality of lighting elements 206 may be in electrical communication with each other and a power supply 700 via vertical mounting rails 102 and 103 in electrical communication with positive (+) and negative (−) terminals 701 and 702 of the power supply 700 receiving alternate current ( ac ) power . referring now to fig8 , a further alternate embodiment of the lighted heat dissipating panel comprises a window 800 comprised of transparent material enclosing groove 208 . said transparent material may be glass , plastic such as , for example polycarbonate or acrylic , quartz , silicone , or any other stiff transparent material known in the art . window 800 is attached to heat dissipating panel 100 by chemical bonding using bonding agents known in the art , by use of threaded fasteners , by press fit , or by use of mechanical retainers as is known in the art . light 207 emitted from the lighting element 206 of the panel 100 can be seen through the window 800 . the lighted heat dissipating panel 100 described herein may be used in any application in which it is desired that an illuminating surface be present . when used as an illuminated shelf , for example in a cabinet , the lighted heat dissipating panel 100 is utilized with said groove opening in a downward direction , thereby providing illumination to the area underneath the shelf it is readily seen that this application of the invention provides illumination for uses such as merchant display cases , refrigerator shelving , curio cabinets , and the like . when used as an architectural element , the lighted heat dissipating panel 100 is utilized to provide a desired amount of lighting of a desired spectrum as required by the designer such that a specific lighting effect is achieved . for such applications the lighted heat dissipating panel 100 may be incorporated directly into walls , ceilings , furniture , structural elements , handrails , cabinetry , flooring , or hung or mounted on any of these surfaces or any other surface to provide the desired lighting effect . the lighted heat dissipating panel 100 may also be used as a lighted visor in vehicle applications wherein said lighting elements may be either oriented upwards to provide indirect lighting to the vehicle interior , or downwards to provide direct lighting to the vehicle interior . the applications of the lighted heat dissipating panel 100 given herein are exemplary ; it is readily seen that the lighted heat dissipating panel 100 of the present invention is useful in any application requiring a panel with integrated lighting . while the above description of the various embodiments contains much specificity , these should not be construed as limitations on the scope of any embodiment , but as examples of the presently preferred and exemplary alternative embodiments thereof for example the figures herein disclose a generally rectangular panel shape of uniform cross section ; however , the rectangular shape shown is exemplary only and it is easily understood that the present invention is not limited to a rectangular or polygon shape , nor is it limited to a uniform cross section . the lighted heat dissipating panel 100 of the present invention may take any shape desired by the user , including any shape in which the outline of the panel is curvilinear , and furthermore the panel may be of non - uniform cross section . many other variations are possible within the disclosure of the various embodiments disclosed herein . the scope of the invention should thus be determined by the appended claims and their legal equivalents , and not solely by the examples given .