[null, {"document_url": "https://www.binghamton.edu/ieec/facilities/seml/seml-equipment.html", "unformatted_src": "/ieec/facilities/img/mpm-momentum.jpg", "src": "https://www.binghamton.edu/ieec/facilities/img/mpm-momentum.jpg", "formatted_filename": "mpm momentum", "alt_text": "MPM Momentum", "rendered_width": 998, "rendered_height": 1264}, null, {"document_url": "https://www.binghamton.edu/ieec/facilities/seml/seml-equipment.html", "unformatted_src": "/ieec/facilities/img/koh-young.jpg", "src": "https://www.binghamton.edu/ieec/facilities/img/koh-young.jpg", "formatted_filename": "koh young", "alt_text": "Koh Young aSpire3", "rendered_width": 998, "rendered_height": 1264}, null, {"document_url": "https://www.binghamton.edu/ieec/facilities/seml/seml-equipment.html", "unformatted_src": "/ieec/facilities/img/ekra-screen.jpg", "src": "https://www.binghamton.edu/ieec/facilities/img/ekra-screen.jpg", "formatted_filename": "ekra screen", "alt_text": "Ekra Screen", "rendered_width": 998, "rendered_height": 1264}, null, {"document_url": "https://www.binghamton.edu/ieec/facilities/seml/seml-equipment.html", "unformatted_src": "/ieec/facilities/img/uic-fuzion.jpg", "src": "https://www.binghamton.edu/ieec/facilities/img/uic-fuzion.jpg", "formatted_filename": "uic fuzion", "alt_text": "UIC Fuzion Mounter", "rendered_width": 998, "rendered_height": 1264}, null, {"document_url": "https://www.binghamton.edu/ieec/facilities/seml/seml-equipment.html", "unformatted_src": "/ieec/facilities/img/koh-young-zenith.jpg", "src": "https://www.binghamton.edu/ieec/facilities/img/koh-young-zenith.jpg", "formatted_filename": "koh young zenith", "alt_text": "Kohn Young Zenith", "rendered_width": 998, "rendered_height": 1264}, null, {"document_url": "https://www.binghamton.edu/ieec/facilities/seml/seml-equipment.html", "unformatted_src": "/ieec/facilities/img/heller-reflow.jpg", "src": "https://www.binghamton.edu/ieec/facilities/img/heller-reflow.jpg", "formatted_filename": "heller reflow", "alt_text": "Heller Reflow Oven", "rendered_width": 998, "rendered_height": 1264}, null, {"document_url": "https://www.binghamton.edu/ieec/facilities/seml/seml-equipment.html", "unformatted_src": "/ieec/facilities/img/warpage.jpg", "src": "https://www.binghamton.edu/ieec/facilities/img/warpage.jpg", "formatted_filename": "warpage", "alt_text": "Warpage", "rendered_width": 499, "rendered_height": 632}, null]
Integrated Electronics Engineering Center

SEML - Electronics Assembly

MPM Momentum Screen Printer

MPM printer is a high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils.Solder Paste, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB. Solder paste printed deposits are essential to forming defect-free solder joints, the electrical and physical connections between electronic components and the PCB assembly. Koh Young aSpire3 SPI Ekra Screen Printer UIC Fuzion Mounter Koh Young Zenith PRE-AOI Heller Reflow Oven Thermal Warpage Inspection system Return to Top

Last Updated: 11/15/18