document: Design and implementation of a 3-D mapping system for highly irregular shaped objects with application to semiconductor manufacturing The basic technology for a robotic system is developed to automate the packing of polycrystalline silicon nuggets into fragile fused silica crucible in Czochralski -LRB- melt pulling -RRB- semiconductor wafer production . The highly irregular shapes of the nuggets and the packing constraints make this a difficult and challenging task . It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets into a fragile fused silica crucible . For this application , a dual optical 3-D surface mapping system that uses active laser triangulation has been developed and successfully tested . One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible . A resolution of 1 mm with 15-KHz sampling frequency is achieved . Data from the system are used by the packing algorithm , which determines optimal nugget placement . The key contribution is to describe the design and implementation of an efficient and robust 3-D imaging system to map highly irregular shaped objects using conventional components in context of real commercial manufacturing processes
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