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## ALICE ITS3: how to integrate a large dimension MAPS sensor in a bent configuration detector

## Domenico Colella a ,* for the ALICE Collaboration

a University and INFN Bari,

Via E. Orabona 4, 170125, Bari, Italy

E-mail: domenico.colella@ba.infn.it

The ALICE Collaboration is developing a novel vertexing detector to extend the heavyflavour physics programme of the experiment during Run 4 by improving the pointing resolution of the tracking, particularly at low transverse momentum. It will be a detector with three truly cylindrical layers based on thin wafer scale MAPS, reaching less than 0.07% X/X0 per layer and with the innermost layer located as close as 19 mm to the interaction point. This contribution will describe the global detector integration concept, focusing  on:  the  sensor  bending  procedure,  the  sensor  electrical  interconnection,  the choice of the best carbon foam for light mechanical supporting structures, the studies of cooling by air flow, and the global structures mechanical characterization.

6th International Conference on Technology and Instrumentation in Particle Physics (TIPP2023)

4 - 8 Sep 2023 Cape Town, Western Cape, South Africa

https://pos.sissa.it/

## 1. Introduction

The  ITS3  project  of  the  ALICE  Collaboration  [1,2],  is  developing  an  ultra-light vertexing detector, combining several innovative approaches, many of which have never been adopted in high-energy physics. The result is a nearly massless detector that is based on wafer-scale silicon sensors of up to 10 cm × 26.6 cm, reaching a mean material thickness of 0.09% X/X0 per layer.

Two new pioneering technologies are implemented in the sensor design: usage of 65 nm CMOS technology node that allows more dense circuitry and gives access to larger wafers (300 mm in diameter), and stitching technique that allows for extending the sensor dimentions above the usual size (O(2×3 cm 2 )). The implementation of the main analog  and  digital  blocks  of  a  MAPS  in  65  nm  has  been  demostrated  with  a  large campaign of sensor characterization that took place from 2020 to 2022; results are given in Ref. [3]. The development of large stitched sensors took two years of design and led to reception of first prototypes during summer 2023; the results of first characterization are given in Ref. [4].

The other groundbreaking innovation is the removal of most of the services from the detector acceptance exploting the flexibility of thin silicon. Detector half-layers will be formed by a single sensor, thinned down to 50 μm, bent to acquire a half-cylindrical shape, and fixed in position by carbon foam structures. Sensor cooling will be performed by forced air flow between detector layers and by thermal conduction to the support structures.

## 2. Detector concept

Figure 1 :  Left:  ITS3  detector  concept with six half-layers. Right: components of single half-layer. Taken from Ref. [2].

![image](https://ac.marcodsn.me/arxiv-markdown-images/2408.01108v1-figure-60f00127-6034-4a83-ad2f-ab5595b430e0.jpg)

The ITS3 detector is structured into three layers, with respective target radii of 19.0 mm, 25.2 mm, and 31.5 mm. Each layer is further divided into two halves, each forming a half-cylinder. The three half-layers are in contact through the support structures and are mounted in an external cylindrical support structure, forming a compact block to be placed around the beam pipe. A simplified schematic is shown in the left part of Figure 1. A more detailed half-layer schematic, including services like air distributor and flex for

powering, control, and data transmission, is shown in the right part of Figure 1. The whole detector will thus be made of only six sensors, each of them covering 180 degrees in azimuthal angle, and measuring 266 mm in length. These six sensors will be kept in cylindrical shape by minimal ultra-light support structures made of carbon foam, placed at  the edges of the sensor sensible area. Air for cooling will be driven to the sensor through small diameter ducts. These ducts will also be a part of the support structure for the flex circuitry that will be used to bring power and allow comunication with sensor. As can be seen in Figure 1, all these services will lie outside the detector sensible area.

## 3. Sensor bending

R&amp;D  activities  started  from  small  dimension  sensors.  A  3-point  bending  test, demonstrated that ITS 3 target radii are easily reachable with silicon thickness below 50 μm, for sensors based on CMOS technology node of 180 nm and 65 nm [2]. It has also been shown that MAPS (180 nm node) do not change their performance when bent to acquire cylindrical shape withthe ITS 3 target radii [5].

Figure 2 :  Left: picture of the bending setup for a large dimension silicon sensor. Right: details of the bending procedure steps. Taken from Ref. [2].

![image](https://ac.marcodsn.me/arxiv-markdown-images/2408.01108v1-figure-a2149da0-2f0b-477f-a039-331947c6d98c.jpg)

Large dimension silicon sensors are bent in cylindrical shape by means of a mandrel and a tensioned mylar foil. After the alignment to the mandrel, an adhesive polyimide strip holds the sensor to the mandrel. A rotating motor wraps the mylar foil around the mandrel forcing the sensor to bend. A second adhesive polyimide strip guarantees that the sensor will be kept in position at the end of the procedure. Figure 2 shows the bending tool  and  the main procedure steps. Such a bending procedure is nowadays routinely performed with success.

## 4. Mechanics and cooling

Two  main  components  are  used  as  support  structures  for  the  half-layer:  the logerons and the half-rings (Figure 1). Carbon foam has been identified as the optimal material  to  satisfy  various  requirements  for  the  ITS3.  Two  varieties  of  open-cell reticulated vitreous carbon (RVC) foams have been chosen based on the functionality of

the mechanical components. A low-density foam (45 kg/m 3 ) with a high stiffness, Carbon Duocel, is selected for the support longerons. Meanwhile, for the cooling radiator, the Allcomp K9 standard density RVC foam, distinguished by its high thermal conductivity (25 W m -1  K -1 ), has been chosen.

Figure 3 : Left: wind tunnel setup for air cooling verification. Right: ITS3 prototype integrating heaters to simulate power dissipation. Taken from Ref. [2].

![image](https://ac.marcodsn.me/arxiv-markdown-images/2408.01108v1-figure-33db005d-35b2-457f-9391-8cba6ad5655e.jpg)

A  prototype,  integrating  ducts  for  air  cooling  and  heaters  to  simulate  the  power dissipation of the MAPS, has been used in a wind-tunnel setup (Figure 3), to verify the possibility of sensor cooling by air flow. Power dissipation of the sensor will not be uniform across the silicon surface, so the prototype integrated two different regions: the matrix (25 mW/cm 2 ) and end-cap regions (1000 mW/cm 2 ). It has been demonstrated that, with an average freestream airflow velocity of approximately 8 m/s between the layers, the detector is kept at a temperature that is 5  C higher than the inlet air temperature and ◦ uniformity is maintained within 5  C along the sensor. ◦

Further  mechanical  characterizations  of  the  half-detector  established  that  the maximum displacement of a sensor, due to the airflow is limited to about 1.1 μm with an RMS below 0.4 μm, which well meets the ITS 3 requirements.

Finally,  another prototype, made of a single silicon layer glued to  a carbon fiber cylindrical external structure, has been tested in a climate chamber (with temperature ranging  between  10  and  40  C  and  constant  50%  humidity),  showing  no  detrimental ◦ effects  from  the  temperature  fluctuations.  This  is  the  first  measurement  of  a  larger campaign that will assess potential failures caused by thermo-elastic deformation.

## 5. Flex printed circuit integration

Sensor powering will  be provided  at  the  two longitudinal  extremities  by two flex printed circuits (FPC).  A-side  FPC  (Figure  1)  is  also  designed  to perform  the communication (control and data transmission) to the external world. This specific FPC is designed to have a region bent at the same radius of the corresponding sensor, and tails having zero insertion force connectors to the external boards. Length of the full FPC is limited by signal transmission integrity to less than 30 cm. Electrical connection to the

sensor is done via wire-bonding. A safety gap of 0.5 mm is left between the sensor and the FPC edges, reflecting in a distance between corresponding pads for soldering in the two objects of the order of 1 mm. A first exercise to estimate the best bonding parameters, targeting the best pull-force and minimizing the loop height, returned a mean pull-force value of 6.6±0.3 g. This study, done with not final grade materials, will be repeated with final components.

## 6. Summary

The  intense  R&amp;D  activities  done  in  the  ITS  3  project  already  successfully demonstrated the functionality of first stitched sensor and defined a controlled procedure to  bend  wafer-scale  silicon  sensors.  Next  sensor  submission  is  planned  for  2024, containing the prototype sensor to be used in the ALICE ITS 3 detector. On mechanical side more studies are expected to further improve the cooling system and assess the mechanical  properties  of  the  half-barrel,  providing  guidelines  for  the  final  detector assembly procedure. The final detector is  expected  to  be  assembled  during  the  first quarter of 2027, to be installed and finally commissioned in the cavern during the first quarter of 2028.

## References

- [1] ALICE Collab., Letter of Intent for an ALICE ITS Upgrade in LS3 , CERN-LHCC-2019-018.
- [2] ALICE Collab., Technical Design Report for the ALICE Inner Tracking System 3 - ITS3. A bent wafer monolithic pixel detector , CERN-LHCC-2024-003.
- [3] A. Trifirò for the ALICE Collab., ALICE Inner Tracking System Upgrade: characterization of first chips fabricated in 65 nm CMOS technology , these proceedings.
- [4] V. Sarritzu for the ALICE Collab., The ALICE Inner Tracking System Upgrade , these proceedings.
- [5] ALICE ITS Project, First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors , Nucl. Instrum. Methods Phys. Res. A 1028 (2022) 166280.
Domenico Colella
ALICE ITS3: how to integrate a large dimension MAPS sensor in a bent configuration detector
The ALICE Collaboration is developing a novel vertexing detector to extend
the heavy-flavour physics programme of the experiment during Run 4 by improving
the pointing resolution of the tracking, particularly at low transverse
momentum. It will be a detector with three truly cylindrical layers based on
thin wafer scale MAPS, reaching less than 0.07% X/X0 per layer and with the
innermost layer located as close as 19 mm to the interaction point. This
contribution will describe the global detector integration concept, focusing
on: the sensor bending procedure, the sensor electrical interconnection, the
choice of the best carbon foam for light mechanical supporting structures, the
studies of cooling by air flow, and the global structures mechanical
characterization.