## In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn3Ag-0.5Cu/Cu solder joint

Tianhong Gu*, Yilun Xu, Christopher M. Gourlay, and T. Ben Britton

Department of Materials, Imperial College London, SW7 2AZ. UK

*Corresponding author: t.gu15@imperial.ac.uk

The  heterogeneous  evolution  of  microstructure  in  a  single  Cu/SAC305/Cu  solder  joint  is investigated  using  in-situ  thermal  cycling  combined  with  electron  backscatter  diffraction (EBSD). Local deformation due to thermal expansion mismatch results in heterogeneous lattice rotation within the joint, localised towards the corners. This deformation is induced by the constraint and the coefficient of thermal expansion (CTE) mismatch between the β-Sn, Cu6Sn5 and Cu at interfaces. The formation of subgrains with continuous increase in misorientation is revealed during deformation, implying the accumulation of plastic slip at the strain-localised regions and the activation of slip systems (110)[ 1 ̅ 11]/2 and ( 11 ̅ 0)[111]/2.

Keywords: Pb-free  solder,  Polygonization,  In-situ  thermal  cycling,  and  Microstructure evolution.

The failure of electronics in service is often due to thermomechanical failure of the solder joints. This drives our need to understand the mechanisms leading to thermomechanical fatigue failure, to be able to predict the joint microstructure that is most resistant to thermal cycling and to develop ways of generating the optimum microstructure through alloy design and processing.

SAC305  is  a  Sn-based  alloy  containing  ~96.5%  β-Sn  phase [1] .  β-Sn has  a  body-centred tetragonal  (BCT)  structure  and  behaves  anisotropically  in  thermophysical  properties.  For example, the coefficient of thermal expansion (CTE) is double along the c-direction than along a = b [2] and also stiffness is triple along the c-direction than a = b [3] . Furthermore, in a solder joint the SAC305 ball is attached through intermetallic and metallisation layers to a polymer based printed circuit board (PCB) and, often silicon, which have significant differences in CTE to the solder ball. Thus, solder joints are particularly sensitive to thermal cycling.

The major failure mode of solder joints in thermal cycling is cracking during heterogeneous microstructure evolution, i.e. polygonization and crack nucleation, in the bulk solder near the solder/substrate interface on the Si chip-side, observed in ref [4-19] . The crack propagates in the region where the mismatch of CTE is large and the induced thermal strain is high in comparison to the surroundings (larger misfit on the Si chip side than PCB side of joint [2, 20-22] ). This CTE mismatch between the major constituents (solder / IMC layers / copper / PCB / silicon) leads to localised plastic deformation, this results in high local dislocation density and the stored energy may be released by recovery, recrystallization and grain growth in the  -Sn lattice. Ultimately this can provide an energetically favourable site for cracking within the  -Sn [5, 9, 1416, 18, 23]

.

Due to the low melting temperature of tin based solders, the recovery process takes place during deformation, where the stored energy or the driving force can be released by forming subgrains

with misorientation between 2 - 15 ° [7, 19, 24] .  The tested solder joints deform by continuous lattice rotation, caused by the operation of certain slip systems [25].

The generation of {110} slip traces is often associated with polygonization and recrystallization [6-8, 24] . Zhou et al. [7] analysed slip traces from SAC305 solder joints with [110] orientation close to the loading direction and demonstrated surface roughness enhanced at the strain-localised region with formation of subgrains, which are attributed to the generation of dislocations and the operation of slip system: (1 1 ̅ 0)[001] with gradual lattice rotation around the  [110]  axis.  With  increasing  straining,  recrystallized  grains  develop  progressively  with greater misorientation [7] .  Han et al. [24] carried out thermal shock testing for a multi-crystal SAC305 solder joint and found that the β-Sn deforms by subgrain rotation with [001] and [100] rotational axes for the chip and PCB side respectively. Bieler et al. [6] showed with SAC305 solder joints that the {110}[001] slip systems are the most easily activated when the  -Sn caxis is aligned with the loading direction and stimulates recrystallization at the strain localised region. Furthermore, Telang et al. [8] reported continuous recrystallization with the formation of {110} slip plane traces in a Sn-Ag joint during thermal cycling. Based on analysis using EBSD and  3D  finite  element  modelling  (FEM),  newly  recrystallized  orientations  grew  to consume initial orientation(s) and the rate of recrystallization was related to the elastic strain energy driving force [8] .

While  significant  advances  have  been  made  in  understanding  microstructure  and  damage development during thermal cycling, a range of questions remain about the early stages of microstructure evolution during thermal cycling, e.g. When and where does the microstructural deformation  start?  How  does  heterogeneous  deformation  arise?  Where  does  the  strain accumulate? How do the β-Sn grains (re)orientate? If we can characterise and understand these deformation processes, then we may be able to predict the optimum microstructures for reliable

electronic components.

This paper explores these questions using an in-situ heating stage together with EBSD during the  early  stages  of  thermal  cycling.  We  study  ball  grid  array  (BGA)  scale  Cu/SAC305/Cu solder joints containing a single  -Sn grain, and focus on the localisation of plastic deformation and microstructure evolution with increasing number of thermal cycles.

A sandwich geometry solder joint (Cu/SAC305/Cu) was fabricated for in-situ thermal cycling with SEM analysis. The sample dimensions were 8 × 8 × 1.5 mm 3 consisting of a 5 × 5 array of solder balls with ball pitch size 1 mm and pad size 0.5 mm. The solder balls were ~500 μm in diameter and connected with two Cu substrates (~500 μm in thickness, which constrains the freedom of solder ball during thermal cycling and gives a loading direction parallel to the plane of  substrate).  The  solder  balls  were  made  of  SAC305  solder  ingots  with  composition  Sn3.052Ag-0.504Cu in wt% and main impurities of 0.029Pb, 0.007Sb, &lt;0.003Fe, &lt;0.003Bi, and Zn, Cd, As, Al all &lt;0.001 wt% as measured by XRF spectroscopy. Ingot was rolled into foil, punched into thin disks and then melted on a hot plate with a mildly activated rosin flux (RM5) to form near-spheres due to surface tension [26] . After that, the solder balls were soldered to the  Cu  substrates  with  the  flux  and  then  reflowed  through  a  conveyor  oven  (LFR400HTX TORNADO Surface Mount Technology, UK)  [26] . All samples were cleaned in an ultrasonic bath  with  ethanol  to  remove  flux  residues  and  were  then  submerged  in  acetic  acid  for 20 minutes to remove the solder mask layer.

The solder joint array was polished without mounting using a Gatan Disk Grinder 623. The microstructure  of  the  joint  was  revealed  by  standard  mechanical  polishing  to  a  0.05  µm colloidal silica (OPS) finish. The quality of the cross-sectional surface of the solder joint was

then improved by ion-beam milling (PECSII) at 1 and 0.5 keV with a tilt angle of 3 and 1° respectively for a high spatial resolution EBSD scan.

In-situ thermal cycling together with EBSD scanning was carried out with the Gatan Murano 525 heating stage inside a Quanta FEI 450 SEM. The solder joint was thermally cycled from 20 to 150 °C with a dwell time of 10 minutes at the temperature extremes. The heating rate was ~12.5 °C/min. and the cooling rate was ~4.5 °C /min (the profile is chosen according to the IPC9701  [27] ). An EBSD map was scanned of the whole joint at room temperature after every 12 thermal cycles with a step size of 1.8 µm and the solder / substrate interface was scanned with a step size of 0.2 µm after 36 cycles. Between every 12 cycles, the joint was detached from the hot plate and put inside a vacuum desiccator to avoid oxidation. The EBSD data shown was  analysed  using  Bruker  ESPRIT 2.1  with  post-processed  'absorb  surrounded  zero solutions'.

Figure 1 shows a single β-Sn grain solder joint with its c-axis almost within the plane of the substrate (approximately 20°), which gives the largest in-plane CTE mismatch with the Cu substrate ( Table 1 ). We note that the non-linear evolution of CTEs may further enhance this mismatch  [28] .

As the joint is thermally cycled, a gradual change in colour of the IPF-LD maps at the corners of the joint from green to cyan after 36 ( Figure 1 b) and 60 cycles ( Figure 1 c) occurs compared to  the  maps  at  12  cycles  ( Figure 1 a),  indicating  the  orientation  is  rotated  gradually  as  the number of cycles increases. This is caused by the CTE mismatch between the three major phases (the CTE values for β-Sn, Cu6Sn5 and Cu are given in Table 1 ), which generates largely thermal strain and causes lattice rotation at the interface in the solder matrix (due to the softness of  β-Sn).  After  84  thermal  cycles,  the  accumulated  plastic  deformation  causes  noticeable reduction in indexing at the corners of the joint with no EBSD pattern detected ( Figure 1 d).

The in-grain misorientation maps in Figure 2 show two intersecting shear bands that extend from the corners of the joint to form a cross. The highest misorientation appears at the corners (MO av. colour key 0 - 15 ). It is observed that a slight lattice rotation occurs from the centre  to the corner of the joint. Along each band, the minimum misorientation is at the centre of the joint and increases in magnitude as moving from the centre towards the joint corners, along each diagonal deformation band ( Figure 2 a - 2d), i.e. from the centre (location 1) to the corner of the joint (location 2 and 3), the orientation rotates counter-clockwise increasingly, while the orientation rotates clockwise as moving down the cross band (location 4 and 5) as illustrated in Figure 2 f.  After 84 cycles ( Figure 2 d), the non-indexed positions appear at the corners, where relatively higher misorientations are observed than at previous cycles ( Figure 2 a - 2c). Generally, the misorientation increases with increasing thermal cycling shown as an increase in peaks to larger angles in the misorientation curves at higher number of cycles ( Figure 2 e). The misorientation angle (Δɵ) vs. position (x) curves ( Figure 2 e) are drawn according to the red dashed line in each MO av. map).  They show the rotation angle increases as the distance becomes farther from the centre of the joint and the curve has larger gradient at higher thermal cycle number. Figure 2 f plots the unit cell orientations with increasing number of cycles from the measured Euler angles. It can be seen that the β-Sn rotates around the [001] rotational axis and the direction of rotation is indicated with blue arrows.

When the solder is deformed by thermal cycling, the lattice misorientation within the solder joint  is  increased  continuously  by  lattice  rotation  resulting  from  crystal  slip  along  a  single rotational  axis  ( Figure 2 f).  This  lattice  rotation  indicates  higher  straining  and  more  highly stored energy in the region, which causes formation of significant subgrain boundaries and is vital for generation of HAGBs (recrystallization) and crack nucleation in the later stages of thermal cycling [7, 8, 14-16, 18] .

The microstructure of the β-Sn / Cu6Sn5 / Cu reaction zone is shown in the Figure 3 after 12 thermal cycles. The four phases: β-Sn (red), Cu6Sn5 (blue), Ag3Sn (green) and Cu (yellow) are identified clearly in the phase map ( Figure 3 a). Only a few Ag3Sn particles are indexed in the region because of its fine size (sub-micrometre scale). A layer of Cu6Sn5 and Cu6Sn5 in the bulk solder can be seen in Figure 3 , which are approximately 1 - 5 μm in size. Near the Cu6Sn5 layer, the high misorientation is concentated in the β-Sn phase ( Figure 3 c - 3e) with significant formation of subgrains ( Figure 3 b).

The deformation of the solder joint is induced at the corner of the solder matrix during thermal cycling at the β-Sn, Cu6Sn5 and Cu interface. This is caused by the CTE mismatch between the 3 phases ( Table 1 ), which systematically varies the stress and strain build-up during thermal loading near the interface of the solder joint and results in microstructural evolution in the solder matrix.

The lattice rotation during deformation can be evaluated based on the rotation matrix from the initial crystallographic orientation to the deformed one, which gives:

$$R = ( R _ { i n i } ) ^ { - 1 } R _ { r o t }$$

Where 𝑹𝑖𝑛𝑖 and 𝑹𝑟𝑜𝑡 are  the  initial  and  deformed  rotation  matrices  from  the  reference configuration that are calculated from the EBSD measured Euler angles. The rotation axis 𝒖𝑒𝑥𝑝 of the lattice rotaton matrix 𝑹 is then given by:

$$u _ { e x p } \, = \, \begin{pmatrix} u _ { x } \\ u _ { y } \\ u _ { z } \end{pmatrix} = \begin{pmatrix} R ( 3, 2 ) - R ( 2, 3 ) \\ R ( 1, 3 ) - R ( 3, 1 ) \\ R ( 2, 1 ) - R ( 1, 2 ) \end{pmatrix}$$

The analytical rotation axis 𝒖 𝑎𝑛𝑎𝑙𝑦𝑡 (𝛼) is determined by the α th slip system with slip normal 𝒏 (𝛼) and slip direction 𝒔 (𝛼) of a Sn crystal as:

$$u _ { a n a l y t } ^ { ( \alpha ) } = n ^ { ( \alpha ) } \times s ^ { ( \alpha ) }$$

Hence, the deviation angle ∆ω between the experimental measured rotation axis 𝒖𝑒𝑥𝑝 and the rotation axis by a certain slip system 𝒖𝑎𝑛𝑎𝑙𝑦𝑡 enables to determine which specific slip systems are potentially activated during deformation. The slip system(s) with minimum ∆ω is likely to be activated.

The experimental rotation axis is obtained from the location 1 (the centre of the solder given in Figure  2 a)  to  the  configuration  2  and  4  (shown  in Figure  2 f).  The  deviation  angle ∆ω between the experimental and analytical rotational axis is ranked from smallest to largest as plotted in Figure 4 a and 4c.

The activation of slip systems can be found by analysing ∆ω and  calculating  the  weighted Schmid factor ( mW ) for the crystal orientation, which is measured by EBSD Euler angles. The mW can be calculated according to the critical resolved shear stress ( τCRSS ) and Schmid factor ( m ), as given in Equation (4).

$$m _ { W } = \frac { m } { \tau _ { C R S S } / \tau _ { C R S S } ^ { [ 0 0 1 ] } }$$

Where τCRSS = F A cosϕ cosλ and the Schmid factor, m = cosϕ  cosλ .

Therefore, by considering both mW and ∆ω , slip system #8 (110)[ 1 ̅ 11]/2 and #9 ( 11 ̅ 0)[111]/2 are indicated as the most active slip systems for the solder joint under cyclic thermal loading, according to their relatively high mW and small ∆ω among all slip systems ( Table 2 ).

Although the slip systems #11 (110)[ 11 ̅ 0], #12 ( 11 ̅ 0)[110] and #15 (100)[011] have a small ∆ω ,  they  are  unlikely  to  be  active  due  to  relatively  lower  values  of mW and  longer  slip distances than the slip systems #8 (110)[ 1 ̅ 11]/2 and #9 ( 11 ̅ 0)[111]/2, which have been reported by Zhou et al. [29] , Kinoshita et al. [30] and Matin et al. [31] . The slip systems presented are based on prior work by Fujiwara et al. [32] and Zhou et al. [29] . The common Sn slip systems [32] with CRSS ratios ( 𝜏𝐶𝑅𝑆𝑆 /𝜏 𝐶𝑅𝑆𝑆 [001] ) [29] , m and mW values are included in Supplementary Table S1.

Moreover, it is found that the activated slip systems are in line with the directions of the two diagonal deformation bands in Figure 2 , which are also relative to the dendrite microstructure pointing along [110] and [ 11 ̅ 0] in the cross-section of the solder (Figure S2). It is known that [110] and [ 11 ̅ 0] are the dendrite growth directions in  -Sn, where the primary and secondary dendrite arms are indicated with blue line 1 and red line 2 respectively in Figure S2.

In-situ  thermal  cycling  has  been  performed  to  investigate  the  heterogeneous  evolution  of microstructure in a single  -Sn crystal Cu/SAC305/Cu BGA solder joint. In the early stage of thermal cycling, it has been revealed that heterogeneous deformation was associated with both the constraint by the CTE mismatch between the three major phases (Cu, Cu6Sn5 and β-Sn) and the anisotropy of β-Sn. The plastic deformation localised at the corners of the β-Sn /Cu6Sn5 / Cu interface resulted in heterogeneous lattice rotation, i.e. the greater the distance from the centre  of  the  joint  the  greater  the  rotation,  which  is  a  consequence  of  the  increase  in misorientation and formation of subgrains (polygonization) by recovery processes.

The activation of slip systems has been analysed by measuring the lattice rotation angle and calculating  the  weighted  Schmid factor  during  the  microstructural  evolution  for  the  crystal orientation  of  the  solder  joint.  The  most  likely  activated  slip  system  are  (110)[ 1 ̅ 11]/2  and

( 11 ̅ 0)[111]/2, which produced two diagonal deformation bands in the misorientation maps as illustrated in Figure 2 , and the evolution in stored energy as a result of further cycling, is likely the precursor to recrystallization and crack propagation.

This work provides new understanding on the early stages of microstructural deformation and the accumulation of stored energy associated with these bands as the precursor to the more widely studied phenomena of recrystallization and crack propagation in thermal cycling.

TG drafted the initial  manuscript and  conducted the experimental work.  YX supported the development of the Matlab code for Sn slip systems. CG and TBB supervised the work equally. TG, CG and TBB contributed to the final manuscript.

Data from this manuscript is available at: &lt;link to be included upon final acceptance&gt;.

TBB would like to thank the Royal Academy of Engineering for his research fellowship. CG would like  to  thank  EPSRC  (EP/M002241/11)  for  funding  of  his  research  fellowship.  We would  like  to  thank  EPSRC  (EP/R018863/1)  for  funding.  We  would  like  to  thank  Nihon Superior  for  positive  support  and  encouragement  to  conduct  this  work.  We  would  like  to acknowledge Dr Sergey Belyakov for support in the initial fabrication of the samples and Prof Fionn Dunne for helpful discussions on slip system activity. The microscope and loading frame used to conduct these experiments was supported through funding from Shell Global Solutions and is provided as part of the Harvey Flower EM suite at Imperial.

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Figure  1. EBSD  IPF-LD  (Crystal  orientations  represented  with  EBSD  inverse  pole  figure colouring  with  respect  to  the  loading  direction,  IPFX)  maps  showing  heterogeneity  in microstructural evolution of a single β-Sn grain SAC305 solder joint at different number of thermal cycles, (a) after 12 cycles, (b) after 36 cycles, (c) after 60 cycles and (d) after 84 cycles. (Only the  -Sn has been indexed here).

![image](https://ac.marcodsn.me/arxiv-markdown-images/1908.00401v2-figure-a8437ccd-347a-4446-96ac-700a86e73ac4.jpg)

Figure 2. EBSD MO av. map showing misorientation evolution of a single  -Sn grain SAC305 solder joint at different number of thermal cycles, (a) after 12 cycles, (b) after 36 cycles, (c) after 60 cycles and (d) after 84 cycles. (e) Orientation rotation angle vs. position curves, the curve  is  drawn  according  to  the  red  dashed  line  on  (a-d).  (f)  Illustrations  of  the  unit  cell orientations showing the crystal rotation behaviour, location 1 is at the centre of the solder, location 2 - 5 are the rotated frame of the grain at corresponding locations on the MO maps. (Only the  -Sn has been indexed here).

![image](https://ac.marcodsn.me/arxiv-markdown-images/1908.00401v2-figure-16ae4d6b-7eb3-4651-b05d-996518612c65.jpg)

Figure 3. EBSD crystal orientation mapping showing the microstructure at β-Sn / Cu6Sn5 / Cu interface after 12 thermal cycles within the red rectangular region in Figure 1 a. (a) Phase map (red = β-Sn, blue = Cu6Sn5, green = Ag3Sn, yellow=Cu). (b) MO av. map for β-Sn, Cu6Sn5 and Cu respectively. (c-e) IPF-LD maps of β-Sn (c), Cu6Sn5 (d) and Cu (e).

![image](https://ac.marcodsn.me/arxiv-markdown-images/1908.00401v2-figure-a8ba752d-838d-4c87-9ba9-756cdf00fb1c.jpg)

Figure 4. Lattice rotation axis analysis of constraint slip for single grain solder joint. (a, c) The distributions of the deviation angle (  ω) between experiental and analytical rotation axes (shortlist to  ω ≤ 30º), the EBSD Euler angles are measured from location 1 to 2 (a) and from location 1 to 4 (c) respectively in Figure 2 f. (b, d) The activated slip systems are illistrated in orientation unit cells with rotational axes, and slip direction labelled, the green shadowed planes represent the slip planes.

![image](https://ac.marcodsn.me/arxiv-markdown-images/1908.00401v2-figure-f03d17d4-4c93-435f-a67c-05e5448c7f5b.jpg)

Table 1. The CTE values of the interface constituents. The values are determined using in-situ powder X-ray diffraction (PXRD) and calculated by fitting the PXRD data into corresponding crystal structure [2, 20, 28] . A typical PCB material is a glass reinforced epoxy FR-4.

| Axis   |   β-Sn (°C -1 ) [2] |    '-Cu 6 Sn 5 (°C -1 ) [2] |   Cu (°C -1 ) [20] |
|--------|---------------------|------------------------------|--------------------|
| a      |              14.195 |                       19.195 |               16.5 |
| b      |              14.195 |                       17.684 |               16.5 |
| c      |              28.662 |                       18.695 |               16.5 |

Table 2. The shortlisted Sn slip systems [32] in Figure 4 a and c are given with the deviation angle (  ω) measured from location 1 to 2  and 1 to 4 ( Figure 2 f) and weighted Schmid factor (mW) loaded along [100] direction. The full table of common Sn slip systems and weighted Schmid  factor  (shortlist  to  mW  ≥  0.25)  distribution  vs.  the  slip  system  (#)  is  presented  in supplementary Table S1 and Figure S2.

| Family   |   Slip system | Slip system     |  ω 1-2 (°)   |  ω 1-4 (°)   |   m w |
|----------|---------------|-----------------|---------------|---------------|-------|
| 3        |             5 | (100)[010]      | -             | 18.5          | 0.046 |
|          |             6 | (010)[100]      | -             | 18.5          | 0.046 |
|          |             8 | (110)[ 1 ̅ 11]/2 | 25.7          | 10.2          | 0.344 |
|          |             9 | ( 11 ̅ 0)[111]/2 | 29.4          | 19.8          | 0.449 |
| 5        |            11 | (110)[ 11 ̅ 0]   | -             | 18.5          | 0.389 |
|          |            12 | ( 11 ̅ 0)[110]   | -             | 18.5          | 0.389 |
|          |            14 | (010)[ 101 ̅ ]   | -             | 29.2          | 0.029 |
|          |            15 | (100)[011]      | 10.5          | 11.8          | 0.125 |
| 10       |            25 | (121)[ 101 ̅ ]   | 25.3          | -             | 0.256 |
|          |            27 | ( 12 ̅ 1)[101]   | 25.3          | -             | 0.093 |
Tianhong Gu Christopher M. Gourlay T. Ben Britton
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder
joint is investigated using in-situ thermal cycling combined with electron
backscatter diffraction (EBSD). Local deformation due to thermal expansion
mismatch results in heterogeneous lattice rotation, localised towards the
corners of the joint and decreases towards the centre of the joint. This
deformation is induced by the constraint from the CTE between the \b{eta}-Sn,
Cu6Sn5 and Cu at interfaces. The formation of subgrains with continuous
increase in misorientation is revealed during deformation, implying the
accumulation of plastic slip at the strain-localised regions and the activation
of slip systems (1-10)[111]/2 and (11-0)[111]/2.