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# c12) United States Patent Hirano et al. 

# (54) ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 

(71) Applicant: FUJIFILM Corporation, Tokyo (JP) 

(72) Inventors: Shuji Hirano, Shizuoka (JP); Natsumi Yokokawa, Shizuoka (JP); Hiroo Takizawa, Shizuoka (JP); Wataru Nihashi, Shizuoka (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

( *) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days. 

(21) Appl. No.: 14/605,264 

(22) Filed: Jan.26,2015 

## (65) Prior Publication Data 

US 2015/0132687 Al May 14, 2015 

(63) Continuation of application No. PCT/JP2013/070829, filed on Jul. 25, 2013. 

## (30) Foreign Application Priority Data 

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(51) Int. Cl. 

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(52) U.S. Cl. CPC .............. G03F 710388 (2013.01); C08F 22110 (2013.01); C08F 220128 (2013.01); G03F 710002 (2013.01); G03F 710392 (2013.01); G03F 710397 (2013.01); G03F 7111 (2013.01); G03F 712002 (2013.01); G03F 712037 (2013.01); G03F 712041 (2013.01); G03F 7130 (2013.01); G03F 71325 (2013.01); G03F 7138 (2013.01); H0JL 2110274 (2013.01); C08F 212/14 (2013.01) 

(58) Field of Classification Search CPC ......... G03F 7/038; G03F 7/0388; G03F 7/30; 

## Related U.S. Application Data 

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# (IO) Patent No.: US 9,291,896 B2 

# Mar.22,2016 (45) Date of Patent: 

C08F 220/12; C08F 220/18; C08F 220/20; C08F 220/26; C08F 12/24; C08F 2220/285; H0lL 21/0271; H0lL 21/0273; H01L 21/0274 USPC ................ 430/270.1, 322,325,329; 526/320 See application file for complete search history. 

## (56) References Cited 

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## FOREIGN PATENT DOCUMENTS 

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International Search Report for PCT/JP2013/070829 dated Oct. 29, 2013 [PCT/ISA/210]. 

Primary Examiner - Amanda C Walke 

(74) Attorney, Agent, or Firm - Sughrue Mion, PLLC 

## (57) ABSTRACT 

There is provided an actinic ray-sensitive or radiation-sensi› tive resin composition comprising (P) a resin containing a repeating unit represented by the specific formula (1) and a repeating unit represented by the specific formula (A); a resist film formed using the actinic ray-sensitive or radiation-sen› sitive resin composition; a pattern forming method compris› ing (i) a step of forming a film from the actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of expos› ing the film, and (iii) a step of developing the exposed film by using a developer to form a pattern; a method for manufac› turing an electronic device, comprising the pattern forming method, and an electronic device manufactured by the manu› facturing method of an electronic device. 

US009291896B2 

## U.S. PATENT DOCUMENTS 

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## OTHER PUBLICATIONS 

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## 20 Claims, No Drawings 

