content_image/931986.jpg
# c19) United States c12) Patent Application Publication 

# Cheng et al. 

# (54) ANISOTROPIC CONDUCTIVE ADHESIVE 

(76) Inventors: Chih-Min Cheng, Westford, MA (US); Jayesh P. Shah, Plaistow, NH (US); Bo Xia, Lexington, MA (US) 

Correspondence Address: NATIONAL STARCH AND CHEMICAL COMPANY P.O. BOX 6500 BRIDGEWATER, NJ 08807-3300 (US) 

(21) Appl. No.: 11/373,484 

(22) Filed: Mar. 10, 2006 

(51) Int. Cl. C0SL 63/00 (2006.01) 

## Publication Classification 

<img src='content_image/931986.jpg'>

US 20070213429Al 

# c10) Pub. No.: US 2007/0213429 Al 

# (43) Pub. Date: Sep. 13, 2007 

(52) U.S. Cl. ......................... 523/458; 523/442; 523/443; 525/523; 525/529; 525/530; 525/533 

## (57) ABSTRACT 

An anisotropic conductive adhesive that provides strong adhesion to metals and organic substrates to generate stable and reliable electric interconnects. The adhesive provides the benefits of short thermocompression bond time at low temperatures. The adhesive contains cationic curable resin, latent cationic catalyst that thermally cures the resin at high speeds and low temperatures, conductive filler, optionally a film forming thermoplastic solid resin and optionally nano size filler. The optional nano filler provides the benefit of reducing the coefficient of thermal energy mismatch, improving the adhesion strength and reducing the total heat of reaction for the system. 

