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## 2.1.2 Performance and capacity considerations 

FlashSystem 900 AE3 performance is depending on the following areas: 

GLYPH<SM590000> Number of FPGAs 

GLYPH<SM590000> Capacity of IBM MicroLatency modules 

GLYPH<SM590000> Number of NAND chips on IBM MicroLatency cards in side the modules 

The relationship of the IBM MicroLatency modules internal structure and the number of FPGAs per cards within the IBM MicroLatency modules is shown in Figure 2-3. 

<img src='content_image/1001782.jpg'>

Consider the following points: 

GLYPH<SM590000> The Small (3.6 TB) module includes one FPGA chip, which serves 12 NAND flash chips. 

GLYPH<SM590000> The Medium (8.5 TB) module features two FPGAs, which serve 28 NAND flash chips. 

GLYPH<SM590000> The Large (18 TB) module includes two FPGAs and serves 56 NAND flash chips. 

GLYPH<SM590000> The XLarge (18 TB) module includes two FPGAs and serves 56 NAND flash chips 

Figure 2-3 also shows that the Medium, Large, and XLarge IBM MicroLatency modules features two FPGAs that are connected to the XBARs to service data requests. 

An estimation of the performance of FlashSystem 900-AE3 (depending on the MicroLatency module capacity and the number of modules that are installed in a system) is listed in Table 2-1. 

<img src='content_image/1001777.jpg'>

