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# c19) United States c12) Patent Application Publication 

# OU et al. 

# (54) ACTIVE LIGHTRAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD 

(71) Applicant: FUJIFILM Corporation, Tokyo (JP) 

(72) Inventors: Keiyu OU, Haibara-gun (JP); Keita KATO, Haibara-gun (JP); Michihiro SHIRAKAWA, Haibara-gun (JP); Akiyoshi GOTO, Haibara-gun (JP); Sou KAMIMURA, Haibara-gun (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

(21) Appl. No.: 15/092,871 

(22) Filed: Apr. 7, 2016 

(63) Continuation of application No. PCT /JP2014/080906, filed on Nov. 21, 2014. 

## Related U.S. Application Data 

<img src='content_image/944079.jpg'>

## (30) Foreign Application Priority Data 

<img src='content_image/944094.jpg'>

(51) Int. Cl. 

(52) U.S. Cl. CPC ................ G03F 710045 (2013.01); G03F 7120 (2013.01); G03F 7132 (2013.01); G03F 7116 (2013.01); G03F 7111 (2013.01) 

## (57) ABSTRACT 

This active light-sensitive or radiation-sensitive resin compo› sition contains a resin (A), a compound (B) capable of gen› erating an acid upon irradiation with active light or radiation, and a compound (C) having at least one oxygen atom. The compound (C) does not include the resin (A) and the com› pound (B). 

US 20160223905Al 

# c10) Pub. No.: US 2016/0223905 Al 

# (43) Pub. Date: Aug. 4, 2016 

## Publication Classification 

<img src='content_image/944095.jpg'>

