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# c19) United States c12) Patent Application Publication 

# Kodera et al. 

# (54) ELECTROLYTIC LIQUID FOR ELECTROLYTIC POLISHING AND ELECTROLYTIC POLISHING METHOD 

(76) Inventors: Akira Kodera, Kanagawa-ken (JP); Yasushi Toma, Kanagawa-ken (JP); Tsukuru Suzuki, Kanagawa-ken (JP); Takayuki Saito, Kanagawa-ken (JP); Itsuki Kobata, Tokyo (JP) 

Correspondence Address: WENDEROTH, LIND & PONACK, L.L.P. 2033 K STREET N. W. SUITE 800 WASHINGTON, DC 20006-1021 (US) 

(21) Appl. No.: 11/896,251 

(22) Filed: Aug. 30, 2007 

## (30) Foreign Application Priority Data 

<img src='content_image/924111.jpg'>

<img src='content_image/924098.jpg'>

(51) Int. Cl. C25F 3/16 (2006.01) B23H 3/00 (2006.01) 

(52) U.S. Cl. ......................... 205/645; 205/656; 205/662; 205/684 

## (57) ABSTRACT 

An electrolytic liquid is used for electrolytic polishing which can provide a processed surface having high flattening characteristics with a low voltage applied while ensuring a higher processing rate for an conductive material, and can remove an unnecessary conductive material and expose a barrier film without causing dishing, erosion, or etching at the interface between the barrier film and a metal ( conduc› tive material). The electrolytic liquid for use in electrolytic polishing of a surface conductive material of a workpiece comprises an aqueous solution containing at least one organic acid or its salt, at least one strong acid having a sulfonic acid group, a corrosion inhibitor and a water› soluble polymeric compound. 

US 20080067077Al 

# c10) Pub. No.: US 2008/0067077 Al 

# (43) Pub. Date: Mar. 20, 2008 

## Publication Classification 

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