content_image/891682.jpg content_image/891681.jpg content_image/891680.jpg
-continued 

[Chemical formula 19] 

<img src='content_image/891682.jpg'>

<img src='content_image/891681.jpg'>

[Chemical formula 20] 

and 

[Chemical formula 21] 

<img src='content_image/891680.jpg'>

wherein, a, b, c, d, and e may respectively satisfy 0.01 ~a/ (a+b+c+d+e)<0.4; 0.01 <b/(a+b+c+d+e)<0.3; 0.01 <c/(a+b+ c+d+e )<0.3; 0.01 ~d/(a+b+c+d+e )<0.3; 0.01 ~e/(a+b+c+d+ e)<0.15. 

In addition, the chemically amplified resist composition according to an exemplary embodiment of the invention may include the copolymer and a solvent, and a main chain of the copolymer is connected with the PAG. The chemically ampli- 

fled resist composition according to an exemplary embodi- ment of the invention may further include other additives. The other additives are not particularly limited, however, for example, a surfactant and water-soluble alcohols may be used alone or in any combination thereof. The chemically ampli› fied resist composition according to an exemplary embodi› ment of the invention may further include a separate PAG. 

