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# c12) United States Patent 

# Sasaki 

# (54) POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME 

(75) Inventor: Tomoya Sasaki, Shizuoka (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

( *) Notice: Subject to any disclaimer, the term ofthis patent is extended or adjusted under 35 U.S.C. 154(b) by 176 days. 

(21) Appl. No.: 11/217,422 

(22) Filed: Sep.2,2005 

## (65) Prior Publication Data 

US 2006/0046195 Al Mar. 2, 2006 

## (30) Foreign Application Priority Data 

Sep.2,2004 (JP) .......................... P.2004-255473 

(51) Int. Cl. G03F 71039 (2006.01) 

(52) U.S. Cl. .................................... 430/270.1; 430/326 

(58) Field of Classification Search .............. 430/270.1, 430/907, 326, 176 See application file for complete search history. 

## (56) References Cited 

<img src='content_image/899228.jpg'>

## U.S. PATENT DOCUMENTS 

<img src='content_image/899239.jpg'>

# (IO) Patent No.: US 7,504,193 B2 

# (45) Date of Patent: Mar.17,2009 

## FOREIGN PATENT DOCUMENTS 

<img src='content_image/899227.jpg'>

Patent Abstracts of Japan (JP-A-11-282163), Shiro Tan, "Positive 

Photosensitive Composition" copyrighted 1999. 

European Search Report dated Feb. 1, 2006. 

* cited by examiner 

Primary Examiner-Cynthia Hamilton 

(74) Attorney, Agent, or Firm-Sughrue Mion PLLC 

## (57) ABSTRACT 

A positive resist composition satisfying high sensitivity, high resolution and good line edge roughness at the same time, and a pattern forming method using the resist composition are provided, which are a positive resist composition comprising (A) a resin which becomes soluble in alkali developer increases under the action of an acid, the resin having two kinds of repeating units each having a specific styrene skel› eton, (B) a compound of generating an acid upon irradiation with actinic rays or radiation, and (C) an organic basic com› pound, and a pattern forming method using the resist compo› sition. 

US007504193B2 

## OTHER PUBLICATIONS 

## 17 Claims, No Drawings 

