content_image/922884.jpg content_image/922885.jpg content_image/922886.jpg content_image/922887.jpg
<img src='content_image/922884.jpg'>

[0385] To the above reaction solution, 0.17 g of 4-hydroxy TEMPO (manufactured by TOKYO CHEMICAL INDUS› TRY CO., LTD.) and 75.9 g oftriethylamine were added and allowed to react at room temperature for 4 hours. Thereafter, 112 g of a 70% aqueous solution of methane sulfonic acid were added to the reaction solution. After the reaction, the reaction solution was subjected to re-precipitation with water and a solid was recovered. 25 g of specific polymer A having the following structure were obtained. The acid value of spe› cific polymer A was 4.0 mmol/g. 

<img src='content_image/922885.jpg'>

[0386] Preparation of Composition A for Forming a Layer to be Plated 

[0387] 0.30 g (7.5% by mass) of the specific polymer A (the above-described structure; weight average molecular weight: 44,000; solid content: 87% by mass), 0.07 g (1.75% by mass) of sodium hydrogen carbonate, and 1.63 g ( 40.6% by mass) of water were mixed while stirring to dissolve the specific poly› mer A, and then 2.0 g (49.9% by mass) of methanol and 0.01 g (0.25% by mass) of water-insoluble photopolymerization initiator (IRGACURE 907, trade name, Chiba Japan K.K.) were added thereto and stirred to prepare a composition A for forming a layer to be plated. At this time, the content of methanol contained in the water-alcohol mixed solvent was 55.1 % by mass. Further, after the production of the compo› sition A for forming a layer to be plated and subsequent leaving thereof to stand for 10 minutes, occurrence of pre› cipitation was not seen by visual observation. 

[0388] Formation of Layer to be Plated 

[0389] The thus-prepared composition A for forming a layer to be plated was applied onto the adhesion-aiding layer of the above-described substrate Al so as to be a thickness of 1 µm according to a spin coat method, and was dried at 80° C. for 30 minutes. 

[0390] Then, pattern exposure to the coated film of the composition for forming a layer to be plated was carried out through a photomask having line-and-space of 300 µm with exposure energy of 100 mJ to 8,000 mJ using a UV exposure machine (wavelength: 365 nm (wavelength cutting at short 

MonomerM 

Specific polymer A 

wavelength side using soda glass), Model No: UVF-502S, lamp: UXM-501MD, all trade names, manufactured by SAN› EI ELECTRIC CO., LTD.). 

[0391] After the exposure, the substrate was immersed in a 1 % NaHCo$_{3 }$ aqueous solution for 10 minutes, and was then washed with distilled water. 

[0392] Substrate A2 having a patterned layer to be plated was thus obtained. 

[0393] Application of Plating Catalyst 

[0394] SubstrateA2 with a layer to be plated was immersed in a 1 % by mass silver nitrate aqueous solution for 10 min› utes, and was then immersed in water for washing. 

[0395] Patterned Electroless Plating 

[0396] SubstrateA2 with a patterned layer to be plated onto which a plating catalyst had been applied was subjected to electroless plating at 30° C. for 30 minutes, using an electro› less plating bath having the following composition thereby obtaining a metal pattern material. The thickness of the obtained electroless plating film was 1 µm. 

Composition of Electroless Plating Bath 

[0397] 

<img src='content_image/922886.jpg'>

[0398] Entire Surface Electroless Plating 

[0399] In order to evaluate adhesion, by use of the compo› sitionA for forming a layer to be plated and exposure without a photomask, a composition layer to be plated was formed on the entire surface of the substrate, and a plated film having a thickness of 0.1 µm to 1.5 µm was produced as described below. 

Composition of Electroless Plating Bath 

[0400] 

<img src='content_image/922887.jpg'>

[0401] All Over Electroplating 

[0402] Subsequently, electroplating was performed in a copper electroplating bath having the following composition at 3 A/dm $^{2 }$for 20 minutes, using the copper electro less plating film as a feed layer. The thickness of the obtained copper electroplating film was 18 µm. 

