[0585] In Formula (fl-1), nf$^{1 }$represents an integer of 1 to 5, preferably an integer of 1 to 3, and more preferably an integer of 1 or 2. 101 

[0586] In Formula (fl-1), Rf represents an organic group containing a fluorine atom, and is preferably a hydro› carbon group containing a fluorine atom. 

[0587] The hydrocarbon group containing a fluorine atom may be linear, branched, or cyclic, and has preferably 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and particularly preferably 1 to 10 carbon atoms. 

[0588] It is preferable that the hydrocarbon group having a fluorine atom has 25% or more of the hydrogen atoms in the hydrocarbon group fluorinated, more preferably 50% or greater, and particularly preferably 60% or greater from the viewpoint of improving the hydrophobicity of the resist film during immersion exposure. 101 

[0589] Among these, as Rf , a fluorinated hydrocarbon group having 1 to 6 carbon atoms is preferable, and a trifluoromethyl group, ----CH 2 ----CF$_{3}$ , -CH 2 -CF 2 -CF$_{3}$ , -CH(CF 3 ) 2 , ----CH 2 ----CH 2 ----CF $_{3}$ , and ----CH 2 ----CH 2 - CF 2-CF 2-CF2----CF 3 are most preferable. 

[0590] The weight average molecular weight (Mw) (in terms of polystyrene determined by gel permeation chroma› tography) of the component (F) is preferably in a range of 1,000 to 50,000, more preferably in a range of 5,000 to 40,000, and most preferably in a range of 10,000 to 30,000. In a case where the weight average molecular weight is less than or equal to the upper limit of the above-described range, the resist composition exhibits a satisfactory solubility in a solvent for a resist enough to be used as a resist. On the other hand, in a case where the weight average molecular weight is greater than or equal to the lower limit of the above› described range, dry etching resistance and the cross-sec› tional shape of the resist pattern become excellent. 

[0591] Further, the dispersity (Mw/Mn) of the component (F) is preferably in a range of 1.0 to 5.0, more preferably in a range of 1.0 to 3.0, and most preferably in a range of 1.2 to 2.5. 

[0592] The component (F) may be used alone or in com› bination of two or more kinds thereof. 

[0593] In a case where the resist composition contains the component (F), the content of the component (F) is typically in a range of 0.5 to 10 parts by mass, with respect to 100 parts by mass of the component (A). 

[0594] As desired, other miscible additives can also be added to the resist composition of the present invention. The resist composition may contain miscible additives such as additive resins, dissolution inhibitors, plasticizers, stabiliz› ers, colorants, halation prevention agents, and dyes for improving the performance of the resist film, as appropriate. 

[0595] <<Organic Solvent Component (S)>> 

[0596] The resist composition of the present embodiment may be produced by dissolving the resist materials in an organic solvent (hereinafter, referred to as a "component (S)"). 

[0597] The component (S) may be any organic solvent which can dissolve the respective components to be used to obtain a uniform solution, and optional organic solvent can be appropriately selected from those which have been con› ventionally known as solvents for a chemically amplified resist composition and then used. 

[0598] Examples thereof include lactones such as y-buty› rolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl-n-pentyl ketone, methyl isopentyl 

ketone, and 2-heptanone; polyhydric alcohols, such as eth› ylene glycol, diethylene glycol, propylene glycol and dipro› pylene glycol; compounds having an ester bond, such as ethylene glycol monoacetate, diethylene glycol monoac› etate, propylene glycol monoacetate, and dipropylene glycol monoacetate; polyhydric alcohol derivatives including com› pounds having an ether bond, such as a monoalkylether (such as monomethylether, monoethylether, monopropyl› ether or monobutylether) or monophenylether of any of these polyhydric alcohols or compounds having an ester bond (among these, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferable); cyclic ethers such as dioxane; esters such as methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, and ethyl ethoxypro› pionate; aromatic organic solvents such as anisole, ethyl› benzylether, cresylmethylether, diphenylether, dibenzyle› ther, phenetole, butylphenylether, ethylbenzene, diethylbenzene, pentylbenzene, isopropylbenzene, toluene, xylene, cymene and mesitylene; and dimethylsulfoxide (DMSO). 

[0599] The component (S) may be used alone or in the form of a mixed solvent of two or more kinds thereof. 

[0600] Among these, PGMEA, PGME, y-butyrolactone, EL and cyclohexanone are preferable. 

[0601] Further, among the mixed solvents, a mixed sol› vent obtained by mixing PGMEA with a polar solvent is preferable. The mixing ratio (mass ratio) of the mixed solvent can be appropriately determined, taking into con› sideration the compatibility of the PGMEA with the polar solvent, but is preferably in the range of 1 :9 to 9: 1 and more preferably in a range of 2:8 to 8:2. 

[0602] More specifically, in a case where EL or cyclo› hexanone is mixed as the polar solvent, the PGMEA:EL or cyclohexanone mass ratio is preferably in a range of 1:9 to 9:1 and more preferably in a range of 2:8 to 8:2. Alterna› tively, in a case where PGME is mixed as the polar solvent, the PGMEA:PGME mass ratio is preferably in a range of 1 :9 to 9: 1, more preferably in a range of2:8 to 8:2, and still more preferably in a range of 3:7 to 7:3. Furthermore, a mixed solvent of PGMEA, PGME and cyclohexanone is also preferable. 

[0603] Further, as the component (S), a mixed solvent of at least one of PGMEA and EL with y-butyrolactone is also preferable. The mass ratio (former:latter) of such a mixed solvent is preferably in a range of 70:30 to 95:5. 

[0604] The amount of the component (S) is not particu› larly limited, and is appropriately adjusted to a concentration which enables coating of a coating solution to a substrate. In general, the component (S) is used in an amount such that the solid content of the resist composition becomes in the range of 1 % to 20% by mass and preferably in a range of 2% to 15% by mass. 

[0605] In the resist composition of the present embodi› ment, a constitutional unit having a specific structure, that is, a resin component (Al) having a constitutional unit (a0) represented by Formula (a0-1) and a constitutional unit (1) containing an acid decomposable group whose polarity is increased due to the action of an acid is employed as described above. 

[0606] The tertiary carbon atom-containing group that protects the oxy group (---0-) side of the carbonyloxy 

