[0762] The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms, because the coat› ability of the resist composition becomes satisfactory. Spe› cific examples include an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an n-pentyl group, an isopentyl group, a cyclopentyl group and a hexyl group, and an n-butyl group and an isopentyl group are particularly desirable. 

[0763] The halogen atom, with which hydrogen atoms of the alkyl group may be substituted, is preferably a fluorine atom. 

[0764] The aryl group for R$^{73 }$and R$^{74 }$is not particularly limited. For example, an aryl group having 6 to 12 carbon atoms may be used in which part or all of the hydrogen atoms of the aryl group may or may not be substituted with alkyl groups, alkoxy groups, halogen atoms, or the like. 

[0765] The aryl group is preferably an aryl group having 6 to 10 carbon atoms because it can be synthesized at a low cost. Specific examples thereof include a phenyl group, a benzyl group and a naphthyl group. 

[0766] The alkyl group, with which hydrogen atoms of the aryl group may be substituted, is preferably an alkyl group having 1 to 5 carbon atoms, and more preferably a methyl group, an ethyl group, a propyl group, an n-butyl group, or a tert-butyl group. 

[0767] The alkoxy group, with which hydrogen atoms of the aryl group may be substituted, is preferably an alkoxy group having 1 to 5 carbon atoms, and more preferably a methoxy group or an ethoxy group. 

[0768] The halogen atom, with which hydrogen atoms of the aryl group may be substituted, is preferably a fluorine atom. 73 

[0769] Alternatively, in general formula (sl’-1), R and R$^{74 }$may be bonded to each other to form a ring. 

[0770] In this case, R$^{73 }$and R$^{74 }$each independently repre› sents a linear or branched alkylene group (preferably an alky› lene group of 1 to 10 carbon atoms) and the terminal ofR 73 and the terminal of R$^{74 }$are bonded to each other to form a ring. Further, a carbon atom of the alkylene group may be substituted with an oxygen atom. 

[0771] Specific examples of such ether-based organic sol› vents include 1,8-cineole, tetrahydrofuran and dioxane. 

[0772] The boiling point (at normal pressure (atmospheric pressure)) of the component (S2) is preferably within a range from 30 to 300° C., more preferably from 100 to 200° C., and still more preferably from 140 to 180° C. When the boiling point of the component (S2) is at least as large as the lower limit of the above-mentioned temperature range, the compo› nent (S) hardly evaporates during the spin coating process when applying the resist composition of the present inven› tion, thereby suppressing coating irregularities and improv› ing the resulting coating properties. On the other hand, when the boiling point of the component (S2) is no more than the upper limit of the above-mentioned temperature range, the component (S) is satisfactorily removed from the resist film by a prebake (PAB) treatment, thereby improving formability of the resist film. Further, when the boiling point of the component (S2) is within the above-mentioned temperature range, the effect of reducing the thickness loss of the resist patterns and the stability of the composition upon storage are further improved. The above-mentioned temperature range for the boiling point of the component (S2) is also preferable from the viewpoints of the heating temperature required in the PAB step and/or PEB step. 

[0773] Specific examples of the component (S2) include 1,8-cineole (boiling point: 176° C.), dibutyl ether (boiling point: 142° C.), diisopentyl ether (boiling point: 171 ° C.), dioxane (boiling point: 101 ° C.), anisole (boiling point: 155° C.), ethylbenzyl ether (boiling point: 189° C.), diphenyl ether (boiling point: 259° C.), dibenzyl ether (boiling point: 297° C.), phenetole (boiling point: 170° C.), butylphenyl ether, tetrahydrofuran (boiling point: 66° C.), ethylpropyl ether (boiling point: 63° C.), diisopropyl ether (boiling point: 69° C.), dihexyl ether (boiling point: 226° C.), dipropyl ether (boiling point: 91 ° C.), and cresylmethyl ether. 

[077 4] These components (S2) can be used either alone, or in combinations of two or more different solvents. 

[0775] In the present invention, the component (S2) is pref› erably a cyclic or chain-like, ether-based organic solvent because the effect of reducing the thickness loss of the resist patterns becomes satisfactory, and it is particularly desirable that the component (S2) be at least one member selected from the group consisting of 1,8-cineole, dibutyl ether and diiso› pentyl ether. 

[0776] [Component (S3)] 

[0777] In addition to the component (S 1 ), or in addition to the components (Sl) and (S2), the component (S) may also include an organic solvent other than the components (Sl) and (S2) (hereafter, referred to as "component (S3)"), as long as the effects of the present invention are not impaired. 

[0778] The component (S3) may be any organic solvent which can dissolve the resist materials to give a uniform solution, and any one or more kinds of organic solvents can be appropriately selected from those which have been conven› tionally known as solvents for a chemically amplified resist. 

[0779] By further including the component (S3), the solu› bility of the components (A), (B) and the like, and other properties can be adjusted. 

[0780] Examples of the component (S3) include lactones such as y-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl-n-pentyl ketone, methyl isopentyl ketone, and 2-heptanone; polyhydric alcohols, such as ethylene glycol, diethylene glycol, propylene glycol and dipropylene glycol; compounds having an ester bond, such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, and dipropylene glycol monoacetate; polyhydric alcohol derivatives including com› pounds having an ether bond, such as a monoalky !ether (e.g., monomethylether, monoethylether, monopropylether or monobutylether) or monophenylether of any of these polyhy› dric alcohols or compounds having an ester bond (among these, propylene glycol monomethyl ether acetate (PGMEA; boiling point: 146° C.) and propylene glycol monomethyl ether (PGME; boiling point: 120° C.) are preferable); esters such as methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, and ethyl ethoxypropionate; aro› matic organic solvents such as ethylbenzene, diethylbenzene, pentylbenzene, isopropylbenzene, toluene, xylene, cymene and mesitylene; dimethyl sulfoxide (DMSO); and alcohol› based organic solvents having a boiling point of less than 150° C. (hereafter, referred to as "component (S3a)"), such as n-pentyl alcohol (boiling point: 138.0° C.), s-pentyl alcohol (boiling point: 119.3° C.), t-pentyl alcohol (boiling point: 101.8° C.), isopentyl alcohol (boiling point: 130.8° C.), isobutanol (also called isobutyl alcohol or 2-methyl-1-pro› panol) (boiling point: 108° C.), isopropyl alcohol (boiling point: 82.3° C.), 2-ethylbutanol (boiling point: 147° C.), neo- 

