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# c19) United States c12) Patent Application Publication 

# KAWANO et al. 

# (54) COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL 

(75) Inventors: Takatsugu KAWANO, Kanagawa (JP); Takeyoshi KANO, Kanagawa (JP) 

(73) Assignee: FUJIFILM CORPORATION, Tokyo (JP) 

(21) Appl. No.: 12/910,884 

(22) Filed: Oct. 25, 2010 

## (30) Foreign Application Priority Data 

Oct. 29, 2009 (JP) ................................. 2009-249382 

<img src='content_image/923467.jpg'>

(51) Int. Cl. 

(52) U.S. Cl. ................ 428/195.1; 430/270.1; 430/286.1; 430/283.1; 430/324 

## (57) ABSTRACT 

The present invention provide a composition for forming a layer to be plated, including a solution in which from 1 % by mass to 20% by mass of a polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group, and a water-in› soluble photopolymerization initiator are dissolved in a mixed solvent comprising from 20% by mass to 99% by mass of a water-soluble flammable liquid and water; a method of producing a metal pattern material using the composition for forming a layer to be plated; and a metal pattern material produced by the method. 

US 20110104454Al 

# c10) Pub. No.: US 2011/0104454 Al 

# (43) Pub. Date: May 5, 2011 

## Publication Classification 

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