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# c19) United States c12) Patent Application Publication 

# TSUCHIMURA 

# (54) RADIATION-SENSITIVE OR ACTINIC RAY-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, MASK BLANK, RESIST PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE 

(71) Applicant: FUJIFILM Corporation, Tokyo (JP) 

(72) Inventor: Tomotaka TSUCHIMURA, Shizuoka (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

(21) Appl. No.: 15/352,662 

(22) Filed: Nov. 16, 2016 

(63) Continuation of application No. PCT/JP2015/ 065083, filed on May 26, 2015. 

## (30) Foreign Application Priority Data 

Jun. 19, 2014 (JP) ................................. 2014-126652 

(51) Int. Cl. 

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## Related U.S. Application Data 

## Publication Classification 

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(52) U.S. Cl. CPC ............ G03F 710382 (2013.01); G03F 71322 (2013.01); G03F 712004 (2013.01); G03F 712037 (2013.01); C08F 212114 (2013.01); G03F 71162 (2013.01); G03F 1120 (2013.01); G03F 1122 (2013.01) 

## (57) ABSTRACT 

A radiation-sensitive or actinic ray-sensitive resin composi› tion contains a polymer compound (A) including a structural part (a) that is decomposed by irradiation with actinic rays or radiation to generate an acid anion on a side chain and a repeating unit (b) that is represented by the following Formula (I), in the formula, R$_{3 }$ represents a hydrogen atom, an organic group, or a halogen atom, A$_{1 }$ represents an aromatic ring group or an alicyclic group. R$_{1 }$ and R$_{2 }$ each independently represent an alkyl group, a cycloalkyl group, or an aryl group, at least two of A$_{1}$ , R$_{1}$ , or R$_{2 }$ may be bonded to each other to form a ring. B$_{1 }$ and L$_{1 }$ each independently represent a single bond or a divalent linking group, X represents a hydrogen atom or an organic group, n represents an integer of 1 or greater. 

US 20170059990Al 

# c10) Pub. No.: US 2017 /0059990 Al 

# (43) Pub. Date: Mar. 2, 2017 

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