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# c19) United States c12) Patent Application Publication 

# Kobata et al. 

# (54) ELECTROCHEMICAL MECHANICAL POLISHING APPARATUS CONDITIONING METHOD, AND CONDITIONING SOLUTION 

(76) Inventors: Itsuki Kobata, Tokyo (JP); Yasushi Toma, Kanagawa-ken (JP); Akira Kodera, Kanagawa-ken (JP); Tsukuru Suzuki, Kanagawa-ken (JP); Yuji Makita, Kanagawa-ken (JP); Takayuki Saito, Kanagawa-ken (JP) 

Correspondence Address: WENDEROTH, LIND & PONACK, L.L.P. 2033 K STREET N. W., SUITE 800 WASHINGTON, DC 20006-1021 

(21) Appl. No.: 12/068,300 

(22) Filed: Feb.5,2008 

## (30) Foreign Application Priority Data 

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<img src='content_image/922764.jpg'>

(51) Int. Cl. B24B 49100 (2006.01) 

(52) U.S. Cl. ............................................................ 451/8 

## (57) ABSTRACT 

An electrochemical mechanical polishing apparatus is for use in polishing of a conductive material ( e.g., metal) on a surface of a substrate by combination of electrochemical action and mechanical action. This apparatus includes a polishing table having divided electrodes and adapted to hold a polishing pad having a polishing surface, a polishing head adapted to hold a workpiece having a conductive film and to press the work› piece against the polishing surface, a second electrode for supplying an electric current to the conductive film, an elec› trolytic-solution supply section for supplying an electrolytic solution to the polishing surface, a detecting section adapted to detect a signal corresponding to a thickness of the conduc› tive film, a variable resistance unit having the same number of variable resistors as the number of divided electrodes, a mov› ing mechanism for providing relative movement between the workpiece and the polishing surface, and a control section adapted to control each of the variable resistors based on the signal from the detecting section. 

US 20080188162Al 

# c10) Pub. No.: US 2008/0188162 Al 

# (43) Pub. Date: Aug. 7, 2008 

## Publication Classification 

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