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## 2.2.4 DS8900F base frames 

a. For more details see “I/O enclosure adapters” on page 46 

As mentioned in 2.1.1, “Storage system” on page 24, the DS8900F is available in different racked and rack mounted models. The frame model number is determined by the configuration and the hardware version. The specific combinations are shown in Table 2-1 on page 24. 

Note:  The DS8910F model 994 and the DS8950F model 996 always comes with a base frame which consists of a new 40U high-end rack with a reduced footprint, height and depth. The DS8910F model 993 doesn’t have a base frame. 

The DS8900F base frames accommodate the following components: 

GLYPH<SM590000> High-Performance Flash Enclosure Gen2 (HPFE Gen2), in the following configurations: 

– Up to four HPFE Gen2 enclosure pairs in the base frame. 

The flash drives are installed in groups of 16 called an install group. This install group is ordered as a set with one feature code. Each HPFE Gen2 enclosure pair can accommodate 16, 32, or 48 flash drives. 

Flash drives are available in 800 GB, 1.6 TB, 1.92 TB, 3.2 TB, 3.84 TB, 7.68 TB, and 15.36TB capacities. For more information about the HPFE, refer to the IBM Redbooks publication, IBM DS8000 High-Performance Flash Enclosure Gen2 , REDP-5422. 

Note:  The 1.92 TB flash drives can be used in the DS8910F models 993/994 only and are not available on the DS8950F models 996/E96. 

All enclosures have redundant power and integrated cooling, which draw air from front to rear. For more information about cooling requirements, see Chapter 7, “IBM DS8900F physical planning and installation” on page 179. 

GLYPH<SM590000> The rack power subsystem 

The DS8900F family introduced a simplified rack power distribution by using the intelligent Power Distribution Units (iPDUs) supporting single- or three-phase power in all models. Each iPDU has its own dedicated input AC power cord. A choice of various AC input connector line cords for different regions are available. 

