a pronounced undercut where further this undercut has a significant exposure latitude during processing of the resist where these properties are imparted by the formulation itself during normal processing and do not depend upon optical manipulation of exposure tool parameters such as defocus settings. Herein is described a novel high sensitivity chemi› cally amplified i-line photoresist formulation which unex› pectedly, when exposed and processed, gives a pronounced undercut which has a wide exposure latitude. The pro› nounced undercut enabling for an easier lift off process after metallization of these resist patterns. 

[0013] In one of its aspects, the present invention relates to a chemically-amplified, negative-acting, photoresist com› position, imageable by 365 nm radiation that is developable in aqueous base, wherein the photoresist composition com› prises, along with a solvent, the following solids compo› nents: 

[0014] a) an aqueous base soluble phenolic film-form› ing polymeric binder resin having ring bonded hydroxyl groups. 

[0015] b) a photoacid generator that forms an acid upon exposure to radiation at 365 nm, in an amount sufficient to initiate crosslinking of the film-forming binder resin. 

[0016] c) a crosslinking agent that forms a carbonium ion upon exposure to the acid from step b) generated by exposure to radiation, and which comprises an etheri› fied melamine. 

[0017] d) a dye having a molar attenuation coefficient at 365 nm ranging from about 1.61xl0 $^{4 }$to about 1.07xl04 mole-$^{1 }$L cm- 1 . 

[0018] e) a quencher system consisting essentially of an amine quencher, or a mixture of such amine quenchers, having a pKa in water from about 6.0 to about 12, where the amine quencher has a boiling point of at least 100° C., at 1 atmosphere pressure, and comprises at least one C2-C25 alkyl substituent, a -(CH$_{2}$)nOH substituent, or a -(CH$_{2}$)nO-(CH$_{2}$)n’---0-R’ sub› stituent or comprises a mixture of these substituents, where n and n’ are independently an integer ranging from 2 to 4 and R’ is a Cl-C4 alkyl or H. 

[0019] Other aspects of this invention are the processes of coating on a substrate and imaging the above photoresist with 365 nm, or broadband radiation containing a 365 nm component, to produced features which have a large under› cut profile with a good exposure latitude and also the processes of using such profile in a metallization/lift off approach. 

[0020] FIG. 1 Shows non-limiting examples of i-line (broadband) photoacid generators which generate sulfonic, and other strong acids. 

[0021] FIG. 2 Shows non-limiting examples of i-line (broadband) trihalo photoacid generators which generate either HCl or HBr. 

[0022] FIG. 3 Compares the undercut lithographic perfor› mance when using a photoresist formulation containing Monazoline C but without a DI-dye compared to a formation containing both Monazoline C and the DI-dye 

[0023] FIG. 4 Compares the undercut lithographic perfor› mance when using a photoresist formulation containing a 

## SUMMARY OF THE INVENTION 

## BRIEF DESCRIPTION OF THE DRAWINGS 

DI-dye, but without Monazoline C compared to a formation containing both Monazoline C and the DI-dye 

[0024] FIG. 5 Compares the undercut lithographic perfor› mance of two photoresist formulations both containing Monazoline C and DI-dye but where one contains an Mine PAG which generates HCl and the second photoresist con› tains instead an i-line PAG which generates a sulfonic acid. 

[0025] FIG. 6 Compares the undercut lithographic perfor› mance of two photoresist formulations Example 7 Using AI quencher and Example 8 Using MNNE quencher. 

[0026] FIG. 7 Compares the undercut lithographic perfor› mance of two photoresist formulations Comparative Example 8 using TPA quencher and Example 9 using 2El quencher. 

[0027] FIG. 8 Shows extended undercut lithographic per› formance of two photoresist formulations of Examples 10, using N-Methyldipropylamine quencher and Example 11, using N,N-diisopropylethylamine quencher respectively 

[0028] FIG. 9 Shows the undercut lithographic perfor› mance of two photoresist formulations using Tris-isobu› tylamine quencher at two different concentrations of Examples 12 and 13. 

[0029] FIG. 10 Compares the undercut profiles of two photoresist formulations of Examples 14 and 15, using different dyes, Coumarin 7 dye and DI dye respectively. 

[0030] It is to be understood that both the foregoing general description and the following detailed description are illustrative and explanatory, and are not restrictive of the subject matter, as claimed. In this application, the use of the singular includes the plural, the word "a" or "an" means "at least one", and the use of "or" means "and/or", unless specifically stated otherwise. Furthermore, the use of the term "including", as well as other forms such as "includes" and "included", is not limiting. Also, terms such as "ele› ment" or "component" encompass both elements and com› ponents comprising one unit and elements or components that comprise more than one unit, unless specifically stated otherwise. As used herein, the conjunction "and" is intended to be inclusive and the conjunction "or" is not intended to be exclusive unless otherwise indicated. For example, the phrase "or, alternatively" is intended to be exclusive. As used herein, the term "and/or" refers to any combination of the foregoing elements including using a single element. 

[0031] The section headings used herein are for organiza› tional purposes and are not to be construed as limiting the subject matter described. All documents, or portions of documents, cited in this application, including, but not limited to, patents, patent applications, articles, books, and treatises, are hereby expressly incorporated herein by refer› ence in their entirety for any purpose. In the event that one or more of the incorporated literature and similar materials defines a term in a manner that contradicts the definition of that term in this application, this application controls. 

[0032] Herein, unless otherwise indicated, alkyl refers to hydrocarbon groups which can be linear, branched ( e.g. methyl, ethyl, propyl, isopropyl, tert-butyl and the like) or cyclic (e.g. cyclohexyl, cyclopropyl, cyclopentyl and the like) multicyclic (e.g. norbornyl, adamantly and the like). These alkyl moieties may be substituted or unsubstituted as described below. The term alkyl refers to such moieties with C-1 to C-20 carbons. It is understood that for structural reasons linear alkyls start with C-1, while branched alkyls 

## DETAILED DESCRIPTION 

