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photomask, the composition layer to be plated was formed on the entire surface of the substrate, and a plated film having a thickness of 18 µm was produced by whole surface electro less plating and electroplating. 

[0449] With respect to the plated film thus obtained, a cross cut test (JIS-K5600) was carried out. From the result that peeling of even 1 of 100 squares was not observed, it is understood that the formed metal film has a sufficient adhe› siveness to the substrate. 

[0450] Evaluation of Sensitivity 

[0451] In the above-described Examples and Comparative Examples, the coated film of the composition for forming a layer to be plated was cured while fixing the exposure amount at 3000 ml, followed by development. When film formation was exhibited, it was evaluated as "O", and when film forma› tion was not exhibited, it was evaluated as "X". The results are shown in Table 1 below. 

[0452] Evaluation of Drying Time 

[0453] In the above-described Examples and Comparative Examples, when sufficient drying was obtained at 80° C. for 5 minutes, it was evaluated as "A"; when a sufficient drying was obtained at 120° C. for 15 minutes, it was evaluated as "B"; when drying at 120° C. for 60 minutes was necessary, it was evaluated as "C", and when drying at 120° C. for 60 minutes was insufficient, it was evaluated as "D". The deter› mination as to whether drying time is sufficient or insufficient was performed as follows. 

[0454] In a case in which the coated film of the composition for forming a layer to be plated was dried, when the amount of a remaining solvent was 5% by weight or less with respect to the weight of the film, the drying time is determined to be sufficient. In contrast, when the amount was more than 5% by weight, the drying time was determined to be insufficient. The amount of remaining solvent was measured as follows. 

[0455] A value obtained by subtracting a weight of the substrate before coating from a weight of substrate provided with a coated film thereon after drying was designated as a total weight of the solvent and the film. Further, a value obtained by subtracting a weight of the substrate before coat› ing from a weight of the substrate after curing, developing and drying a whole surface of the film provided on the substrate was designated as a weight of the film. The amount of remain› ing solvent was obtained by subtracting the above-described weight of the film from the above-described total weight of the solvent and the film. The results are shown in the follow› ing Table 1. 

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[0456] From the results of Examples 1 to 9 and Compara› tive Examples 1 to 3, it can be seen that a pattern is formed at high sensitivity and a metal pattern having high resolution can be easily obtained in Examples using the composition for forming a layer to be plated according to the invention. Fur› ther, in comparison of Examples 1 to 7 with Examples 8 and 9, it can be seen that when a water-alcohol mixed solvent is used as the water-water-soluble flammable liquid mixed sol› vent, the effect of the invention is conspicuous. On the other hand, in the composition of Comparative Examples 1 and 2 in which the amount of alcohol in a water-alcohol mixed solvent was small, the water-insoluble photopolymerization initiator was not homogeneously dissolved, resolution of the formed pattern was deteriorated, and in the composition of Compara› tive Example 3 not containing water-insoluble photopoly› merization initiator, a cured film was not formed. 

[0457] All publications, patent applications, and technical standards mentioned in this specification are herein incorpo› rated by reference to the same extent as if each individual publication, patent applications, or technical standards was specifically and individual indicated to be incorporated by reference. 

What is claimed is: 

1. A composition for forming a layer to be plated, the composition comprising a solution in which from 1 % by mass to 20% by mass of a polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group, and a water-in› soluble photopolymerization initiator are dissolved in a mixed solvent comprising from 20% by mass to 99% by mass of a water-soluble flammable liquid and water. 

2. The composition for forming a layer to be plated accord› ing to claim 1, wherein the water-insoluble photopolymeriza› tion initiator is included in the range of from 1 % by mass to 20% by mass with respect to the polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group. 

3. The composition for forming a layer to be plated accord› ing to claim 1, wherein the water-soluble flanimable liquid comprises an alcohol-based solvent. 

4. The composition for forming a layer to be plated accord› ing to claim 1, wherein the water-insoluble photopolymeriza› tion initiator comprises a compound having an absorbance peak in the range of from 250 nm to 400 nm. 

5. The composition for forming a layer to be plated accord› ing to claim 1, wherein, in the polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group, the functional group that forms an interaction with a plating catalyst or a precursor thereof comprises a non-dissociative functional group or an ionic polar group that forms an inter› action with a plating catalyst or a precursor thereof. 

6. The composition for forming a layer to be plated accord› ing to claim 5, wherein the non-dissociative functional group comprises an ether group, or a cyano group. 

7. The composition for forming a layer to be plated accord› ing to claim 5, wherein the ionic polar group comprises a carboxylic acid group. 

8. The composition for forming a layer to be plated accord› ing to claim 1, wherein the radical polymerizable group com› prises an acryloyl group, a methacryloyl group, an acryla› mide group, a methacrylamide group, an ally! group, a vinyl group, or a styryl group. 

