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# c12) United States Patent Hirano et al. 

# (54) ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN 

(71) Applicant: FUJIFILM Corporation, Minato-Ku, Tokyo (JP) 

(72) Inventors: Shuji Hirano, Shizuoka (JP); Hiroo Takizawa, Shizuoka (JP); Hideaki Tsubaki, Shizuoka (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

( * ) Notice: Subject to any disclaimer, the term ofthis patent is extended or adjusted under 35 U.S.C. 154(b) by O days. 

(21) Appl. No.: 14/229,210 

(22) Filed: Mar. 28, 2014 

## (65) Prior Publication Data 

US 2014/0227636 Al Aug. 14, 2014 

(63) Continuation of application No. PCT/JP2012/075867, filed on Sep. 28, 2012. 

(60) Provisional application No. 61/548,032, filed on Oct. 17, 2011. 

## (30) Foreign Application Priority Data 

Sep. 30, 2011 (JP) ................................. 2011-217048 

(51) Int. Cl. 

<img src='content_image/886522.jpg'>

(52) U.S. Cl. CPC .............. G03F 710388 (2013.01); C08F 12108 (2013.01); C08F 212108 (2013.01); C08F 220128 (2013.01); G03F 710045 (2013.01); G03F 710046 (2013.01); G03F 710392 (2013.01); G03F 710397 (2013.01); G03F 710758 (2013.01); G03F 7111 (2013.01); G03F 712041 (2013.01) 

(58) Field of Classification Search CPC ..... G03F 7/004; G03F 7/0045; G03F 7/0046; G03F 7/0388; G03F 7/0392; G03F 7/397; G03F 7/11; G03F 7/2041; C08F 212/08; C08F 12/08; C08F 236/10 

## Related U.S. Application Data 

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# (IO) Patent No.: US 9,323,150 B2 

# Apr. 26, 2016 (45) Date of Patent: 

## (56) References Cited 

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English Translation of IPRP issued in PCT/JP2012/075867 dated Apr. 10, 2014. 

Primary Examiner - Amanda C Walke 

(74) Attorney, Agent, or Firm - Sughrue Mion, PLLC 

## (57) ABSTRACT 

Provided is an actinic-ray- or radiation-sensitive resin com› position including a resin (Aa) containing at least one repeat› ing unit (Aal) derived from monomers of general formula (aal-1) below and at least one repeating unit (Aa2) derived from monomers of general formula (aa2-1) below and com› prising a resin (Ab) that when acted on by an acid, changes its alkali solubility. 

USPC .............. 430/270.1, 913, 311, 322,325,329; 526/243, 242, 251 See application file for complete search history. 

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US009323150B2 

## U.S. PATENT DOCUMENTS 

(Continued) 

## FOREIGN PATENT DOCUMENTS 

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## OTHER PUBLICATIONS 

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## 22 Claims, No Drawings 

