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9. The composition for forming a layer to be plated accord› ing to claim 1, wherein the polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group comprises a copolymer which comprises a unit represented by the follow› ing Formula (A) and a unit represented by the following Formula (B): 

<img src='content_image/939185.jpg'>

<img src='content_image/939186.jpg'>

wherein, in Formula (A) and Formula (B), R$^{1 }$to R 5 each independently represent a hydrogen atom, or a substi› tuted or unsubstituted alkyl group; X, Y, and Z each independently represent a single bond, a substituted or unsubstituted divalent organic group, an ester group, an amide group, or an ether group; L $^{1 }$and L $^{2 }$each indepen› dently represent a single bond, or a substituted or unsub› stituted divalent organic group; and W represents an ionic polar group that forms an interaction with a plating catalyst or a precursor thereof. 

10. The composition for forming a layer to be plated according to claim 9, wherein the unit represented by For› mula (B) comprises an alicyclic carboxylic group at a termi› nal of the unit. 

11. The composition for forming a layer to be plated according to claim 9, wherein, in Formula (B), Wis a car› boxylic acid group, and a chain length ofL $^{2 }$is in the range of from 6 atoms to 18 atoms. 

12. The composition for forming a layer to be plated according to claim 9, wherein, in Formula (B), Wis a car› boxylic acid group, and both X and L $^{2 }$are each a single bond. 

13. The composition for forming a layer to be plated according to claim 9, wherein the value of ionic polarity or an acid value of the unit represented by Formula (B) is in the range of from 1.5 mmol/g to 10.0 mmol/g. 

14. The composition for forming a layer to be plated according to claim 9, wherein the polymer having a func› tional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group comprises a copolymer further comprising a unit represented by the following Formula (C): 

(A) 

(B) 

15. The composition for forming a layer to be plated according to claim 1, wherein the content of the water-soluble flammable liquid in the mixed solvent is in the range of from 30% by mass to 80% by mass. 

16. The composition for forming a layer to be plated according to claim 7, wherein the composition further com› prises an additive selected from the group consisting of sodium hydrogen carbonate, sodium carbonate and sodium hydroxide. 

17. The composition for forming a layer to be plated according to claim 1, wherein the water-insoluble photopo› lymerization initiator comprises a benzoin compound or a derivative thereof; a benzyl ketal-based compound or a derivative thereof; a hydroxy ketone-based compound or a derivative thereof; a benzophenone-based compound or a derivative thereof; an acetophenone-based compound or a derivative thereof; an a-aminoalkyl phenone-based com› pound or a derivative thereof; a bisacyl phosphinoxide-based compound or a derivative thereof; an acyl phosphinoxide› based compound or a derivative thereof; a thioxanthone› based compound or a derivatives thereof; an anthraquinone› based compound or a derivative thereof; or an oxime ester› based compound or a derivative thereof. 

18. A method of producing a metal pattern material com› prising: 

<img src='content_image/939187.jpg'>

wherein, in Formula (C), R $^{6 }$represents a hydrogen atom, or a substituted or unsubstituted alkyl group; X represents a single bond, a substituted or unsubstituted divalent organic group, an ester group, an amide group, or an ether group; L $^{3 }$represents a single bond, or a substituted or unsubstituted divalent organic group; and V repre› sents a non-dissociative functional group that forms an interaction with a plating catalyst or a precursor thereof. 

coating the composition for forming a layer to be plated according to claim 1 on or above a substrate or an adhe› sion-aiding layer to form a coated film for forming a layer to be plated, and then applying energy to the coated film for forming a layer to be plated and curing the coated film at a portion to which the energy has been applied; 

forming a patterned layer by developing an uncured por› tion of the coated film on or above the substrate or the adhesion-aiding layer with an aqueous solution; 

applying a plating catalyst or a precursor thereof to the patterned layer; and 

plating the plating catalyst or the precursor thereof. 

(C) 

