content_image/891917.jpg content_image/891938.jpg
<img src='content_image/891917.jpg'>

wherei~, in General Formula (II-2), each ofRgi, Rg$_{2}$ , and Rg$_{3 }$ mdependently represents an alkyl group, an alkenyl group, a cycloalkyl group, or an aryl group; n81 represents 0 or 1; and at least two of Rg$_{1 }$ to Rg$_{3 }$ may be connected to each other to form a ring, and 

<img src='content_image/891938.jpg'>

w~erein, in Formula (V), each of Rg$_{1}$ , Rg$_{2}$ , and Rg$_{3 }$ mdependently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkoxycarbonyl group; here, Rg$_{2 }$ may be bonded to Lg to form a ring, and Rg$_{2 }$ in this case represents a single bond or an alkylene group; Xg represents a single bond or a divalent connecting group; Lg represents a single bond or an (s+l) valent connect› ing group, and in the case of being bonded to Rg$_{2 }$ to form a ring, represents an (s+2) valent connecting group; s represents an integer of 1 to 5; here, in a case where Lg is a single bond, s is 1; and Bg represents a group containing a cross-linking group. 

46. The active light-sensitive or radiation-sensitive resin composition according to claim 45, 

wherein a cross-linking group included in Bg in General Formula (V) is a hydroxymethyl group, an alkoxym› ethyl group, an oxirane ring, or an oxetane ring. 

47. The active light-sensitive or radiation-sensitive resin composition according to claim 45, 

wherein Bg in General Formula (V) is a group which has a phenol structure, a urea structure, or a melamine structure, having a hydroxymethyl group or an alkoxymethyl group. 

48. The active light-sensitive or radiation-sensitive resin composition according to claim 47, 

wherein Bg in General Formula (V) is a group which has a phenol structure having a hydroxymethyl group or an alkoxymethyl group, provided that the hydroxymethyl group is not directly bonded to a nitrogen atom, and the alkoxymethyl group is not directly bonded to a nitrogen atom. 

49. The active light-sensitive or radiation-sensitive resin composition according to claim 45, 

wherein the content of the repeating unit represented by General Formula (V) is 1 mo! % to 20 mo! % with respect to the entirety of repeating units in the resin (A). 

50. The active light-sensitive or radiation-sensitive resin composition according to claim 45, 

wherein the bond between X$_{4 }$ and L$_{4 }$ in General Formula (I) is a single bond. 

51. The active light-sensitive or radiation-sensitive resin composition according to claim 45, 

wherein the content of the repeating unit represented by General Formula (I) is 10 mo! % to 40 mo! % with respect to the entirety of repeating units in the resin (A). 

52. The active light-sensitive or radiation-sensitive resin composition according to claim 45, 

wherein the active light-sensitive or radiation-sensitive resin composition further includes a compound (B) that generates an acid by active light or radiation. 

53. The active light-sensitive or radiation-sensitive resin composition according to claim 52, 

wherein the compound (B) that generates an acid by active light or radiation is a compound that generates an acid having a volume of 240 Angstroms 3 or greater. 

54. A resist film which is formed using the active light- sensitive or radiation-sensitive resin composition according to claim 45. 

* * * * * 

