content_image/915300.jpg content_image/915301.jpg content_image/915302.jpg content_image/915303.jpg content_image/915304.jpg content_image/915305.jpg content_image/915306.jpg content_image/915307.jpg content_image/915308.jpg content_image/915309.jpg content_image/915310.jpg
<img src='content_image/915300.jpg'>

<img src='content_image/915301.jpg'>

<img src='content_image/915302.jpg'>

<img src='content_image/915303.jpg'>

<img src='content_image/915304.jpg'>

<img src='content_image/915305.jpg'>

<img src='content_image/915306.jpg'>

-continued 

<img src='content_image/915307.jpg'>

<img src='content_image/915308.jpg'>

<img src='content_image/915309.jpg'>

<img src='content_image/915310.jpg'>

The compound represented by formula (A) can be syn- thesized by referring to, for example, JP-A-2007-298569 and JP-A-2009-199021. 

In the present invention, as for the low molecular weight compound (D), one compound may be used alone, or two or more compounds may be mixed and used. 

The composition of the present invention may or may not contain the low molecular compound (D), but in the case of containing the compound (D), the content thereof is usually from 0.001 to 20 mass%, preferably from 0.001 to 10 mass %, more preferably from 0.01 to 5 mass%, based on the total solid content of the composition combined with the basic compound. 

In the case where the composition of the present invention contains an acid generator, the ratio between the acid gen› erator and the compound (D) used in the composition is preferably acid generator/[compound (D)+basic compound] (by mol)=from 2.5 to 300. That is, the molar ratio is preferably 2.5 or more in view of sensitivity and resolution and is preferably 300 or less from the standpoint of sup› pressing the reduction in resolution due to thickening of the resist pattern over time after exposure until heat treatment. The acid generator/[compound (D)+basic compound] (by mo!) is more preferably from 5.0 to 200, still more prefer› ably from 7.0 to 150. 

Other examples of the basic compound which can be used in the composition of the present invention include com- pounds synthesized in Examples of JP-A-2002-363146 and compounds described in paragraph 0108 of JP-A-2007- 298569. 

-continued 

