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In the formulae, each of L $^{1 }$to L $^{8 }$independently represents a hydrogen atom, a hydroxymethyl group, an alkoxymethyl group (preferably a methoxymethyl group or an ethoxym› ethyl group) or an alkyl group having a carbon number of 1 to 6. 

The amount added of the crosslinking agent is preferably from 3 to 70 mass %, more preferably from 5 to 50 mass %, based on the total solid content of the actinic ray-sensitive or radiation-sensitive resin composition. 

[5] Compound Having a Molecular Weight of3,000 or Less and being Capable of Decomposing by an Action of an Acid to Increase the Solubility in an Alkali Developer 

The positive actinic ray-sensitive or radiation-sensitive resin composition of the present invention may further con› tain a dissolution inhibiting compound having a molecular weight of3,000 or less and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer (hereinafter, sometimes referred to as "dissolution inhibiting compound"). In order to prevent reduction in the transparency to light of220 nm or less, the dissolution inhib- iting compound is preferably an alicyclic or aliphatic com› pound containing an acid-decomposable group, such as acid› decomposable group-containing cholic acid derivatives described in Proceeding of SPIE, 2724, 355 (1996). Examples of the acid-decomposable group are the same as those described above for the acid-decomposable unit. 

In the case where the composition according to the present invention is exposed to a KrF excimer laser or irradiated with an electron beam, the dissolution inhibiting compound is preferably a compound containing a structure where a phe› nolic hydroxyl group of a phenol compound is substituted with an acid-decomposable group. The phenol compound is preferably a compound containing from 1 to 9 phenol frame› works, more preferably from 2 to 6 phenol frameworks. 

The amount added of the dissolution inhibiting compound is preferably from 3 to 50 mass %, more preferably from 5 to 40 mass%, based on the total solid content of the composi› tion. 

Specific examples of the dissolution inhibiting compound are illustrated below, but the present invention is not limited thereto. 

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[ 6] Other Components 

The positive or negative actinic ray-sensitive or radiation› sensitive resin composition according to the present invention may further contain a basic compound, an organic solvent, a surfactant, a dye, a plasticizer, a photosensitizer, a compound for accelerating dissolution in developer, a compound having a proton acceptor functional group, and the like. 

(Basic Compound) 

The composition according to the present invention may further contain a basic compound. When a basic compound is further contained, the change of the performance over time between exposure and heating (post-bake) can be more reduced. Also, when thus contained, the in-film diffusion of an acid generated upon exposure can be controlled. 

The basic compound is preferably a nitrogen-containing organic compound. The compound that can be used is not particularly limited, but, for example, compounds in the fol› lowing categories (1) to (5) can be used. 

