a layer to be plated and subsequent leaving thereof to stand for 10 minutes, occurrence of precipitation was not seen by visual observation. 

[ 043 2] A metal pattern material having a copper plated film was obtained in the same manner as Example 6 except that the composition F for forming a layer to be plated, used in Example 6, was changed to the above obtained composition I for forming a layer to be plated. 

[0433] Preparation of Composition J for Forming a Layer to be Plated 

[0434] 0.70 g (6.97% by mass) of the specific polymer A (solid content:87% by mass), 8.56 g (85.24% by mass) of water and 0.24 g (2.39% by mass) of sodium hydrogen car› bonate were mixed and stirred to prepare a solution contain› ing the specific polymer A dissolved therein. Separately, 0.5 g (4.98% by mass) of methanol, 0.021 g (0.21% by mass) of water-insoluble photopolymerization initiator (IRGACURE 907 used in Example 1) and 0.021 g (0.21% by mass) of surfactant (Aqalon RN-20, trade name, manufactured by DAI-ICHI KOGYO SEIYAKU CO., LTD.) were mixed and dissolved to prepare a solution, and then the resultant solution was slowly added while stirring to the solution containing the specific polymer A dissolved therein so as to disperse the photopolymerization initiator therein. The resultant liquid was heated at 60° C. for 8 hours, and methanol was removed. A quantity of water equal to the decreased weight was added. Thereafter, filtration with #420 filter cloth (pore size: 60.5 µm) was carried out, so that solids having a large dispersion size were removed to produce a composition J for forming a layer to be plated ( dispersion liquid) of Comparative Example 1. At this time, the content of methanol contained in the water-alcohol mixed solvent was 5.51 % by mass. Further, after the production of the composition J for forming a layer to be plated of Comparative Example 1 and subsequent leav› ing thereof to stand for 10 minutes, occurrence of precipita› tion was seen by visual observation. 

[0435] A metal pattern material having a copper plated film was obtained in the same manner as Example 1 except that the composition A for forming a layer to be plated, used in Example 1, was changed to the above obtained composition J for forming a layer to be plated. 

[0436] Preparation of Composition K for Forming a Layer to be Plated 

[0437] 8.9 g of water, 0.37 g ofNaHCO$_{3}$ , and 0.66 g of the specific polymer B (the above-described structure, solid con› tent: 99% by mass, weight average molecular weight: 16,000) were mixed and stirred to prepare a solution containing the specific polymer B dissolved therein. Separately, 0.5 g of methanol, 0.021 g of water-insoluble photopolymerization initiator (IRGACURE 907) and 0.021 g of surfactant (Aqalon RN-20) were mixed and dissolved to prepare a solution, and then the resultant solution was slowly added while stirring to the solution containing the specific polymer B dissolved therein so as to disperse the water-insoluble photopolymer› ization initiator therein. The resultant liquid was heated at 60° C. for 8 hours, and methanol was removed. A quantity of water equal to the decreased weight was added. Thereafter, filtration with #420 filter cloth was carried out, so that solids having a large dispersion size were removed to produce a 

## Comparative Example 1 

## Comparative Example 2 

composition k for forming a layer to be plated ( dispersion liquid) of Comparative Example 2. At this time, the content of methanol contained in the water-alcohol mixed solvent was 0% by mass. Further, after the production of the composition K for forming a layer to be plated of Comparative Example 2 and subsequent leaving thereof to stand for 10 minutes, occur› rence of precipitation was seen by visual observation. 

[0438] A metal pattern material having a copper plated film was obtained in the same manner as Example 1 except that the composition A for forming a layer to be plated, used in Example 1, was changed to the above obtained composition K for forming a layer to be plated. 

[0439] Preparation of Composition L for Forming a Layer to be Plated 

[0440] 0.30 g (7.5% by mass) of the specific polymer A (solid content: 87% by mass) used in Example 1, 0.07 g (1.75% by mass) of sodium hydrogen carbonate, 1.63 g (40. 6% by mass) ofwaterand2.0 g (49.9% by mass) of methanol were mixed while stirring to dissolve the specific polymer A, followed by further stirring to prepare a composition L for forming a layer to be plated of Comparative Example 3. 

[0441] The same manner as Example 1 was carried out except that the composition A for forming a layer to be plated, used in Example 1, was changed to the above-obtained com› position L for forming a layer to be plated. 

[0442] Evaluation of Pattern-Forming Performance 

[0443] The plated film produced by using each of the com› positions for forming a layer to be plated, obtained in Examples 1 to 8, had a thickness of 1 µm, and a metal pattern having high resolution of mask size of –1 % or less was confirmed by observation using an optical microscope. It was confirmed that the metal pattern obtained in Example 9 is a metal pattern having high resolution of mask size of –5% or less. 

[0444] The plated films produced by using the composition for forming a layer to be plated, obtained in Comparative Examples 1 and 2, had a thickness of 1 µm. It was confirmed that the metal pattern obtained by using a photomask having line and space of300 µm had a wiring width exhibiting a 40% to 50% increase. In the composition obtained without filtra› tion by a filter cloth, spaces between wirings were filled in (metal pattern having a wiring width exhibiting a 100% or more increase), and formation of a pattern having high reso› lution was difficult. 

[0445] Further, pattern formation was attempted using the composition for forming a layer to be plated, not containing the water-insoluble photopolymerization initiator obtained in Comparative Example 3, but a film was not formed. 

[0446] Line and space of the pattern obtained in the above› described Examples and Comparative Examples were mea› sured. With respect to the line width of line and space of the photomask used in pattern exposure, when a fluctuation range of the wiring width was less than 1 %, it was evaluated as "O"; when a fluctuation range of the line width was from 1 % to less than 5%, it was evaluated as "li."; and when a fluctuation range of the line width was 5% or more, it was evaluated as "X". In this evaluation, "O" and "ti." are levels where there are no practical problems. The results are shown in Table 1 below. 

[0447] Evaluation of Adhesion 

[0448] Using the composition for forming a layer to be plated, each obtained in Examples 1 to 9 and Comparative Examples 1 to 2, and carrying out exposure thereto without a 

## Comparative Example 3 

