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# c19) United States c12) Patent Application Publication 

# TSUBAKI et al. 

# (54) PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE 

(71) Applicant: FUJIFILM CORPORATION, TOKYO (JP) 

(72) Inventors: Hideaki TSUBAKI, Shizuoka (JP); Hiroo TAKIZAWA, Shizuoka (JP); Takeshi KAWABATA, Shizuoka (JP) 

(73) Assignee: FUJIFILM CORPORATION, TOKYO (JP) 

(21) Appl. No.: 14/227,444 

(22) Filed: Mar. 27, 2014 

(63) Continuation of application No. PCT/JP2012/072285, filed on Aug. 28, 2012. 

## (30) Foreign Application Priority Data 

Sep.30,2011 (JP) ................................. 2011-218549 

## Related U.S. Application Data 

<img src='content_image/900899.jpg'>

(51) Int. Cl. 

(52) U.S. Cl. CPC . G03F 7120 (2013.01); G03F 71038 (2013.01) USPC ............. 430/18; 430/296; 430/325; 430/319; 430/270.1; 430/285 .1 

## (57) ABSTRACT 

A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a devel› oper containing an organic solvent by an action of an acid and (B) a low molecular weight compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and decomposing by an action of an acid to decrease a solubility of the low molecular weight com› pound (B) in an organic solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step ( 4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern. 

US 20140199617Al 

# c10) Pub. No.: US 2014/0199617 Al 

# (43) Pub. Date: Jul. 17, 2014 

## Publication Classification 

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