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PAG-14 

PAG-15 

PAG-16 

PAG-17 

PAG-18 

PAG-19 

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[0349] <Compound (C) Having at Least One Oxygen Atom> 

[0350] The compound (C) contained in the composition of the present invention is not particularly limited as long as it is a compound having at least one oxygen atom. However, the compound (C) does not include the resin (A) and the com› pound (B) as described above. 

[0351] In one embodiment of the present invention, the compound (C) preferably contains two or more groups or bonds selected from the group consisting of an ether bond, a hydroxyl group, an ester bond, and a ketone bond, more preferably contains three or more of the groups or bonds, and still more preferably contains four or more of the groups or bonds. In this case, groups or bonds selected from the ether bonds, the hydroxyl groups, the ester bonds, and the ketone bonds contained in plural numbers in the compound (C) may be the same as or different from each other. 

[0352] In one embodiment of the present invention, the molecular weight of the compound (C) is preferably 3,000 or less, more preferably 2,500 or less, still more preferably 2,000 or less, and particularly preferably 1,500 or less. The molecular weight of the compound (C) is typically 100 or more, preferably 150 or more, more preferably 200 or more, still more preferably 300 or more, and particularly preferably 500 or more. 

[0353] Incidentally, in the present specification, in the case where there is a distribution of the molecular weight of the compound (C), the molecular weight of the compound (C) is intended to be the weight-average molecular weight of the compound (C). A method for calculating the weight-average molecular weight is the same as above. 

[0354] Moreover, in one embodiment of the present inven› tion, the number of carbon atoms contained in the compound (C) is preferably 8 or more, more preferably 9 or more, and still more preferably 10 or more. 

[0355] Incidentally, in one embodiment of the present invention, the number of carbon atoms contained in the com› pound (C) is preferably 30 or less, more preferably 20 or less, and still more preferably 15 or less. 

[0356] Moreover, in one embodiment of the present inven› tion, the compound (C) is preferably a compound having a boiling point of 200° C. or higher, more preferably a com› pound having a boiling point of 220° C. or higher, and still more preferably a compound having a boiling point of 240° C. or higher. Further, the boiling point refers to a boiling point at 1 atm. 

[0357] In particular, the compound (C) is preferably a com› pound having an ether bond, more preferably a compound having at least two ether bonds, still more preferably a com› pound having three or more ether bonds, and particularly preferably a compound having four or more ether bonds. 

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PAG-20 

