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# c12) United States Patent 

# Miyabe et al. 

# (54) POLISHING COMPOSITION FOR SEMICONDUCTOR WAFER, METHOD FOR PRODUCTION THEREOF AND POLISHING METHOD 

(75) Inventors: Shinsuke Miyabe, Tokyo (JP); Kuniaki Maejima, Tokyo (JP); Masahiro Izumi, Tokyo (JP); Hiroaki Tanaka, Kanagawa (JP) 

(73) Assignee: Nippon Chemical Industrial Co., Ltd., Tokyo (JP) 

( *) Notice: Subject to any disclaimer, the term ofthis patent is extended or adjusted under 35 U.S.C. 154(b) by O days. 

(21) Appl. No.: 12/153,111 

May 14, 2008 (22) Filed: 

## (65) Prior Publication Data 

US 2008/0287038 Al Nov. 20, 2008 

## (30) Foreign Application Priority Data 

May 18, 2007 (JP) ............................. 2007-132223 

(51) Int. Cl. 

<img src='content_image/933837.jpg'>

(52) U.S. Cl. ............................. 51/308; 51/307; 51/309; 106/3; 438/691; 438/692; 438/693; 438/694 

(58) Field of Classification Search ........... 51/307-309; 106/3; 438/691-694 See application file for complete search history. 

<img src='content_image/933849.jpg'>

# (IO) Patent No.: US 7,753,974 B2 

# Jul. 13, 2010 (45) Date of Patent: 

## (56) References Cited 

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## FOREIGN PATENT DOCUMENTS 

<img src='content_image/933840.jpg'>

* cited by examiner 

Primary Examiner-Anthony J Green 

Assistant Examiner-Pegah Parvini 

(74) Attorney, Agent, or Firm-Edwards Angell Palmer & DodgeLLP 

## (57) ABSTRACT 

The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishing composition, and a polishing method. The polishing composition for a semiconductor wafer comprises an acid and an aqueous medium dispersion containing positively-charged silica particles having an amino group-containing silane coupling agent bonded on a surface thereof, the polishing composition having a pH of 2 to 6. 

US007753974B2 

## U.S. PATENT DOCUMENTS 

## 7 Claims, No Drawings 

