group as provided as the resin (A). The repeating unit having the group (z) which is decomposed by the action of an acid may have at least one of a fluorine atom or a silicon atom. With respect to the hydrophobic resin (HR), the content of the repeating unit having a group (z) which is decomposed due to an action of an acid is preferably 1 to 80 mo! %, more preferably 10 to 80 mo!%, and even more preferably 20 to 60 mo! % with respect to all repeating units in the resin (HR). 

[0442] The hydrophobic resin (HR) may further have a repeating unit different from the repeating unit described above. 

[0443] The repeating unit containing a fluorine atom is preferably 10 to 100 mo! % and more preferably 30 to 100 mo! % with respect to the all repeating units included in the hydrophobic resin (HR). The repeating unit including a silicon atom is preferably 10 to 100 mo! % and more preferably 20 to 100 mo! % with respect to the all repeating units included in the hydrophobic resin (HR). 

[0444] Meanwhile, particularly, in a case where the hydro› phobic resin (HR) includes a CH$_{3 }$ partial structure in a side chain moiety, an aspect in which the hydrophobic resin (HR) does not substantially contain a fluorine atom and a silicon atom is also preferable. Also, it is preferable that the hydrophobic resin (HR) is substantially constituted only by repeating units constituted only by atoms selected from a carbon atom, an oxygen atom, a hydrogen atom, a nitrogen atom, and a sulfur atom. 

[0445] The weight-average molecular weight of the hydrophobic resin (D) in terms of standard polystyrene is preferably in the range of 1,000 to 100,000 and more preferably in the range of 1,000 to 50,000. 

[0446] The content of the hydrophobic resin (HR) in the composition is preferably 0.01 to 10 mass % and more preferably 0.05 to 8 mass % with respect to the total solid content in the composition according to the embodiment of the present invention. 

[0447] The hydrophobic resin (HR) may be used singly and two or more kinds thereof may be used in combination. In a case where two or more hydrophobic resins (HR) are used in combination, it is preferable that the total content is in the above range. 

[0448] In the hydrophobic resin (HR), the content of the residual monomer or oligomer components is preferably 0.01 to 5 mass% and more preferably 0.01 to 3 mass%. The molecular weight distribution (Mw/Mn, hereinafter, also referred to as a "dispersion degree") is preferably in the range of 1 to 5 and more preferably in the range of 1 to 3. [0449] As the hydrophobic resin (HR), various kinds of commercially available products may be used, or the hydro› phobic resin (HR) may be synthesized by a general method (for example, radical polymerization). 

[0450] The composition according to the embodiment of the present invention generally contains a solvent. 

[0451] Examples of the solvent that can be used in pre› paring the composition include organic solvents such as alkylene glycol monoalkyl ether carboxylate, alkylene gly› col monoalkyl ether, lactic acid alkyl ester, alkyl alkoxy› propionate, cyclic lactone (preferably having 4 to 10 carbon atoms), a monoketone compound which may have a ring (preferably having 4 to 10 carbon atoms), alkylene carbon› ate, alkyl alkoxyacetate, and alkyl pyruvate. 

## Solvent 

[0452] Specific examples of these solvents include sol› vents disclosed in paragraphs <0441> to <0455> of US2008/0187860A. 

[0453] According to the present invention, a mixed sol› vent obtained by mixing a solvent containing a hydroxyl group in a structure and a solvent not containing a hydroxyl group may be used as the organic solvent. 

[0454] As the solvent containing a hydroxyl group in a structure and the solvent not containing a hydroxyl group, the example compounds described above can be appropri› ately selected, but the solvent containing a hydroxyl group is preferably alkylene glycol monoalkyl ether and lactatic acid alkyl ester and more preferably propylene glycol monomethyl ether (PGME, also known as l-methoxy-2- propanol), methyl 2-hydroxyisobutyrate, and ethyl lactate. As the solvent not containing a hydroxyl group, alkylene glycol monoalkyl ether acetate, alkyl alkoxy propionate, a monoketone compound that may contain a ring, cyclic lactone, and alkyl acetate are preferable. Among these, propylene glycol monomethyl ether acetate (PGMEA, also referred to as l-methoxy-2-acetoxypropane), ethyl ethoxy› propionate, 2-heptanone, y-butyrolactone, cyclohexanone, and butyl acetate are more preferable, and propylene glycol monomethyl ether acetate, ethyl ethoxypropionate, and 2-heptanone are even more preferable. 

[0455] The mixing ratio (mass) of the solvent containing a hydroxyl group and the solvent not containing a hydroxyl group is 1/99 to 99/1, preferably 10/90 to 90/10, and more preferably 20/80 to 60/40. A mixed solvent containing 50 mass % or more of the solvent not containing a hydroxyl group is particularly preferable in view of coating unifor› mity 

[0456] The solvent preferably includes propylene glycol monomethyl ether acetate and is preferably a single solvent of propylene glycol monomethyl ether acetate or a mixed solvent of two or more kinds containing propylene glycol monomethyl ether acetate. 

[0457] The composition according to the embodiment of the present invention may not further contain a surfactant, but in a case where the composition contains a surfactant, and a fluorine-based and/or silicon-based surfactant (fluo› rine-based surfactant, silicon-based surfactant, and surfac› tant having both of fluorine atom and silicon atom) are preferable. 

[0458] In a case where the composition according to the embodiment of the present invention contains a surfactant, in a case where an exposure light source having 250 nm or lower, particularly 220 nm or lower is used, a resist pattern having excellent adhesiveness and fewer development defects can be applied at favorable sensitivity and resolu› tions. 

[0459] Examples of the fluorine-based and/or silicon› based surfactants include surfactants disclosed in paragraph <0276> of US2008/0248425A. 

[0460] According to the present invention, surfactants other than fluorine-based and/or silicon-based surfactants disclosed in paragraph <0280> ofUS2008/0248425A can be used. 

[0461] These surfactants may be used singly, or several kinds thereof may be used in combination. 

## Other Additives 

## Surfactant 

