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8. The active light-sensitive or radiation-sensitive resin composition according to claim 1, wherein a boiling point of the compound (C) is 200° C. or higher. 

9. The active light-sensitive or radiation-sensitive resin composition according to claim 1, wherein a boiling point of the compound (C) is 220° C. or higher. 

10. The active light-sensitive or radiation-sensitive resin composition according to claim 1, wherein a content of the compound (C) is 30 parts by mass or less with respect to 100 parts by mass of the resin (A). 

11. The active light-sensitive or radiation-sensitive resin composition according to claim 1, further comprising an acid diffusion control agent (D). 

12. The active light-sensitive or radiation-sensitive resin composition according to claim 1, wherein the compound (C) has a partial structure represented by the following General Formula (1): 

<img src='content_image/932010.jpg'>

wherein in General Formula (1 ), R$_{11 }$represents analkylene group which may have a substituent, n represents an integer of 1 or more, and * represents a bonding hand. 

General Formula (1) 

13. The active light-sensitive or radiation-sensitive resin composition according to claim 12, wherein in General For› mula (1 ), n represents an integer of 4 to 8. 

14. A pattern forming method comprising: 

(1) forming a resist film on a substrate using the active light-sensitive or radiation-sensitive resin composition according to claim 1; 

(2) exposing the resist film; and 

(3) developing the exposed resist film using a developer containing an organic solvent to form a resist pattern. 

15. The pattern forming method according to claim 14, further comprising: 

providing a top coat on the resist film. 

16. The pattern forming method according to claim 15, wherein the top coat includes a hydrophobic resin having a repeating unit having a CH$_{3 }$ partial structure in a side chain portion. 

17. The pattern forming method according to claim 15, wherein the top coat includes a basic compound. 

18. The pattern forming method according to claim 15, wherein the top coat is formed of a top coat composition including a hydrophobic resin and an alcohol-based solvent. 

* * * * * 

