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# c12) United States Patent 

# Takizawa et al. 

# (54) PATTERN FORMING METHOD, COMPOSITION KIT AND RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THESE, AND ELECTRONIC DEVICE 

(71) Applicant: FUJIFILM Corporation, Tokyo (JP) 

(72) Inventors: Hiroo Takizawa, Shizuoka (JP); Shuji Hirano, Shizuoka (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

( *) Notice: Subject to any disclaimer, the term ofthis patent is extended or adjusted under 35 U.S.C. 154(b) by O days. 

(21) Appl. No.: 14/921,524 

(22) Filed: Oct. 23, 2015 

## (65) Prior Publication Data 

US 2016/0048075 Al Feb. 18, 2016 

(63) Continuation of application No. PCT/JP2014/060522, filed on Apr. 11, 2014. 

## (30) Foreign Application Priority Data 

Apr. 26, 2013 (JP) ................................. 2013-094403 

(51) Int. Cl. 

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(52) U.S. Cl. CPC .............. G03F 71039 (2013.01); C08F 20128 (2013.01); C08F 220128 (2013.01); G03F 71004 (2013.01); G03F 710397 (2013.01); G03F 7111 (2013.01); G03F 7120 (2013.01); G03F 712004 (2013.01); G03F 712037 (2013.01); G03F 7132 (2013.01); C08F 2220/283 (2013.01) 

( 58) Field of Classification Search CPC .... G03F 7/2041; G03F 7/0397; G03F 7/2004; G03F 7/11 USPC .......... 430/270.1, 273.1, 326, 907, 942, 905 See application file for complete search history. 

## (56) References Cited 

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## Related U.S. Application Data 

## U.S. PATENT DOCUMENTS 

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# (IO) Patent No.: US 10,031,419 B2 

# (45) Date of Patent: Jul. 24, 2018 

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Search Report dated Jul. 8, 2014, issued by the International Searching Authority in counterpart International Application No. PCT/JP2014/060522 (PCT/ISA/210). Written Opinion dated Jul. 8, 2014, issued by the International Searching Authority in counterpart International Application No. PCT/JP2014/060522 (PCT/ISA/237). Translation of Written Opinion dated Jul. 8, 2014, issued by the International Searching Authority in counterpart International Application No. PCT/JP2014/060522 (PCT/ISA/237). Office Action dated Oct. 25, 2016, issued by the Japanese Patent Office in counterpart Japanese Application No. 2013-094403. Office Action dated Nov. 16, 2016 issued by the Korean Intellectual Property Office in counterpart Korean Patent Application No. 10-2015-7030825. 

Primary Examiner - John S Chu 

(74) Attorney, Agent, or Firm - Sughrue Mion, PLLC 

## (57) ABSTRACT 

There is provided a pattern forming method comprising (i) forming a film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a resin which decomposes due to an action of an acid to change its solubility with respect to a developer and (C) a specific resin, (ii) forming a top coat layer using a top coat composition which contains a resin (T) on the film, (iii) exposing the film which has the top coat layer to actinic rays or radiation, and (iv) forming a pattern by developing the film which has the top coat layer after the exposing. 

US010031419B2 

## FOREIGN PATENT DOCUMENTS 

## OTHER PUBLICATIONS 

(Continued) 

## 18 Claims, No Drawings 

