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When the resist composition contains the acid generator of addition type, an appropriate amount of the generator added is 0.1 to 50 parts, more preferably 1 to 40 parts by weight per 100 parts by weight of the base resin. 

## Other Components 

The resist composition may further comprise any addi› tives such as a quencher, dissolution regulator, surfactant, and acetylene alcohol. 

The addition of the quencher to the resist composition is effective, for example, for reducing the rate of acid diffusion in the resist film, thus contributing to a further improvement in resolution. Suitable quenchers are basic compounds including those described in JP-A 2008-111103, paragraphs [0146]-[0164] (U.S. Pat. No. 7,537,880). Preferred are pri› mary, secondary and tertiary amine compounds, specifically amine compounds having a hydroxyl group, ether bond, ester bond, lactone ring, cyano group or sulfonic ester bond. An appropriate amount of the basic compound added as the quencher is Oto 100 parts, more preferably 0.001 to 50 parts by weight per 100 parts by weight of the base resin. 

Also useful are quenchers of polymer type as described in JP-A2008-239918 (U.S. Pat. No. 7,598,016). The polymeric quencher segregates at the resist surface after coating and thus enhances the rectangularity of resist pattern. When a protective film is applied on the resist film, the polymeric 

