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[0284] The resin (A) may have a repeating unit having an alkali-soluble group. Examples of the alkali-soluble group include a carboxy group, a sulfonamide group, a sulfonylim› ide group, a bissulfonylimide group, and aliphatic alcohol (for example, hexafluoroisopropanol group) of which the a-position is substituted with an electron withdrawing group. Examples of the repeating unit having an alkali› soluble group include repeating units disclosed in para› graphs <0085> and <0086> of JP2014-098921A. 

[0285] The resin (A) may further have a repeating unit having an alicyclic hydrocarbon structure which does not have a polar group (for example, alkali-soluble group, a hydroxyl group, and a cyano group) and not exhibiting acid decomposability. Examples of the repeating unit include repeating units disclosed in paragraphs <0114> to <0123> of JP2014-106299A. 

[0286] For example, the resin (A) may include repeating units disclosed in paragraphs <0045> to <0065> of JP2009- 258586A. 

[0287] The resin (A) used in the composition according to the embodiment of the present invention may include vari› ous repeating units in addition to the repeating unit. Examples of the repeating units include repeating units corresponding to the following monomers, but the repeating units are not limited thereto. 

[0288] Examples of the monomer include a compound having one addition polymerizable unsaturated bond selected from acrylic acid esters, methacrylic acid esters, acrylamides, methacrylamides, ally! compounds, vinyl ethers, and vinyl esters. 

[0289] In addition, in a case of an addition polymerizable unsaturated compound copolymerizable with the monomer corresponding to the above various repeating structural units, the compound may be copolymerized. 

[0290] With respect to the resin (A) used in the compo› sition according to the embodiment of the present invention, the content molar ratio of each of the repeating structural units is appropriately set. 

[0291] In a case where the composition according to the embodiment of the present invention is for ArF exposure, in view of transparency to ArF light, it is preferable that the resin (A) used in the composition according to the embodi› ment of the present invention has substantially no aromatic group. Specifically, during the entire repeating unit of the resin (A), the content of the repeating unit having an aromatic group is preferably 5 mo! % or less, more prefer› ably 3 mo! % or less, and ideally 0 mo! % with respect to the all repeating units, that is, it is more preferable to not have a repeating unit having an aromatic group. The resin (A) preferably has a monocyclic or polycyclic alicyclic hydro› carbon structure. 

[0292] The weight-average molecular weight (Mw) of the resin (A) is preferably 1,000 to 200,000 and more preferably 2,000 to 20,000. In a case where the weight-average molecu› lar weight is caused to be 1,000 to 200,000, it is possible to prevent deterioration of heat resistance and dry etching resistance and it is possible to prevent deterioration of developability and deterioration of lam formability due to increase in viscosity. 

[0293] A dispersion degree (molecular weight distribu› tion) which is a ratio (Mw/Mn) of a weight-average molecu› lar weight (Mw) and a number-average molecular weight (Mn) in the resin (A) is generally 1.0 to 3.0, preferably 1.0 to 2.6, more preferably 1.0 to 2.0, and even more preferably 

in the range of 1.1 to 2.0. As the molecular weight distri› bution is smaller, a resolution and a resist shape are excel› lent, a sidewall of a resist pattern is smooth, and roughness properties are excellent. 

[0294] A content ratio of the resin (preferably the resin (A)) in the total composition is preferably in the range of30 to 99 mass % and more preferably in the range of 50 to 95 mass % with respect to the total solid content. 

[0295] The resin (preferably the resin (A)) may be used singly, and two or more kinds thereof may be used in combination. In a case where two or more resins (preferably the resin (A)) are used in combination, it is preferable that the total content is in the above range. 

[0296] The actinic ray-sensitive or radiation-sensitive resin composition according to the embodiment of the present invention may contain a basic compound. 

[0297] The basic compound is not particularly limited, and well-known basic compounds can be used. 

[0298] In a case where the actinic ray-sensitive or radia› tion-sensitive resin composition contains a basic compound, the content of the basic compound is generally 0.001 to 10 mass % and preferably 0.01 to 5 mass % with respect to the solid content of the composition. 

[0299] Hereinafter, the basic compound that can be pref› erably used in the actinic ray-sensitive or radiation-sensitive resin composition according to the embodiment of the present invention is described. 

## Compound Having Structure Represented by Formula (A) to (E)) 

[0300] Examples of the basic compound include com› pounds having structures represented by Formulae (A) to (E). 

<img src='content_image/936521.jpg'>

<img src='content_image/936522.jpg'>

<img src='content_image/936523.jpg'>

<img src='content_image/936524.jpg'>

<img src='content_image/936525.jpg'>

[0301] In Formulae (A) and (E), 200 201 

[0302] R , R , and R $^{202 }$may be identical to or different from each other, and represent hydrogen atoms, alkyl groups (preferably having 1 to 20 carbon atoms), cycloalkyl groups (preferably, having 3 to 20 carbon atoms), or aryl groups (having 6 to 20 carbon atoms). Here, R$^{201 }$and R$^{202 }$may be bonded to each other, so as to form a ring. 

## Basic Compound 

(A) 

(B) 

(C) 

(D) 

(E) 

