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# c12) United States Patent 

# Sasaki 

# (54) POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME 

(75) Inventor: Tomoya Sasaki, Shizuoka (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

( *) Notice: Subject to any disclaimer, the term ofthis patent is extended or adjusted under 35 U.S.C. 154(b) by 120 days. 

(21) Appl. No.: 11/234,187 

(22) Filed: Sep.26,2005 

## (65) Prior Publication Data 

US 2006/0068322 Al Mar. 30, 2006 

## (30) Foreign Application Priority Data 

Sep.24,2004 (JP) ......................... P. 2004-278320 

(51) Int. Cl. G03F 71039 (2006.01) 

(52) U.S. Cl. .................... 430/270.1; 430/176; 430/326; 430/907 

(58) Field of Classification Search .............. 430/270.1, 430/176, 326, 907 See application file for complete search history. 

## (56) References Cited 

<img src='content_image/888929.jpg'>

## U.S. PATENT DOCUMENTS 

<img src='content_image/888938.jpg'>

# (IO) Patent No.: US 7,410,747 B2 

# (45) Date of Patent: Aug. 12, 2008 

<img src='content_image/888927.jpg'>

## FOREIGN PATENT DOCUMENTS 

<img src='content_image/888928.jpg'>

European Search Report dated Dec. 7, 2005. 

* cited by examiner 

Primary Examiner-Cynthia Hamilton 

(74) Attorney, Agent, or Firm-Sughrue Mion, PLLC 

## (57) ABSTRACT 

A positive resist composition satisfying high sensitivity, high resolution and good line edge roughness at the same time, and a pattern forming method using the composition, are pro› vided, which is a positive resist composition comprising (A) a resin of which solubility in an alkali developer increases under the action of an acid, the resin containing a repeating unit having a specific styrene skeleton and a repeating unit having a specific ring structure, and (B) a compound of gen› erating an acid upon irradiation with actinic rays or radiation; and a pattern forming method using the composition. 

US007 4107 4 7B2 

## OTHER PUBLICATIONS 

## 20 Claims, No Drawings 

