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<img src='content_image/1002676.jpg'>

Consider the following points: 

GLYPH<SM590000> IDX is an air-to-water heat exchange inside the frame 

GLYPH<SM590000> Used to remove heat from the frame air stream and reject it to system water 

GLYPH<SM590000> System water rejects heat to building chilled water 

GLYPH<SM590000> Water turbulators are used to improve HX efficiency 

In addition to the PU SCMs cold plates, the internal water loop circulates through heat exchangers that are mounted on each frame in the configuration. These exchangers are in the path of the exhaust air in the rear of the frames. 

Depending on the configuration, these heat exchangers remove up to 93% of the residual heat from the I/O drawers, PCIe I/O drawer, the air-cooled logic in the CPC drawer, and the power enclosures. The goal is for two-thirds of the total heat that is generated to be removed from the room by the chilled water. 

