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# ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 

## CROSS-REFERENCE TO RELATED APPLICATIONS 

[0001] This application is a Continuation of PCT Interna› tional Application No. PCT/JP2017/021494 filed on Jun. 9, 2017, which claims priority under 35 U.S.C § 119(a) to Japanese Patent Application No. 2016-170028 filed on Aug. 31, 2016 and Japanese Patent Application No. 2017-009460 filed on Jan. 23, 2017. Each of the above application(s) is hereby expressly incorporated by reference, in its entirety, into the present application. 

## BACKGROUND OF THE INVENTION 

[0002] The present invention relates to an act1mc ray› sensitive or radiation-sensitive resin composition, a resist film, a pattern forming method, and a method of manufac› turing an electronic device. 

[0003] In the related art, microfabrication by lithography using a radiation-sensitive resin composition has been per› formed in the process of manufacturing a semiconductor device such as an integrated circuit (IC) and a large scale integrated circuit (LSI). 

[0004] For example, JP5900255B discloses a radiation› sensitive resin composition containing a monosulfonic acid› type acid generator which is cleaved upon irradiation with radiation. The acid generated by cleavage of the acid gen› erator has a function of making a deprotection reaction of the resin component in the composition occur or a crosslinking reaction of the resin component occur. 

[0005] In the section of the example of JP5900255B, as described below, an acid generator having a structure in which a portion of hydrogen atoms on carbon atoms (in other words, on the carbon atoms bonded to the sulfonic acid ion) at the a-position of a sulfonic acid ion is substituted with fluorine atoms is specifically disclosed. 

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## SUMMARY OF THE INVENTION 

[0006] The present inventors have conducted research on the actinic ray-sensitive or radiation-sensitive resin compo› sition containing the acid generator specifically described in the section of the example of JP5900255B and found that, in a case where the actinic ray-sensitive or radiation-sensitive 

## 1. Field of the Invention 

## 2. Description of the Related Art 

resin composition is preserved for a predetermined period of time, a temporal change such as the increase of the number of particles or the decrease of the sensitivity easily occurs. That is, the present inventors have found that it is necessary to further improve the preservation stability. 

[0007] The present inventors also have found that a resist pattern forming by the actinic ray-sensitive or radiation› sensitive resin composition containing the acid generator needs to be further improved even in the pattern line width roughness (LWR). 

[0008] Accordingly, an object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition which has excellent preservation stability and has small pattern line width roughness (LWR) in a case where a resist pattern is formed. 

[0009] Another object of the present invention is to pro› vide a resist film, a pattern forming method, and a method of manufacturing an electronic device, each of which uses the actinic ray-sensitive or radiation-sensitive resin compo› sition. 

[0010] As a result of diligent research so as to achieve the above object, the present inventors have found that the aforementioned objects can be achieved by causing the actinic ray-sensitive or radiation-sensitive resin composition to contain a compound which generates an acid having a specific structure so as to complete the present invention. 

[0011] That is, the present inventors have found that the above objects can be achieved by the following configura› tions. 

[0012] (1) An actinic ray-sensitive or radiation-sensitive resin composition comprising: a compound that generates an acid represented by Formula (I) by irradiation with an actinic ray or radiation; and a resin. 

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[0013] (2) The actinic ray-sensitive or radiation-sensitive resin composition according to (1), wherein, in Formula (I), R 1 represents a hydrocarbon group having 1 to 20 carbon atoms. 

[0014] (3) The actinic ray-sensitive or radiation-sensitive resin composition according to (1) or (2), wherein, in Formula (I), R $^{2 }$represents a hydrocarbon group having 2 to 20 carbon atoms which may include a hetero atom. 

[0015] ( 4) The actinic ray-sensitive or radiation-sensitive resin composition according to any one of (1) to (3), wherein, in Formula (I), R 1 is a linear or branched alkyl group, and R $^{2 }$is an alkyl group having 2 to 20 carbon atoms. 

[0016] (5) The actinic ray-sensitive or radiation-sensitive resin composition according to any one of (1) to ( 4), in Formula (I), n is 1. 

[0017] (6) The actinic ray-sensitive or radiation-sensitive resin composition according to any one of (1) to (5), wherein the resin is a resin that is decomposed due to an action of an acid to increase polarity. 

[0018] (7) A resist film that is formed of the actinic ray-sensitive or radiation-sensitive resin composition according to any one of (1) to (6). 

(I) 

