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# c19) United States c12) Patent Application Publication 

# KOJIMA et al. 

# (54) ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 

(71) Applicant: FUJIFILM Corporation, Tokyo (JP) 

(72) Inventors: Masafumi KOJIMA, Shizuoka (JP); Daisuke ASAKAWA, Shizuoka (JP); Akiyoshi GOTO, Shizuoka (JP); Keita KATO, Shizuoka (JP); Keiyu OU, Shizuoka (JP) 

(73) Assignee: FUJIFILM Corporation, Tokyo (JP) 

(21) Appl. No.: 16/286,984 

(22) Filed: Feb. 27, 2019 

(63) Continuation of application No. PCT/JP2017/ 021494, filed on Jun. 9, 2017. 

## (30) Foreign Application Priority Data 

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(51) Int. Cl. 

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## Related U.S. Application Data 

## Publication Classification 

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(52) U.S. Cl. CPC .......... G03F 710045 (2013.01); G03F 712004 (2013.01); C07C 309/17 (2013.01); C07C 309/16 (2013.01); C07C 309/19 (2013.01); G03F 710046 (2013.01); C07C 2603/74 (2017.05); C07C 317106 (2013.01); C07C 317112 (2013.01); C07D 295/185 (2013.01); G03F 7132 (2013.01); C07C 2601/14 (2017.05); C07C 309107 (2013.01) 

## (57) ABSTRACT 

An actinic ray-sensitive or radiation-sensitive resin compo› sition contains a compound that generates an acid repre› sented by Formula (I) by irradiation with an actinic ray or radiation, and a resin. The resist film is formed of the actinic ray-sensitive or radiation-sensitive resin composition. In the pattern forming method and the method of manufacturing an electronic device, the actinic ray-sensitive or radiation› sensitive resin composition is used. 

US 20190196326Al 

# c10) Pub. No.: US 2019/0196326 Al 

# (43) Pub. Date: Jun. 27, 2019 

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