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[0452] As the hydrophobic resins (HR), in addition to the above, those described in JP-A-2011-248019, JP-A-2010- 175859 and JP-A-2012-032544 can also be preferably used. 

[0453] It is especially preferred to use the hydrophobic resin (HR) having an acid-decomposable group. [3] (B) Compound Capable of Generating an Acid Upon Irradiation with an Actinic Ray or Radiation 

[0454] The actinic ray-sensitive or radiation-sensitive resin composition according to the invention may contain (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation (hereinafter abbreviated to "acid generator (B)"). 

[0455] The acid generator (B) may take the form of a low molecular compound, or may take the form of being included in a part of a polymer. Also, the form as a low molecular compound and the form of being included in a part of a polymer may be used in combination. 

[0456] When the acid generator (B) takes the form of a low molecular compound, the molecular weight is preferably 3,000 or less, more preferably 2,000 or less, and still more preferably 1,000 or less. 

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[0457] In the case where the acid generator (B) takes the form of being included in a part of a polymer, the acid gen› erator (B) may be included in a part of the resin (P) and constitute the resin (P), or may be included in a resin different from the resin (P). 

[0458] In the invention, the acid generator (B) preferably takes the form of a low molecular compound. 

[0459] The preferred form of the acid generator (B) is an onium compound. As such a form of the acid generator (B), for example, a sulfonium salt, an iodonium salt, and a phos› phonium salt are exemplified. 

[0460] As preferred other form of the acid generator (B), a compound capable of generating a sulfonic acid, an imidic acid, or a methide acid upon irradiation with an actinic ray or radiation can be exemplified. As the acid generator (B) in that form, for example, a sulfonium salt, an iodonium salt, a phosphonium salt, an oxime sulfonate, an imidosulfonate and the like can be exemplified. 

[0461] The acid generator (B) is preferably a compound capable of generating an acid upon irradiation with an elec› tron beam or an extreme ultraviolet ray. 

[0462] The actinic ray-sensitive or radiation-sensitive resin composition according to the invention may contain or may not contain the acid generator (B), but when contains the acid generator (B), the content is preferably 0.1 % by mass to 30% by mass, more preferably 0.5% by mass to 20% by mass, and still more preferably 1.0% by mass to 10% by mass, based on all the solid content in the composition. 

[0463] The acid generator (B) can be used by one kind alone, or two or more kinds may be used in combination. 

[0464] The specific examples of the acid generators (B) are shown below. 

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