The earliest joint venture was TI-Acer, followed by Winbond Electronic Corporation (with Toshiba of Japan), Powerchip Semiconductor Corporation (with Mitsubishi of Japan) and ProMOS Technologies Inc. (Mosel Vitelic of Taiwan with Siemens of Germany), for which the contract was signed only in November. All of them follow the same model.
最早的德，其次是華邦（和日商東芝）、力晶（和日商三菱），以及十一月剛簽約的茂德科技（台灣茂矽和德商西門子），都是同一套模式。