Another aspect is that product design costs for IC design companies have already greatly increased from less than US $ 10 million at the 0.13-micron level to more than US $ 45 million at the 65-nanometer level. This increase in cost may force many large vendors to abandon their own independent design work and to cooperate on design with TSMC and other contract wafer manufacturers. This also represents an opportunity.
另一方面，IC 設計公司的設計成本也已大幅增加，從 0.13 微米製程時的不到一千萬美元，到 65 奈米製程的 4 千 5 百萬美元以上，這會迫使許多大廠不再自行獨立設計，而與台積電等晶圓代工廠合作設計，這又是一個機會所在。