After all that comes a series of procedures for testing, cutting, and packaging. In this final stage the dies are wrapped in a black hard shell, out of which stick a number of "feet" for linking up with other circuits. Together these make up the ICs that we can see on the motherboards when we open up our computers.
其後又是一連串測試、切割與封裝的過程，最後一粒粒晶片被包裹在一個個四方黑硬殼裡，殼旁還伸展著許多與其他線路連接的「腳」，成了我們一打開電腦就可以看到的，在主機板上的一顆顆「積體電路」。