What is certain is that the future semiconductor world will rest on the three legs of a tripod: Intel for CPUs, Samsung for memory and TSMC for contract wafer fabrication.
可以確定的是，未來全球半導體界，應該是中央處理器領域的美商英特爾、記憶體的韓商三星電子，及晶圓代工的台積電三足鼎立的局面。