From the upstream processes of cutting and polishing, to developing and etching in the midstream, to dicing and packaging downstream, the products, processes and specifications vary, resulting in pollutants of great variety and complexity.
從上游的晶圓切片、打磨，中游的拉晶、切片、蝕刻等積體電路製程，到下遊的晶圓切割、導線電鍍等晶片封裝製程，由於產品類型和規格多樣，因此製程中產生的汙物相當多且複雜。