The use of hydrofluoric and nitric acids to chemically etch wafers and chips and of massive quantities of ultrapure water to wash them creates a great deal of acidic and alkaline waste water containing fluorine, all of which must be treated.
其中利用氫氟酸、硝酸等溶液進行濕式化學蝕刻，以及使用大量超純水清洗晶圓、晶片，都會產生許多酸鹼廢水及含氟廢水需要處理。