Since then, with the headlong advance of IC manufacturing technology, "die shrinking" and "high density" have become the endlessly pursued goals, and technology has progressed rapidly from five microns, to three, to one, and to today's new global standard of 0.25 microns.
其後，隨積體電路製造技術的突飛猛進，「細微化」、「高密度」成了永無止盡的追求目標，製程的微米數也急遽下降，從五微米、三微米、一微米，到目前全球的新標準﹘ ﹘ 0.25 微米。