The third hurdle is reaction speed, which is related to the structure of the electronics and the packaging technology of the components. With a short reaction time, a product will have much higher added value.
第三是反應的速度，這和感測元件的電路構造及封裝技術都有關，若能縮短測試後的等待時間，產品的附加價值自然大幅提高。