For the future, Morris Chang thinks that while in the past TSMC concentrated on contract manufacturing of logic chips, in the future it will produce a diversified product line that will include embedded DRAM as well as flash memory, niche memory, mixed-signal chips, high-pressure process technology and image sensors, all virgin markets for TSMC.
展望未來，張忠謀認為，台積電過去以代工邏輯晶片為主，未來則生產包括嵌入式 DRAM，及快閃記憶體、利基型記憶體、混合訊號晶片、高壓製程技術、影像感測器等多元產品，進入晶圓廠之前從未踏進的市場。