  Quantifying the temperature of microdevices is critical for probing nanoscale
energy transport.Such quantification is often accomplished by integrating
resistance thermometers into microdevices. However, such thermometers
frequently become structurally unstable and fail due to thermal stresses at
elevated temperatures. Here, we show that custom-fabricated scanning thermal
probes (STPs) with a sharp tip and an integrated heater/thermometer can
accurately measure the temperature of microdevices held at elevated
temperatures. This measurement is accomplished by introducing a modulated heat
input to the STP after contacting the microdevice with the STP's tip, and
characterizing the DC and AC components of the STP's temperature.From these
measured temperature components, the tip-to-sample thermal resistance and the
microdevice surface temperature are deduced via a simple lumped-capacitance
model. The advances presented here can greatly facilitate temperature
measurements of a variety of heated microdevices.

Mesoscale and Nanoscale Physics