  Thin films being a universal functional material have attracted much interest
in academic and industrial applications, such as flexible electronics, soft
robotics, and micro-nano devices. With thin films becoming micro/nanoscale,
developing a simple and nondestructive peeling method for transferring and
reusing remains a big challenge. Here, we present an innovative detaching
approach for thin films: Electro-capillary peeling method. The
electro-capillary peeling method achieves thin films' detachment by driving
liquid to percolate and spread into the bonding layer under electric fields.
Compared with traditional methods, thin film detached by this novel peeling
mode shows a much lower deformation and strain of film (reaching 86%).
Evaluated by various applied voltages and films, the electro-capillary peeling
method shows active control characterizations and is appropriate in a broad
range of films. Theoretically, it is demonstrated that the electro-capillary
peeling method is actualized by utilizing Maxwell stress to compete with the
film's adhesive stress and tension stress. The peeling length versus time,
applied voltage, film's thickness, and elastic modulus are described by $r\sim
t$, $r \sim U$, $r\sim d_{0}^{-1/2}$, and $r\sim E^{-1/2}$, respectively.
Additionally, observations of critical peeling voltage present that the thin
film is readily detached by using the electro-capillary peeling method at the
ultra-low voltage of only 0.7 V. This work clearly shows the great potential of
electro-capillary peeling method to provide a new way for transferring films
and open novel routes for applications of soft materials.

Fluid Dynamics