What is the expected growth rate for the automotive market in the high-end photography market in 2021 and beyond
ding two tier one customers better designing in the platform now. To summarize, the main growth drivers for analog IC business unit for 2020 and beyond, 5G is the most significant driver for RF business for this year and for the next few years. 5G impacts both our mobile business, with RF content is projected to be at 70% CAGR for the coming years according to Yole. And infrastructure, where we are already seeing silicon germanium orders increase for optical connections to serve 5G deployments around the world.
Recovery from the inventory correction on optical 5G data center market, driving shipments in the second half of 2020 will provide good opportunity for additional growth this year. Looking beyond this year, we expect our 5G data center to continue along the rate of data transmission growth to the Internet which most industry analysts assume will continue at approximately 15% CAGR. In addition, automotive is a strong growth driver. In RF today, we have deployed RF radar in several vehicle models and are working now with several customers on LIDAR techniques that make use both of our silicon germanium as well as our new silicon photonics platforms for the future increasing number and capabilities of our time in these vehicles.
And as mentioned, we are leading with our SiPho platform capabilities. In power ICs, our strong traction for the 65 nanometer 300 millimeter BCD platform in the market, provided us with a full funnel of opportunities that will wrap in 2020 and beyond and promise strong growth in power ICs for years to come, providing additional ROI for 300 millimeter capacity growth. We also see automotive as a main growth driver as previously discussed, the strong growth we experienced in 2019 from battery management electrical vehicles and we anticipate further growth as more of the automotive fleet moves to electric drive and as we deploy more advanced high voltage technologies such as the 140 volt non-SOI process.
Moving to our sensors business unit. Despite organic revenue decline of about 20% in the industrial sensor market, predominantly a consequence of the trade war, we were able to compensate to a great extent to have a decrease of 4% year-over-year organic revenues. The said compensation was via the growth of our actually medical sensors market and our high-end visible camera market. This growth should continue in 2020. And with an expected recovery in industrial sensor market, we target a double-digit organic growth in this business in 2020. 2019 was an exciting year for our future, both in state-of-the-art technology developments and in customer engagements. As announced, we have released our 300 millimeter backside illumination hybrid bonding stack wafer technology with copper-to-copper electrical contacts at a pitch smaller than 2.5 micron, the smallest in the world. This technology allows a connection of a BSI sensor to a CMOS logic and analog wafer at the pixel level.
We won two major customers that are using this technology for the mobile time-of-flight market, both for face recognition and front-looking 3D applications. These products will grow international volume production in 2022. The same technology will be used with our existing customers for high-end photography market both in high-end DSLR and mirror less cameras and in cinematography. In addition, we engage with large optical fingerprint sensor providers on the development of under OLED and under LCD sensors, utilizing our high-performing CIS technologies and 200 millimeter fabs at the 0.18 micron technology node. These products are expected to ramp in the second half of this year and to further grow to high volumes in 2021 and beyond.
Looking at our TOPS business unit, the core of our transfer flow activities in the TOPS unit are for the discrete market. This market was soft, especially in the second half of 2019. We are now beginning to see an increase in customer-forecasted demand. We have maintained and grown market share with our existing customers and have added new key customer engagements in 2019. We add value through, for e
ding two tier one customers better designing in the platform now. To summarize, the main growth drivers for analog IC business unit for 2020 and beyond, 5G is the most significant driver for RF business for this year and for the next few years. 5G impacts both our mobile business, with RF content is projected to be at 70% CAGR for the coming years according to Yole. And infrastructure, where we are already seeing silicon germanium orders increase for optical connections to serve 5G deployments around the world.
Recovery from the inventory correction on optical 5G data center market, driving shipments in the second half of 2020 will provide good opportunity for additional growth this year. Looking beyond this year, we expect our 5G data center to continue along the rate of data transmission growth to the Internet which most industry analysts assume will continue at approximately 15% CAGR. In addition, automotive is a strong growth driver. In RF today, we have deployed RF radar in several vehicle models and are working now with several customers on LIDAR techniques that make use both of our silicon germanium as well as our new silicon photonics platforms for the future increasing number and capabilities of our time in these vehicles.
And as mentioned, we are leading with our SiPho platform capabilities. In power ICs, our strong traction for the 65 nanometer 300 millimeter BCD platform in the market, provided us with a full funnel of opportunities that will wrap in 2020 and beyond and promise strong growth in power ICs for years to come, providing additional ROI for 300 millimeter capacity growth. We also see automotive as a main growth driver as previously discussed, the strong growth we experienced in 2019 from battery management electrical vehicles and we anticipate further growth as more of the automotive fleet moves to electric drive and as we deploy more advanced high voltage technologies such as the 140 volt non-SOI process.
 Moving to our sensors business unit. Despite organic revenue decline of about 20% in the industrial sensor market, predominantly a consequence of the trade war, we were able to compensate to a great extent to have a decrease of 4% year-over-year organic revenues. The said compensation was via the growth of our actually medical sensors market and our high-end visible camera market. This growth should continue in 2020. And with an expected recovery in industrial sensor market, we target a double-digit organic growth in this business in 2020. 2019 was an exciting year for our future, both in state-of-the-art technology developments and in customer engagements. As announced, we have released our 300 millimeter backside illumination hybrid bonding stack wafer technology with copper-to-copper electrical contacts at a pitch smaller than 2.5 micron, the smallest in the world. This technology allows a connection of a BSI sensor to a CMOS logic and analog wafer at the pixel level.
We won two major customers that are using this technology for the mobile time-of-flight market, both for face recognition and front-looking 3D applications. These products will grow international volume production in 2022. The same technology will be used with our existing customers for high-end photography market both in high-end DSLR and mirror less cameras and in cinematography. In addition, we engage with large optical fingerprint sensor providers on the development of under OLED and under LCD sensors, utilizing our high-performing CIS technologies and 200 millimeter fabs at the 0.18 micron technology node. These products are expected to ramp in the second half of this year and to further grow to high volumes in 2021 and beyond.
Looking at our TOPS business unit, the core of our transfer flow activities in the TOPS unit are for the discrete market. This market was soft, especially in the second half of 2019. We are now beginning to see an increase in customer-forecasted demand. We have maintained and grown market share with our existing customers and have added new key customer engagements in 2019. We add value through, for e