What is the growth rate in DRAM compared to NAND for investments in memory in 2020? 
shaping a better future for everyone, the advances in technology needed to unlock the potential of artificial intelligence and how materials engineering will enable the industry's new PPACt playbook to advance power, performance, area, cost and time to market.
I also announced Applied's new 10-year goals and road map for environmental sustainability, which is part of our commitment to grow our business responsibly and make possible a better future. Having covered our long-term perspective in detail at that event, today, I'm going to focus my comments on current market dynamics and provide additional insights into our product portfolio and business momentum. Starting with the market environment, we remain mindful of global economic concerns and that consumer spending is a potential headwind for many sectors, including the electronics industry. With that said, demand for semiconductors has strengthened over recent months.
As the world adapts to the challenges created by the pandemic, several major technology inflections are being accelerated. Work from home, home schooling and online retail are driving investments in cloud data centers and communications infrastructure. Many organizations are building stronger business continuity plans and increasing the use of automation and IoT technologies. And because AI has the potential to transform entire industries, its adoption remains nondiscretionary for many companies.
In wafer fab equipment, we expect overall foundry/logic spending to grow this year even with soft demand in specialty nodes that serve automotive and industrial markets. At the leading edge, we see a strong commitment from customers to build out their fabs and aggressively drive their R&D road maps. This gives us confidence these levels of spending are sustainable in 2021 and beyond. As I've described before, with the slowing of traditional 2D Moore's Law scaling, there will be a transition from general purpose computing to customized solutions tailored for specific applications or workloads.
Recent announcements by leading systems companies illustrate this inflection very well. Custom design silicon and diversification of architectures play to the strengths of the foundries and underpin their ongoing investments. In memory, we see investments for the year growing slightly faster than in foundry/logic as customers push forward with their technology road maps. We also see the growth rate in DRAM being very similar to NAND.
Against this backdrop of a strengthening demand, our Semiconductor Systems revenues are up 18% on a trailing 12-month basis, and at the midpoint of our fourth-quarter guidance will be up 25% for our fiscal year. Next, I'll explain what's driving our outperformance today and how, by focusing on our customers' highest value problems, we are positioned to grow faster than our markets over the next several years. The process complexity required to produce leading-edge transistors and interconnects continues to grow and new innovations in materials and structures are fundamental to driving higher performance and lower power consumption. This plays directly to the strengths of Applied's traditional leadership areas, namely creating and modifying materials and structures.
For example, our deposition businesses, CVD, PVD and epi, generated more than $5.2 billion of revenue in calendar 2019 and according to VLSI's data gained eight points of market share. In our growth businesses that focus on shaping and analyzing materials and structures, we have strong momentum. We are the fastest-growing company in etch, even though we don't currently serve the dielectric market segment. At the midpoint of our guidance, our etch revenues will be up nearly 30% this fiscal year.
Since we introduced our Sym3 system in 2015, we have shipped more than 5,000 chambers and we recently introduced Sym3 Y, which is the most advanced etch system we've ever built. This system provides extremely high materials selectivity, as well as precise depth and profile control needed to form the densely packed, high-aspect-ratio structures 
shaping a better future for everyone, the advances in technology needed to unlock the potential of artificial intelligence and how materials engineering will enable the industry's new PPACt playbook to advance power, performance, area, cost and time to market.
I also announced Applied's new 10-year goals and road map for environmental sustainability, which is part of our commitment to grow our business responsibly and make possible a better future. Having covered our long-term perspective in detail at that event, today, I'm going to focus my comments on current market dynamics and provide additional insights into our product portfolio and business momentum. Starting with the market environment, we remain mindful of global economic concerns and that consumer spending is a potential headwind for many sectors, including the electronics industry. With that said, demand for semiconductors has strengthened over recent months.
As the world adapts to the challenges created by the pandemic, several major technology inflections are being accelerated. Work from home, home schooling and online retail are driving investments in cloud data centers and communications infrastructure. Many organizations are building stronger business continuity plans and increasing the use of automation and IoT technologies. And because AI has the potential to transform entire industries, its adoption remains nondiscretionary for many companies.
In wafer fab equipment, we expect overall foundry/logic spending to grow this year even with soft demand in specialty nodes that serve automotive and industrial markets. At the leading edge, we see a strong commitment from customers to build out their fabs and aggressively drive their R&D road maps. This gives us confidence these levels of spending are sustainable in 2021 and beyond. As I've described before, with the slowing of traditional 2D Moore's Law scaling, there will be a transition from general purpose computing to customized solutions tailored for specific applications or workloads.
Recent announcements by leading systems companies illustrate this inflection very well. Custom design silicon and diversification of architectures play to the strengths of the foundries and underpin their ongoing investments. In memory, we see investments for the year growing slightly faster than in foundry/logic as customers push forward with their technology road maps. We also see the growth rate in DRAM being very similar to NAND.
 Against this backdrop of a strengthening demand, our Semiconductor Systems revenues are up 18% on a trailing 12-month basis, and at the midpoint of our fourth-quarter guidance will be up 25% for our fiscal year. Next, I'll explain what's driving our outperformance today and how, by focusing on our customers' highest value problems, we are positioned to grow faster than our markets over the next several years. The process complexity required to produce leading-edge transistors and interconnects continues to grow and new innovations in materials and structures are fundamental to driving higher performance and lower power consumption. This plays directly to the strengths of Applied's traditional leadership areas, namely creating and modifying materials and structures.
For example, our deposition businesses, CVD, PVD and epi, generated more than $5.2 billion of revenue in calendar 2019 and according to VLSI's data gained eight points of market share. In our growth businesses that focus on shaping and analyzing materials and structures, we have strong momentum. We are the fastest-growing company in etch, even though we don't currently serve the dielectric market segment. At the midpoint of our guidance, our etch revenues will be up nearly 30% this fiscal year.
Since we introduced our Sym3 system in 2015, we have shipped more than 5,000 chambers and we recently introduced Sym3 Y, which is the most advanced etch system we've ever built. This system provides extremely high materials selectivity, as well as precise depth and profile control needed to form the densely packed, high-aspect-ratio structures 