What is the total backlog for ASML, including EUV, as of Q2 2021 
comes more connected, not only machine to people, people to machine, but also machine to machine. The expanding application space, with secular drivers such as 5G, AI, high-performance and distributed computing, is fueling a rapidly growing demand for semiconductors. And this demand is not only for leading edge devices required to power these high-performance applications, but it also requires a wide array of applications using other technology to support the build out of the digital infrastructure. Computing is also rapidly moving to the edge, where sensing technologies require connected compute technologies that are often mature in nature.
Lastly, the push for technological sovereignty as countries and regions are planning to establish or expand regional semiconductor manufacturing capabilities in an attempt to manage geographical semiconductor manufacturing risks. This will likely create some level of inefficiency in the semiconductor supply chain and thus additional equipment demand, although we believe that this potential inefficiency will be managed rationally by a few very large manufacturers which are crucial in building this additional infrastructure. We expect these trends to continue for the next several years, which fuels long-term demand for both Logic and Memory and drives demand for our entire product portfolio.
For EUV, future demand growth is primarily driven by Logic, with increasing EUV layer counts and stronger wafer demand on advanced nodes. We're also seeing growing demand for EUV in Memory as customers are ramping EUV in volume production with plans to implement EUV on future nodes across three DRAM customers. With the strong order intake this quarter, this brings our backlog -- our total backlog to EUR17.5 billion, which includes EUV of EUR10.9 billion, which is a reflection of the very healthy market environment we are in today and it covers approximately 80% of the planned EUV output for 2022.
For future Deep UV demand, it's driven by the growing wafer demand in both Memory and Logic. We see both advanced and mature nodes increasing over time. Immersion is required for the more advanced nodes in Memory and Logic, with dry technology required for both advanced and mature technology. We see the Deep UV demand, certainly for dry products, being stronger for longer.
In order to meet our customers' increasing long-term demand, we are working hard with our supply chain to increase our capacity. We continue to drive down manufacturing cycle times, both in our factory and in our supply chain. And jointly with our suppliers, we are looking across the supply chain to determine where we need to add people, equipment or buildings to increase our output capability for EUV as well as Deep UV. Each of these activities have different time horizons to materialize.
For Deep UV, in response to market demand, we will need to increase our capacity in 2022 and beyond, and have therefore started to execute plans to significantly increase our capacity, primarily with dry systems. This is needed since we will not be able next year to again use the surplus inventories of Deep UV modules and parts to fuel our sales, as we will do in 2021. It's a bit too early to provide specific details on our capacity plans for the coming years as we have not yet confirmed the targeted capacity increases with our key suppliers, but we will provide an update as soon as we have finalized these plans.
For EUV, we are planning our supply chain for a capacity of around 55 systems in 2022 and are looking to further increase the capacity to over 60 EUV systems in 2023. In addition to increasing our system capacity, we are also driving our product roadmap to deliver higher productivity systems to increase effective wafer capacity. All of our planned shipments in 2022 will be the higher productivity 3600D systems.
In summary, the chip demand is very strong and we're working to maximize output to meet customer demand. The secular growth trends as part of the digital transformation to a more connected world is fueling future demand across all marke
comes more connected, not only machine to people, people to machine, but also machine to machine. The expanding application space, with secular drivers such as 5G, AI, high-performance and distributed computing, is fueling a rapidly growing demand for semiconductors. And this demand is not only for leading edge devices required to power these high-performance applications, but it also requires a wide array of applications using other technology to support the build out of the digital infrastructure. Computing is also rapidly moving to the edge, where sensing technologies require connected compute technologies that are often mature in nature.
Lastly, the push for technological sovereignty as countries and regions are planning to establish or expand regional semiconductor manufacturing capabilities in an attempt to manage geographical semiconductor manufacturing risks. This will likely create some level of inefficiency in the semiconductor supply chain and thus additional equipment demand, although we believe that this potential inefficiency will be managed rationally by a few very large manufacturers which are crucial in building this additional infrastructure. We expect these trends to continue for the next several years, which fuels long-term demand for both Logic and Memory and drives demand for our entire product portfolio.
For EUV, future demand growth is primarily driven by Logic, with increasing EUV layer counts and stronger wafer demand on advanced nodes. We're also seeing growing demand for EUV in Memory as customers are ramping EUV in volume production with plans to implement EUV on future nodes across three DRAM customers. With the strong order intake this quarter, this brings our backlog -- our total backlog to EUR17.5 billion, which includes EUV of EUR10.9 billion, which is a reflection of the very healthy market environment we are in today and it covers approximately 80% of the planned EUV output for 2022.
For future Deep UV demand, it's driven by the growing wafer demand in both Memory and Logic. We see both advanced and mature nodes increasing over time. Immersion is required for the more advanced nodes in Memory and Logic, with dry technology required for both advanced and mature technology. We see the Deep UV demand, certainly for dry products, being stronger for longer.
 In order to meet our customers' increasing long-term demand, we are working hard with our supply chain to increase our capacity. We continue to drive down manufacturing cycle times, both in our factory and in our supply chain. And jointly with our suppliers, we are looking across the supply chain to determine where we need to add people, equipment or buildings to increase our output capability for EUV as well as Deep UV. Each of these activities have different time horizons to materialize.
For Deep UV, in response to market demand, we will need to increase our capacity in 2022 and beyond, and have therefore started to execute plans to significantly increase our capacity, primarily with dry systems. This is needed since we will not be able next year to again use the surplus inventories of Deep UV modules and parts to fuel our sales, as we will do in 2021. It's a bit too early to provide specific details on our capacity plans for the coming years as we have not yet confirmed the targeted capacity increases with our key suppliers, but we will provide an update as soon as we have finalized these plans.
For EUV, we are planning our supply chain for a capacity of around 55 systems in 2022 and are looking to further increase the capacity to over 60 EUV systems in 2023. In addition to increasing our system capacity, we are also driving our product roadmap to deliver higher productivity systems to increase effective wafer capacity. All of our planned shipments in 2022 will be the higher productivity 3600D systems.
In summary, the chip demand is very strong and we're working to maximize output to meet customer demand. The secular growth trends as part of the digital transformation to a more connected world is fueling future demand across all marke