What is the current installed base of Lam tools in the field 
 play out, the structural factors supporting a long-term WFE growth remain unchanged. These include expanding semiconductor content in end devices, rising device complexity and larger die sizes. These factors create tremendous opportunity for Lam as they require greater etch and deposition intensity to enable higher performance and more scalable device architectures, including the transition to 3D structures. To ensure we are best positioned to win long term, we are focused on three key strategies: first, continue to demonstrate our commitment to customer success by ensuring that the rapidly growing installed base of Lam tools at our customers is operating at maximum efficiency; second, be a trusted R&D partner for our customers by sustaining our investment in the technology development that is most critical to their long-term device scaling road maps; and third, accelerate innovation and deepen our customer and supply chain partnerships by fully leveraging Lam's recently expanded global R&D and manufacturing infrastructure.
Our installed base is now approaching 80,000 chambers in the field. This is over 30% higher than in the 2019 memory-related pullback in WFE. Lam's growing installed base continues to drive strong performance in our CSBG business, which hit another record in the September quarter with approximately $1.9 billion in revenue. While we won't hit new records every quarter, our installed base has become ever more important to our business model, particularly in WFE spending downturns.
During such times, customers can continue to advance their technology while optimizing capital efficiency through upgrades to their existing tools. We are also engaging with customers to find other efficiencies, including yield enhancement. An example of the opportunity this creates can be seen in our Coronus product line. Lam's Coronus double etch process is employed by customers to help prevent process-related defects, which can impair cost per bit scaling.
As a result, we have seen a steady increase in the number of bevel edge passes used at each successive NAND technology node. Another opportunity to help drive efficiency can be found in the enormous volume of equipment and process data being generated from our large and growing installed base. Together with customers, we are using key learnings to deliver services and upgrades that positively impact our customers' operations. For example, we recently deployed Equipment Intelligence Services to support new equipment installation at a large memory manufacturer.
Using these capabilities, we were able to shorten the time to release tools to production by more than 20%. While the near-term demand dynamics warrant an increased focus on operational efficiencies, the strong pull for technology advancement from our customers and the growth opportunity it creates for Lam continues. We made solid progress in the September quarter with key technology wins across multiple customers. For example, our ability to deposit critical films to lower device capacitance and improved lithography overlay performance led to wins for these layers at a leading DRAM customer.
For both applications, we leverage learning from our 3D NAND leadership position, as well as ecosystem partnerships to bring innovative and cost-effective solutions to our DRAM customers. In foundry logic, we secured multiple new ALD application wins at a key customer by delivering purpose modifications and film characteristics required for building and integrating gate-all-around structures. Whether it's our focus on operational efficiency or our collaboration on advanced technology, we believe our long-term success will be rooted in an R&D and manufacturing infrastructure close to our customers, close to our ecosystem partners and with access to world-class talent. Consequently, over the past two years, we have made strategic investments to expand our global footprint, including the addition of a manufacturing facility in Malaysia, an R&D lab in Korea and just last month, the opening of Lam's India Center for Engineering in Be
 play out, the structural factors supporting a long-term WFE growth remain unchanged. These include expanding semiconductor content in end devices, rising device complexity and larger die sizes. These factors create tremendous opportunity for Lam as they require greater etch and deposition intensity to enable higher performance and more scalable device architectures, including the transition to 3D structures. To ensure we are best positioned to win long term, we are focused on three key strategies: first, continue to demonstrate our commitment to customer success by ensuring that the rapidly growing installed base of Lam tools at our customers is operating at maximum efficiency; second, be a trusted R&D partner for our customers by sustaining our investment in the technology development that is most critical to their long-term device scaling road maps; and third, accelerate innovation and deepen our customer and supply chain partnerships by fully leveraging Lam's recently expanded global R&D and manufacturing infrastructure.
Our installed base is now approaching 80,000 chambers in the field. This is over 30% higher than in the 2019 memory-related pullback in WFE. Lam's growing installed base continues to drive strong performance in our CSBG business, which hit another record in the September quarter with approximately $1.9 billion in revenue. While we won't hit new records every quarter, our installed base has become ever more important to our business model, particularly in WFE spending downturns.
During such times, customers can continue to advance their technology while optimizing capital efficiency through upgrades to their existing tools. We are also engaging with customers to find other efficiencies, including yield enhancement. An example of the opportunity this creates can be seen in our Coronus product line. Lam's Coronus double etch process is employed by customers to help prevent process-related defects, which can impair cost per bit scaling.
As a result, we have seen a steady increase in the number of bevel edge passes used at each successive NAND technology node. Another opportunity to help drive efficiency can be found in the enormous volume of equipment and process data being generated from our large and growing installed base. Together with customers, we are using key learnings to deliver services and upgrades that positively impact our customers' operations. For example, we recently deployed Equipment Intelligence Services to support new equipment installation at a large memory manufacturer.
 Using these capabilities, we were able to shorten the time to release tools to production by more than 20%. While the near-term demand dynamics warrant an increased focus on operational efficiencies, the strong pull for technology advancement from our customers and the growth opportunity it creates for Lam continues. We made solid progress in the September quarter with key technology wins across multiple customers. For example, our ability to deposit critical films to lower device capacitance and improved lithography overlay performance led to wins for these layers at a leading DRAM customer.
For both applications, we leverage learning from our 3D NAND leadership position, as well as ecosystem partnerships to bring innovative and cost-effective solutions to our DRAM customers. In foundry logic, we secured multiple new ALD application wins at a key customer by delivering purpose modifications and film characteristics required for building and integrating gate-all-around structures. Whether it's our focus on operational efficiency or our collaboration on advanced technology, we believe our long-term success will be rooted in an R&D and manufacturing infrastructure close to our customers, close to our ecosystem partners and with access to world-class talent. Consequently, over the past two years, we have made strategic investments to expand our global footprint, including the addition of a manufacturing facility in Malaysia, an R&D lab in Korea and just last month, the opening of Lam's India Center for Engineering in Be