What is the impact of the supply chain fire on the company's revenue in the fourth quarter 
based on the automotive, clearly you see more semiconductor in the latest via 5G phones. You've seen the AIP. You have seen the fan-out module. You have seen the PA. You're also seeing more semiconductor content. But in terms of the packaging,versus your overall increase in semiconductor content, my perspective is you will see that percentage going up. I don't believe the packaging costs should be going up as fast as foundry. Because the foundry, the investment versus return, the business model are completely different. But I do believe, because of the complexity and the nature of the heterogenous integration, you will see the packaging content, when you normalize things, I do believe that trend is going up.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Yeah. But what's difficult for us to see that from the revenue growth side because -- for example, like smartphone chip, it's so clear for the wafer side, but it's not clear at all for the packaging side. So it's difficult for us. Can you give us certain quantitative analysis for that?
Tien Yu Wu -- Group Chief Operating Officer
I don't think I have that number. My apologies.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
No worries. So the next question -- I'm sorry?
Tien Yu Wu -- Group Chief Operating Officer
Yeah, go ahead.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Okay. So the next question is that one of your supply chain got serious fire a couple of days ago. What kind of impact to your business? Because one of the key customers is your key customers as well. So what kind of business impact you included in your forecast for the fourth quarter?
Tien Yu Wu -- Group Chief Operating Officer
Well, thank you for asking that question. We will not comment on that particular incident because we're still going through the clarification. So we're waiting for further report. But having said that, we do have multiple important customers who are affected by this particular fire. But just like all of the supply chain scenario, when you have a position, chances are, it is easier for us to go through the supply chain and get replacement as well as get priority. During the last two days, we have collaborated with all of our customers. So I can tell you with confidence in Q4, our revenue has already been factored and impact is less than 1%. So that has already been factored in. Today, we're working on the alternative supply for all of the key customers in the -- of our global substrate suppliers. We believe the situation is complicated, but like everything in the past, this is not the first time we encountered supply chain disruption. We had much worse scenario and we handled that pretty well. In this round, I hope our particular partner in Taiwan can recover soon. But as of today, the situation is manageable.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Okay. Can ask one more question, which is for the ASP. Management was talking about ASP will be friendly in 2021. Does that friendly situation only happens in wirebond or it happens in chip testing or overall? And what about the SiP pricing environment?
Tien Yu Wu -- Group Chief Operating Officer
All right. I guess the best way to answer is the -- it's more friendly in wirebond. Other products are also friendly compared to last year. All right. My apology. That's pretty much all I can tell you.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
How about SiP?
Tien Yu Wu -- Group Chief Operating Officer
SiP, same. Because chances are, when you have like an allocation in a particular package type, it basically cascaded down to all other products.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Okay, thank you. I'll go back to the queue.
Operator
Now the line is open to Szeho Ng, China Resonance. Go ahead please.
Szeho Ng -- China Renaissance Securities (US) Inc. -- Analyst
Hi, good afternoon, gentlemen. My first question is regarding the capex. You mentioned that next year's capex will be going back to the 2018 level. That would represent quite a sharp drop compared with this year's level. So I just wondered, which areas 
based on the automotive, clearly you see more semiconductor in the latest via 5G phones. You've seen the AIP. You have seen the fan-out module. You have seen the PA. You're also seeing more semiconductor content. But in terms of the packaging,versus your overall increase in semiconductor content, my perspective is you will see that percentage going up. I don't believe the packaging costs should be going up as fast as foundry. Because the foundry, the investment versus return, the business model are completely different. But I do believe, because of the complexity and the nature of the heterogenous integration, you will see the packaging content, when you normalize things, I do believe that trend is going up.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Yeah. But what's difficult for us to see that from the revenue growth side because -- for example, like smartphone chip, it's so clear for the wafer side, but it's not clear at all for the packaging side. So it's difficult for us. Can you give us certain quantitative analysis for that?
Tien Yu Wu -- Group Chief Operating Officer
I don't think I have that number. My apologies.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
No worries. So the next question -- I'm sorry?
Tien Yu Wu -- Group Chief Operating Officer
Yeah, go ahead.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Okay. So the next question is that one of your supply chain got serious fire a couple of days ago. What kind of impact to your business? Because one of the key customers is your key customers as well. So what kind of business impact you included in your forecast for the fourth quarter?
Tien Yu Wu -- Group Chief Operating Officer
 Well, thank you for asking that question. We will not comment on that particular incident because we're still going through the clarification. So we're waiting for further report. But having said that, we do have multiple important customers who are affected by this particular fire. But just like all of the supply chain scenario, when you have a position, chances are, it is easier for us to go through the supply chain and get replacement as well as get priority. During the last two days, we have collaborated with all of our customers. So I can tell you with confidence in Q4, our revenue has already been factored and impact is less than 1%. So that has already been factored in. Today, we're working on the alternative supply for all of the key customers in the -- of our global substrate suppliers. We believe the situation is complicated, but like everything in the past, this is not the first time we encountered supply chain disruption. We had much worse scenario and we handled that pretty well. In this round, I hope our particular partner in Taiwan can recover soon. But as of today, the situation is manageable.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Okay. Can ask one more question, which is for the ASP. Management was talking about ASP will be friendly in 2021. Does that friendly situation only happens in wirebond or it happens in chip testing or overall? And what about the SiP pricing environment?
Tien Yu Wu -- Group Chief Operating Officer
All right. I guess the best way to answer is the -- it's more friendly in wirebond. Other products are also friendly compared to last year. All right. My apology. That's pretty much all I can tell you.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
How about SiP?
Tien Yu Wu -- Group Chief Operating Officer
SiP, same. Because chances are, when you have like an allocation in a particular package type, it basically cascaded down to all other products.
Zheng Lu -- Goldman Sachs Group, Inc. -- Analyst
Okay, thank you. I'll go back to the queue.
Operator
Now the line is open to Szeho Ng, China Resonance. Go ahead please.
Szeho Ng -- China Renaissance Securities (US) Inc. -- Analyst
 Hi, good afternoon, gentlemen. My first question is regarding the capex. You mentioned that next year's capex will be going back to the 2018 level. That would represent quite a sharp drop compared with this year's level. So I just wondered, which areas 