3461
Additionally , complex heat sink structures were printed with large surface areas ( 600 mm2/g ) , and their cooling performances were compared to a commercial heat sink with a smaller surface area ( 286 mm2/g ) on an electronic chip .
 machine or equipment: heat sink; process parameter: surface areas; manufacturing process: cooling; machine or equipment: heat sink; process parameter: surface area; material: chip
Given options, please tell me the categories of all the listed entity words.Output format is "type1: word1; type2: word2". 
Option: manufacturing standard, machanical property, manufacturing process, material, engineering feature, process parameter, machine or equipment, application, process characterization, enabling technology, biomedical, concept or principle 
Text: {0} 
 Entities: heat sink, surface areas, cooling, heat sink, surface area, chip 
Answer:
 machine or equipment: heat sink; process parameter: surface areas; manufacturing process: cooling; machine or equipment: heat sink; process parameter: surface area; material: chip