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The mechanism for rapid bonding lies in using an alloy that can form a strong intermetallic bond to the substrate at a low temperature , and exposing the sample multiple times to give sufficient diffusion time for a strong bond .
 concept or principle: mechanism; concept or principle: bonding; material: alloy; material: intermetallic; material: substrate; process parameter: temperature; concept or principle: sample; concept or principle: diffusion
Given options, please tell me the categories of all the listed entity words.Output format is "type1: word1; type2: word2". 
Option: manufacturing standard, machanical property, manufacturing process, material, engineering feature, process parameter, machine or equipment, application, process characterization, enabling technology, biomedical, concept or principle 
Text: {0} 
 Entities: mechanism, bonding, alloy, intermetallic, substrate, temperature, sample, diffusion 
Answer:
 concept or principle: mechanism; concept or principle: bonding; material: alloy; material: intermetallic; material: substrate; process parameter: temperature; concept or principle: sample; concept or principle: diffusion