AMD 3D Stacks SRAM Bumplessly
Really impressive and a plesently surprising feature from AMD. I imagine the real target market for this is Eypc server CPUs. Eventually they might be able to cut the L3 cache out of the CCD die completely and rely only on external SRAM die as L3. This would give AMD a very flexible portfolio where they can offer different SKUs with different amounts of L3 cache at different price points, all using the exact same CCD die. What will be interesting is to see how much the die stacking impacts thermals.