All ICs generate heat when power is applied to them. Thermal management should be considered during package selection to ensure high product reliability. Therefore, to maintain the device’s junction temperature below the maximum allowed, effective heat flow from the IC through the package to the ambient is essential. STATS ChipPAC offers the simulation of thermal resistance of an IC package. Thermal resistance measures the package’s ability to transfer heat generated by the die to the circuit board or the ambient. By calculating the temperatures at two points, the amount of heat flow from one point to the other is determined by the thermal resistance. By knowing the thermal resistance of a package, the IC’s junction temperature can be calculated for a given power dissipation and its reference temperature. STATS ChipPAC offers thermal simulation using JEDEC test conditions, including Theta JA, Theta JC, Theta JB, Psi JT, and Psi JB.