text: Over deze norm
  Specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including 100 mm. Thicknesses from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknessess from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices. The sampling procedures, the methods of test for verification of conformity to the requirements of this standard, and the delivery conditions are also specified.
  ||Koper en koperlegeringen - Band voor systeemdragers
  ||Copper and copper alloys - Strip for lead frame
explanation: The document describes a standard for copper and copper alloy strip used in lead frames for integrated circuits and low power devices. It specifies the composition, property requirements, and tolerances on dimensions and form, as well as the sampling procedures, methods of test, and delivery conditions. The document does not contain any math questions or answers.
distilabel_metadata.content: Evaluate the user given text extract and determine if it contains a math question and optionally and answer to this question.
  
  Output rules:
  
  1. Briefly describe the document and mention if it contains a question or a question and answer.
  2. Finalize the output with: Label: no-question,question,question-and-answer,multiple-question,multiple-question-and-answer
distilabel_metadata.role: system
distilabel_metadata.content: Over deze norm
  Specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including 100 mm. Thicknesses from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknessess from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices. The sampling procedures, the methods of test for verification of conformity to the requirements of this standard, and the delivery conditions are also specified.
  ||Koper en koperlegeringen - Band voor systeemdragers
  ||Copper and copper alloys - Strip for lead frame
distilabel_metadata.role: user
distilabel_metadata.raw_output_q_a_detector_0: The document describes a standard for copper and copper alloy strip used in lead frames for integrated circuits and low power devices. It specifies the composition, property requirements, and tolerances on dimensions and form, as well as the sampling procedures, methods of test, and delivery conditions. The document does not contain any math questions or answers.
  
  Label: no-question