What are high throw solutions? I am trying to make a copper sulfate electroplating solution. I came across a document (Schlesinger and Paunovic 2011) which mentions the amount of copper sulfate that should be added to water to create such a solution. In Table 2.1 on the bottom of page 35, it has two columns: one for conventional solutions and one for high throw solutions. 

I read another paper (Nikolova and Watkowski) which talks about high throw copper electroplating process. All I could glean from the paper was that high throw solutions enable higher aspect ratios for copper PCBs.

Please reply if anyone knows what high throw solutions are.

References:

Nikolova, Maria, and Jim Watkowski. “INNOVATIVE HIGH THROW COPPER ELECTROPLATING PROCESS FOR METALLIZATION OF PCB.”

Schlesinger, M., and M. Paunovic. 2011. Modern Electroplating. The ECS Series of Texts and Monographs. Wiley. http://books.google.com/books?id=j3OSKTCuO00C.
This page suggests that throwing power is the ability to coat a surface evenly regardless of current density differences, and thus to produce an even plating thickness across the whole of a surface.

A solution with high throwing power would thus have the ability to produce a good, close-to-uniform coating on more difficult surface shapes.